Abstract: An information processing apparatus controls a vehicle having a service power supply used to provide a service and a driving power supply used for traveling. The information processing apparatus has a storage unit configured to store service-related information concerning the service provided by the vehicle, and a controller configured to select any of a first mode, in which the service power supply and the driving power supply are independently used, and a second mode, in which the service power supply and the driving power supply are shared, based on the service-related information.

Abstract: A fixation structure for fixing a superconducting cable including a cable core and a thermal insulation tube. The fixation structure includes a fixation box connected to the thermal insulation tube, including a hollow thermal insulation structure, and through which the cable core is passed, a fixation body for fixing the cable core on the inner wall of the fixation box, and a diameter-expanded reinforcement layer that is an electrical insulation layer that has a diameter decreasing toward both ends and is formed on the cable core. A refrigerant flows through the inside of the inner wall of the fixation box. The cable core is fixed on the inner wall with the fixation body through the diameter-expanded reinforcement layer. The structure implements a simple and low-cost fixation structure appropriate for an electric field design.

Abstract: A cooling container accommodates an object to be cooled and a liquid coolant in the inside. A lid member can close an upper opening of the coolant container. A cooling device is supported by the lid member and includes a cooling section at a lower end. Electric current leads supported by the lid member make electric current flow into the object to be cooled inside the coolant container. The electric current leads each include a thermal resistance section with higher thermal resistance than surrounding portions, positioned above the liquid surface of the liquid coolant in the coolant container. Between the thermal resistance sections and the cooling section, a partition section made from a heat insulation material with a lower end below the thermal resistance sections is provided. An effect of penetrating heat can be prevented, allowing the inside of the coolant container to be efficiently cooled.

Abstract: A thermal insulation tube has a double-structure including a thermal insulation internal tube and a thermal insulation external tube, an intermediate connecting part has a double-structure including an outer container and an inner container, the internal tube and the external tube penetrate through a wall surface of the outer container and are introduced at least up to a wall surface of the inner container, a region between the internal tube and the external tube is sealed by joining an end to be introduced of the internal tube and an end to be introduced of the external tube, at an introduction portion of the external tube to be positioned on an inner side of a wall surface of the outer container, and a corrugated tubular part has a tube wall thinner than the external tube outside of the wall surface.

Abstract: A fixation structure for fixing a superconducting cable including a cable core and a thermal insulation tube. The fixation structure includes a fixation box connected to the thermal insulation tube, including a hollow thermal insulation structure, and through which the cable core is passed, a fixation body for fixing the cable core on the inner wall of the fixation box, and a diameter-expanded reinforcement layer that is an electrical insulation layer that has a diameter decreasing toward both ends and is formed on the cable core. A refrigerant flows through the inside of the inner wall of the fixation box. The cable core is fixed on the inner wall with the fixation body through the diameter-expanded reinforcement layer. The structure implements a simple and low-cost fixation structure appropriate for an electric field design.

Abstract: A thermal insulation tube has a double-structure including a thermal insulation internal tube and a thermal insulation external tube, an intermediate connecting part has a double-structure including an outer container and an inner container, the internal tube and the external tube penetrate through a wall surface of the outer container and are introduced at least up to a wall surface of the inner container, a region between the internal tube and the external tube is sealed by joining an end to be introduced of the internal tube and an end to be introduced of the external tube, at an introduction portion of the external tube to be positioned on an inner side of a wall surface of the outer container, and a corrugated tubular part has a tube wall thinner than the external tube outside of the wall surface.

Abstract: A reflow soldering furnace in which a printed board and a plurality of electronic parts mounted thereon are subjected to reflow soldering. The furnace comprises a reflow soldering furnace body including a plurality of heating zones defined by furnace walls, a hot-gas applier, and a radiant-heat applier. The hot-gas applier includes a heat source and a fan for blowing a hot gas of a temperature lower than a target temperature for each zone against a printed board. The radiant-heat applier includes a heater for applying radiant heat of a temperature higher than the target temperature to the printed board. The printed board and electronic parts thereon are heated to the target temperature, the melting point of solder, by means of the radiant heat from the heater. Among these electronic parts, small-sized ones with a relatively small heat capacity are restrained from overheating by the low-temperature hot gas from the hot-gas applier.

Abstract: A reflow soldering furnace in which a printed board and a plurality of electronic parts mounted thereon are subjected to reflow soldering. The furnace comprises a reflow soldering furnace body including a plurality of heating zones defined by furnace walls, a hot-gas applier, and a radiant-heat applier. The hot-gas applier includes a heat source and a fan for blowing a hot gas of a temperature lower than a target temperature for each zone against a printed board. The radiant-heat applier includes a heater for applying radiant heat of a temperature higher than the target temperature to the printed board. The printed board and electronic parts thereon are heated to the target temperature, the melting point of solder, by means of the radiant heat from the heater. Among these electronic parts, small-sized ones with a relatively small heat capacity are restrained from overheating by the low-temperature hot gas from the hot-gas applier.