Abstract: A method of processing a plate-shaped work-piece with a laser beam so as to be divided along a plurality of projected dicing lines on the workpiece includes: forming a plurality of first shield tunnels, each including fine pores and an amorphous substance surrounding the fine pores, in the workpiece along the projected dicing lines by applying a pulsed laser beam having a wavelength transmittable through the workpiece to the workpiece along the projected dicing lines while positioning a converged zone of the pulsed laser beam within the workpiece; changing the converged zone of the pulsed laser beam to be applied to the workpiece to a position along thicknesswise directions of the workpiece; and, forming a plurality of second shield tunnels in the workpiece adjacent and parallel to the first shield tunnels along the direction in which the pulsed laser bream is applied.

Abstract: A method of processing an optical device wafer which includes a laser processing step of repeating an application of one pulse of a pulsed laser beam to the optical device wafer to form one laser processed hole, thereby forming a plurality of laser processed holes along streets; an etching step of causing an etchant to enter into the laser processed holes to etch the inside of the laser processed holes; and a dividing step of exerting an external force on the optical device wafer to divide the optical device wafer along the streets, thereby forming a plurality of optical devices.

Abstract: An optical device including a substrate and a light emitting layer formed on the front surface of the substrate. The back surface of the substrate is formed with a concave portion like a crater. The concave portion is formed by applying a laser beam having an absorption wavelength to an optical device wafer. In the optical device, light emitted from the light emitting layer strikes the inner surface of the concave portion and is next irregularly reflected from the inner surface of the concave portion.

Abstract: A method of processing an optical device wafer which includes a laser processing step of repeating an application of one pulse of a pulsed laser beam to the optical device wafer to form one laser processed hole, thereby forming a plurality of laser processed holes along streets; an etching step of causing an etchant to enter into the laser processed holes to etch the inside of the laser processed holes; and a dividing step of exerting an external force on the optical device wafer to divide the optical device wafer along the streets, thereby forming a plurality of optical devices.

Abstract: The present invention provides a light emitting chip including a device chip having a sapphire base and a light emitting layer formed over the front surface of the sapphire base and a transparent member stuck to the back surface of the sapphire base by a transparent resin transmissive to emitted light from the light emitting layer. The transparent member is transmissive to emitted light from the light emitting layer. The transparent member is formed of a material having a lower refractive index than the sapphire base.

Abstract: An embodiment of the present invention provides a light emitting diode including a chip having a light emitting layer on the front surface side and a translucent member that is bonded between a back surface of the chip and a lead frame to support the chip by a resin having translucency, and is transmissive to light emitted from the light emitting layer. According to this configuration, the light emitting diode includes the translucent member that is transmissive to light emitted from the light emitting layer on the back surface side of the chip having the light emitting layer. Therefore, the ratio of light reflected at the interface with the lead frame to return to the light emitting layer can be suppressed to a low ratio and the light extraction efficiency can be enhanced.

Abstract: An optical device including: a rectangular front side having a light-emitting layer; a rectangular rear side parallel to the front side; and first to fourth lateral sides adapted to connect the front and rear sides, in which the first lateral side is inclined by a first angle with respect to a perpendicular of the front side, and the second lateral side opposed to the first lateral side is inclined by a second angle with respect to the perpendicular, and the third lateral side is inclined by a third angle with respect to the perpendicular, and the fourth lateral side opposed to the third lateral side is inclined by a fourth angle with respect to the perpendicular.