Abstract: The present invention provides functional particles capable of effectively adsorbing impurities in water treatment. The particles can be rapidly separated by use of magnetic force, and hence are excellent in workability. They are magnetic particles having surfaces modified with amphipathic groups loaded thereon. The amphipathic group comprises an ammonium or carboxylate group as a hydrophilic moiety and a hydrocarbon group as a hydrophobic moiety. The hydrophobic moiety has a function of adsorbing the impurities, and the hydrophilic moiety has a function of dispersing the particles stably in water.

Abstract: An oil-adsorbing particle composite and a water-treatment method using the same are provided. The particle composite is capable of selectively adsorbing contaminants such as oils contained in industrial and household wastewaters. The water-treatment method is capable of eliminating contaminants from the wastewater using the composite. The particle composite includes water-insoluble organic polymer particles, magnetic particles and a resin binder, the resin binder bonding the polymer particles and the magnetic particles. The polymer particles have an oil-adsorbing characteristic. The magnetic particles have a magnetic characteristic for a rapid collection of the composite using magnetic forces. The method includes dispersing the particle composite in contaminant-containing water, making the particle composite adsorb contaminants to separate the particle composite from the water after the adsorbing.

Abstract: A polymer composite is provided for a water treatment. The polymer composite with excellent workability is capable of adsorbing impurities in water, being rapidly separated from the water using magnetic forces. The polymer composite includes secondary aggregates. The secondary aggregates are formed of clumped particles, the particles being magnetic particles covered with a polymer. The polymer composite has porous structures suitable for adsorbing underwater impurities.

Abstract: The present invention provides a resin composition for sealing a semiconductor device. The resin composition is in liquid state at room temperature, and can be supplied from a dispenser. The composition is advantageous in regard to molding time, viscosity, moldability and adhesion. This resin composition indispensably comprises a bisphenol type epoxy resin having a polymerization degree of 3 or less, a particular phenol resin or a particular acid anhydride, a catalyst (A) such as 1-cyanoethyl-2-undecylimidazolium trimellitate, a catalyst (B) such as 1-cyanoethyl-2-ethyl-4-methylimidazol, and spherical fused silica particles. The weight ratio (A/B) between the catalysts (A) and (B) is in the range of 9/1 to 4/6.

Abstract: A method of treating waste product containing flexible polyurethane resin includes adding a decomposing agent to the waste product to start a decomposition reaction; and terminating the decomposition reaction at a stage in which a diamine concentration derived from an isocyanate raw material of the flexible polyurethane resin is 2 wt % or lower to obtain a pasty intermediate product.

Abstract: A method of treating waste product containing flexible polyurethane resin includes adding a decomposing agent to the waste product to start a decomposition reaction; and terminating the decomposition reaction at a stage in which a diamine concentration derived from an isocyanate raw material of the flexible polyurethane resin is 2 wt % or lower to obtain a pasty intermediate product.

Abstract: The invention relates to a resin composition that has, as a raw material, a product that is obtained by addition reacting a compound having a unsaturated carbon bond to a resin decomposed product obtained by chemically decomposing a urethane resin, alternatively, by decomposing a urethane resin with a compound having a unsaturated carbon bond. The resin composition can be solidified by polymerization by use of a cross-linking agent and an addition polymerization initiator. Furthermore, when a compound having two or more carboxyl groups or an anhydride thereof is blended together with the urethane resin decomposition, a resin composition can be obtained. When the resin composition obtained thereby is cured, a recycled resin with excellent properties can be obtained.

Abstract: A novel method for decomposing urethane resin suppresses the generation of aromatic amines and facilitates the recycling of urethane resins. To decompose urethane resin, the method involves the use of a decomposing agent that has both an ability to cleave urethane bonds in a urethane resin and an ability to react with and thus capture an amine compound. The decomposing agent is preferably one that contains either at least one selected from carboxyl group, and a salt, ester and acid anhydride thereof, or at least one selected from isocyanate group and epoxy group.

Abstract: Disclosed is a method of adding a compound having at least one group selected from the group consisting of a carboxyl group, salts thereof, esters thereof and haloformyl groups or an acid anhydride, as a treating agent, to a resin decomposed substance prepared by decomposing a urethane bond of a urethane resin, and adding an epoxy resin or isocyanate compound to the product, to regenerate the resin. According to the present invention, reaction activity in producing a regenerated resin from a urethane resin decomposed substance is appropriately suppressed, and thus regeneration of a urethane resin can be carried out by easy procedures.