Abstract: The present invention provides a thermal print head capable of better performing printing on a printing medium; the thermal print head including: a substrate (1), formed with single crystal semiconductor; a resistor layer (4), including a plurality of heating portions (41) arranged in a main scan direction; and a wiring layer (3), configuring a charging path to the plurality of heating portions. The substrate includes: a main surface (11), being a surface opposite to the resistor layer; and a convex portion (13), disposed as protruding from the main surface and extending in the main scan direction. The convex portion includes: an inclining surface (132), inclining relative to the main surface and extending in a linear manner when viewing from the main scan direction; and a curving surface (131), disposed, in a protruding direction of the convex portion, on a position farther away from the main surface than the inclining surface, and curving in a manner that protrudes toward the protruding direction.

Abstract: A semiconductor device includes: a substrate including a main surface; a wiring portion including a first conductive layer formed on the main surface, and a first plating layer which is provided on the first conductive layer and on which an oxide film is formed; a semiconductor element including an element mounting surface and an element electrode formed on the element mounting surface; a bonding portion including a second plating layer made of the same material as the first plating layer and laminated on the first conductive layer, and a solder layer laminated on the second plating layer and bonded to the element electrode; and a sealing resin covering the semiconductor element.

Abstract: The present invention provides a thermal print head capable of better performing printing on a printing medium. The thermal print head includes: a substrate (1), formed with single crystal semiconductor; a resistor layer (4), including a plurality of heating portions (41) arranged in a main scan direction; and a wiring layer (3), configuring a charging path to the plurality of heating portions. The substrate includes: a main surface (11), being a surface opposite to the resistor layer; and a convex portion (13), disposed as protruding from the main surface and extending in the main scan direction. The convex portion includes: an inclining surface (132), inclining relative to the main surface and extending in a linear manner when viewing from the main scan direction; and a curving surface (131), disposed, in a protruding direction of the convex portion, on a position farther away from the main surface than the inclining surface, and curving in a manner that protrudes toward the protruding direction.

Abstract: Semiconductor device includes: substrate having substrate main surface and substrate rear surface facing opposite sides to each other in first direction, and substrate side surface facing in second direction orthogonal to the first direction; wiring layer having main surface electrode covering a portion of the substrate main surface, and side surface electrode connected to the main surface electrode and covering a portion of the substrate side surface; semiconductor element electrically connected to the main surface electrode and mounted on the substrate to face the substrate main surface; and sealing resin having resin side surface facing in the same direction as the substrate side surface, and covering the semiconductor element and the main surface electrode, wherein the side surface electrode has side exposed surface exposed from the sealing resin and facing in the same direction as the substrate side surface, the side exposed surface being flush with the resin side surface.

Abstract: A semiconductor device includes: a substrate including a main surface; a wiring portion including a first conductive layer formed on the main surface, and a first plating layer which is provided on the first conductive layer and on which an oxide film is formed; a semiconductor element including an element mounting surface and an element electrode formed on the element mounting surface; a bonding portion including a second plating layer made of the same material as the first plating layer and laminated on the first conductive layer, and a solder layer laminated on the second plating layer and bonded to the element electrode; and a sealing resin covering the semiconductor element.

Abstract: Semiconductor device includes: substrate having substrate main surface and substrate rear surface facing opposite sides to each other in first direction, and substrate side surface facing in second direction orthogonal to the first direction; wiring layer having main surface electrode covering a portion of the substrate main surface, and side surface electrode connected to the main surface electrode and covering a portion of the substrate side surface; semiconductor element electrically connected to the main surface electrode and mounted on the substrate to face the substrate main surface; and sealing resin having resin side surface facing in the same direction as the substrate side surface, and covering the semiconductor element and the main surface electrode, wherein the side surface electrode has side exposed surface exposed from the sealing resin and facing in the same direction as the substrate side surface, the side exposed surface being flush with the resin side surface.

Abstract: A method for generating a three-dimensional luminescence image includes setting a focal interval between two-dimensional images in accordance with localization of luminescence in a three-dimensional sample. The three-dimensional sample contains a plurality of cells prepared to be luminescent and has a three-dimensional shape. The two-dimensional images have mutually different focal planes and are acquired at the focal interval. The method further includes acquiring a two-dimensional image set including two-dimensional images at the focal interval that is set by imaging the three-dimensional sample under an unirradiated condition; and generating a three-dimensional luminescence image by combining the two-dimensional images included in the two-dimensional image set together.

Abstract: A method for monitoring differentiation into cardiac muscle cells includes keeping, in an alive state, cells into which a reporter gene of luminescent protein configured to vary in luminescence intensity according to an expression of myocardial differentiation marker gene is introduced. The method includes acquiring a luminescence image as a still image by imaging light emitted from the cells in a light shielding state. The method includes acquiring sequential images with illuminating the cells. The method includes associating biological information obtained from the sequential images with biological information obtained from the still image.

Abstract: A method for generating a three-dimensional luminescence image includes setting a focal interval between two-dimensional images in accordance with localization of luminescence in a three-dimensional sample. The three-dimensional sample contains a plurality of cells prepared to be luminescent and has a three-dimensional shape. The two-dimensional images have mutually different focal planes and are acquired at the focal interval. The method further includes acquiring a two-dimensional image set including two-dimensional images at the focal interval that is set by imaging the three-dimensional sample under an unirradiated condition; and generating a three-dimensional luminescence image by combining the two-dimensional images included in the two-dimensional image set together.

Abstract: A method for monitoring differentiation into cardiac muscle cells includes keeping, in an alive state, cells into which a reporter gene of luminescent protein configured to vary in luminescence intensity according to an expression of myocardial differentiation marker gene is introduced. The method includes acquiring a luminescence image as a still image by imaging light emitted from the cells in a light shielding state. The method includes acquiring sequential images with illuminating the cells. The method includes associating biological information obtained from the sequential images with biological information obtained from the still image.

Abstract: A bodyshell of a railcar includes side outside plates, end bodyshells, and guiding plates. The side outside plate are located at both end portions of a carbody in a vehicle width direction. The end bodyshell includes an end outside plate and a corner post. The end outside plates are located at both end portions of the carbody in the longitudinal direction. The corner posts are located at four corners of the carbody. The corner post is joined to the adjacent end outside plate and the adjacent side outside plate. The guiding plate is provided at the side outside plate so as to cover the corner post from a vehicle exterior. The guiding plate includes an inclined portion and a joining portion. The inclined portion is provided in front of the corner post and inclined to the rear side toward the side outside plate.

Abstract: A bodyshell of a railcar includes side outside plates and end bodyshells. The side outside plates are respectively provided at both end portions of an underframe in a vehicle width direction. The end bodyshell includes end outside plates and corner posts. The end outside plates are respectively provided at front and rear end portions of the underframe. The corner posts are respectively provided at four corners of the underframe and are joined to the end outside plates and the side outside plates. Moreover, the corner post includes a side plate joining portion. The side plate joining portion overlaps a front end portion of the side outside plates from an outer side in the vehicle width direction and is joined to the side outside plate.

Abstract: A railcar that includes an underframe, a front surface frame located at a front surface portion of a carbody and having a lower end portion coupled to the underframe, and a buffer member coupled to the front surface frame and extending toward a vehicle interior side. Then, the buffer member is provided at a position higher than the underframe.

Abstract: A bodyshell of a railcar includes side outside plates, end bodyshells, and guiding plates. The side outside plate are located at both end portions of a carbody in a vehicle width direction. The end bodyshell includes an end outside plate and a corner post. The end outside plates are located at both end portions of the carbody in the longitudinal direction. The corner posts are located at four corners of the carbody. The corner post is joined to the adjacent end outside plate and the adjacent side outside plate. The guiding plate is provided at the side outside plate so as to cover the corner post from a vehicle exterior. The guiding plate includes an inclined portion and a joining portion. The inclined portion is provided in front of the corner post and inclined to the rear side toward the side outside plate.

Abstract: A bodyshell of a railcar includes side outside plates and end bodyshells. The side outside plates are respectively provided at both end portions of an underframe in a vehicle width direction. The end bodyshell includes end outside plates and corner posts. The end outside plates are respectively provided at front and rear end portions of the underframe. The corner posts are respectively provided at four corners of the underframe and are joined to the end outside plates and the side outside plates. Moreover, the corner post includes a side plate joining portion. The side plate joining portion overlaps a front end portion of the side outside plates from an outer side in the vehicle width direction and is joined to the side outside plate.

Abstract: A railcar that includes an underframe, a front surface frame located at a front surface portion of a carbody and having a lower end portion coupled to the underframe, and a buffer member coupled to the front surface frame and extending toward a vehicle interior side. Then, the buffer member is provided at a position higher than the underframe.

Abstract: An apparatus for fire protection forming an air-curtain between a supply opening and a exhaust opening, wherein the relationship between the supply opening and the exhaust opening are as follows:1 m.ltoreq.L.ltoreq.5 m0.5 L.ltoreq.L.sub.S .ltoreq.1.5 L1 m/sec.ltoreq.U.sub.L .ltoreq.10 m/sec5 m/sec.ltoreq.U.sub.D .ltoreq.30 m/secU.sub.L .ltoreq.U.sub.0 .ltoreq.U.sub.Dwherein L represents the width of said supply opening in the direction parallel to said escape passage, L.sub.S represents the width of said exhaust opening in the direction parallel to said escape passage, U.sub.L represents the supply air flow velocity, U.sub.D represents the exhaust air flow velocity and U.sub.O represents the additional air flow velocity.