Patents by Inventor Taro Nakanoya

Taro Nakanoya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11376659
    Abstract: There is provided a spherical silver powder which is capable of being sintered at a lower temperature. The spherical silver powder of spherical silver particles has cavities, each of which is formed in a corresponding one of the spherical silver particles and each of which has a major axis of 100 to 1000 nm and a minor axis of 10 nm or more, the ratio of the major axis to the minor axis (major axis/minor axis) being 5 or more, the major axis being the length of the long side of a rectangle which has a minimum area and which circumscribes the outline of a cross-section of a corresponding one of the cavities on an image of the cross-section of the corresponding one of the silver particles exposed by polishing the surface of a resin after the silver powder is embedded in the resin, and the minor axis being the length of the narrow side of the rectangle.
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: July 5, 2022
    Assignee: Dowa Electronics Materials Co., Ltd.
    Inventors: Masaya Osako, Taro Nakanoya
  • Publication number: 20210162495
    Abstract: There is provided a spherical silver powder which is capable of being sintered at a lower temperature. The spherical silver powder of spherical silver particles has cavities, each of which is formed in a corresponding one of the spherical silver particles and each of which has a major axis of 100 to 1000 nm and a minor axis of 10 nm or more, the ratio of the major axis to the minor axis (major axis/minor axis) being 5 or more, the major axis being the length of the long side of a rectangle which has a minimum area and which circumscribes the outline of a cross-section of a corresponding one of the cavities on an image of the cross-section of the corresponding one of the silver particles exposed by polishing the surface of a resin after the silver powder is embedded in the resin, and the minor axis being the length of the narrow side of the rectangle.
    Type: Application
    Filed: December 13, 2018
    Publication date: June 3, 2021
    Applicant: Dowa Electronics Materials Co., Ltd.
    Inventors: Masaya Osako, Taro Nakanoya
  • Patent number: 10460851
    Abstract: Provided is a silver-tellurium-coated glass powder including: a tellurium-based glass powder containing tellurium in an amount of 20% by mass or more; and a coating layer on a surface of the tellurium-based glass powder, the coating layer containing silver and tellurium as a main component. Preferable aspects include an aspect where the coating layer containing silver and tellurium as a main component further contains a component that is other than silver and tellurium and contained in the tellurium-based glass powder, and an aspect where the component that is lo other than silver and tellurium and contained in the tellurium-based glass powder contains one or more kinds selected from zinc, lead, bismuth, silicon, lithium, and aluminum.
    Type: Grant
    Filed: March 15, 2017
    Date of Patent: October 29, 2019
    Assignee: DOWA Electronics Materials Co., Ltd.
    Inventors: Hiroshi Kamiga, Taro Nakanoya, Noriaki Nogami, Kenichi Harigae
  • Patent number: 10252331
    Abstract: A silver powder, including: an organic substance on a surface of the silver powder, the organic substance containing at least one carboxyl group and at least one hydroxyl group in one molecule of the organic substance, wherein a ratio of (Casson yield value/BET specific surface area) is 500 or less, where the Casson yield value is a Casson yield value of a conductive paste and the BET specific surface area is a BET specific surface area of the silver powder, where the conductive paste has a composition in which the silver powder is 86% by mass, a glass fit is 1% by mass, ethyl cellulose is 0.6% by mass, texanol is 10.5% by mass, and zinc oxide is 1.9% by mass, and the conductive paste is prepared by kneading the composition with a planetary centrifugal stirrer and bubble remover and dispersing with a triple roll mill.
    Type: Grant
    Filed: July 27, 2015
    Date of Patent: April 9, 2019
    Assignee: DOWA Electronics Materials Co., Ltd.
    Inventors: Taro Nakanoya, Hiroshi Kamiga
  • Publication number: 20190080815
    Abstract: Provided is a silver-tellurium-coated glass powder including: a tellurium-based glass powder containing tellurium in an amount of 20% by mass or more; and a coating layer on a surface of the tellurium-based glass powder, the coating layer containing silver and tellurium as a main component. Preferable aspects include an aspect where the coating layer containing silver and tellurium as a main component further contains a component that is other than silver and tellurium and contained in the tellurium-based glass powder, and an aspect where the component that is lo other than silver and tellurium and contained in the tellurium-based glass powder contains one or more kinds selected from zinc, lead, bismuth, silicon, lithium, and aluminum.
    Type: Application
    Filed: March 15, 2017
    Publication date: March 14, 2019
    Inventors: Hiroshi Kamiga, Taro Nakanoya, Noriaki Nogami, Kenichi Harigae
  • Patent number: 9993871
    Abstract: A silver powder, including: an organic substance on a surface of the silver powder, the organic substance containing at least one carboxyl group and at least one hydroxyl group in one molecule of the organic substance, wherein a BET specific surface area of the silver powder is 0.1 m2/g or more but 2.0 m2/g or less, and wherein a cumulative 50% point of particle diameter (D50) of the silver powder in a volume-based particle size distribution of the silver powder as measured by a laser diffraction particle size distribution analysis is 0.1 ?m or more but 6.0 ?m or less, and a ratio of [(D90?D10)/D50] is 3.0 or less, where D50 is the cumulative 50% point of particle diameter, D90 is a cumulative 90% point of particle diameter of the silver powder, and D10 is a cumulative 10% point of particle diameter of the silver powder.
    Type: Grant
    Filed: July 27, 2015
    Date of Patent: June 12, 2018
    Assignee: DOWA Electronics Materials Co., Ltd.
    Inventors: Taro Nakanoya, Hiroshi Kamiga
  • Publication number: 20170259334
    Abstract: A silver powder, including: an organic substance on a surface of the silver powder, the organic substance containing at least one carboxyl group and at least one hydroxyl group in one molecule of the organic substance, wherein a BET specific surface area of the silver powder is 0.1 m2/g or more but 2.0 m2/g or less, and wherein a cumulative 50% point of particle diameter (D50) of the silver powder in a volume-based particle size distribution of the silver powder as measured by a laser diffraction particle size distribution analysis is 0.1 ?m or more but 6.0 ?m or less, and a ratio of [(D90?D10)/D5o] is 3.0 or less, where D50 is the cumulative 50% point of particle diameter, D90 is a cumulative 90% point of particle diameter of the silver powder, and D10 is a cumulative 10% point of particle diameter of the silver powder.
    Type: Application
    Filed: July 27, 2015
    Publication date: September 14, 2017
    Applicant: DOWA Electronics Materials Co., Ltd.
    Inventors: Taro Nakanoya, Hiroshi Kamiga
  • Publication number: 20170259333
    Abstract: A silver powder, including: an organic substance on a surface of the silver powder, the organic substance containing at least one carboxyl group and at least one hydroxyl group in one molecule of the organic substance, wherein a ratio of (Casson yield value/BET specific surface area) is 500 or less, where the Casson yield value is a Casson yield value of a conductive paste and the BET specific surface area is a BET specific surface area of the silver powder, where the conductive paste has a composition in which the silver powder is 86% by mass, a glass fit is 1% by mass, ethyl cellulose is 0.6% by mass, texanol is 10.5% by mass, and zinc oxide is 1.9% by mass, and the conductive paste is prepared by kneading the composition with a planetary centrifugal stirrer and bubble remover and dispersing with a triple roll mill.
    Type: Application
    Filed: July 27, 2015
    Publication date: September 14, 2017
    Inventors: Taro Nakanoya, Hiroshi Kamiga
  • Patent number: 8916068
    Abstract: Provided is a silver micropowder coated with a protective material and capable of more drastically reducing the sintering temperature than before. The silver micropowder comprises silver particles processed to adsorb hexylamine (C6H13—NH2) on the surfaces thereof and having a mean particle diameter DTEM of from 3 to 20 nm or an X-ray crystal particle diameter DX of from 1 to 20 nm. The silver micropowder has the property of forming a conductive film having a specific resistivity of not more than 25 ??·cm when it is mixed with an organic medium to prepare a silver coating material and when a coating film formed of it is fired in air at 120° C. Even when fired at 100° C., it may form a conductive film having a specific resistivity of not more than 25 ??·cm.
    Type: Grant
    Filed: December 25, 2008
    Date of Patent: December 23, 2014
    Assignee: Dowa Electronics Materials Co., Ltd.
    Inventors: Kimitaka Sato, Taku Okano, Taro Nakanoya
  • Patent number: 8486307
    Abstract: Provided are silver nanoparticles having a good affinity (that is, dispersibility) for y-butyrolactone (C4H6O2), an organic solvent which has a relatively high boiling point though having a relatively small molecular weight, and has a low viscosity and a low surface tension and which has little irritating odor. The above problems are solved by providing a silver micropowder excellent in affinity for at least y-butyrolactone, which comprises silver particles processed to adsorb at least one of 1,4-dihydroxy-2-naphthoic acid (C11H8O4) and gallic acid (C7H6O5) on the surfaces thereof and having an X-ray crystal particle diameter DX of from 1 to 40 nm, preferably from 1 to 15 nm.
    Type: Grant
    Filed: December 25, 2008
    Date of Patent: July 16, 2013
    Assignee: Dowa Electroncis Materials Co., Ltd.
    Inventors: Kimitaka Sato, Shinya Sasaki, Taro Nakanoya
  • Publication number: 20100288159
    Abstract: Provided are silver nanoparticles having a good affinity (that is, dispersibility) for ?-butyrolactone (C4H6O2), an organic solvent which has a relatively high boiling point though having a relatively small molecular weight, and has a low viscosity and a low surface tension and which has little irritating odor. The above problems are solved by providing a silver micropowder excellent in affinity for at least ?-butyrolactone, which comprises silver particles processed to adsorb at least one of 1,4-dihydroxy-2-naphthoic acid (C11H8O4) and gallic acid (C7H6O5) on the surfaces thereof and having an X-ray crystal particle diameter Dx of from 1 to 40 nm, preferably from 1 to 15 nm.
    Type: Application
    Filed: December 25, 2008
    Publication date: November 18, 2010
    Inventors: Kimitaka Sato, Shinya Sasaki, Taro Nakanoya
  • Publication number: 20100283013
    Abstract: Provided is a silver micropowder coated with a protective material and capable of more drastically reducing the sintering temperature than before. The silver micropowder comprises silver particles processed to adsorb hexylamine (C6H13—NH2) on the surfaces thereof and having a mean particle diameter DTEM of from 3 to 20 nm or an X-ray crystal particle diameter DX of from 1 to 20 nm. The silver micropowder has the property of forming a conductive film having a specific resistivity of not more than 25 ??·cm when it is mixed with an organic medium to prepare a silver coating material and when a coating film formed of it is fired in air at 120° C. Even when fired at 100° C., it may form a conductive film having a specific resistivity of not more than 25 ??·cm.
    Type: Application
    Filed: December 25, 2008
    Publication date: November 11, 2010
    Inventors: Kimitaka Sato, Taku Okano, Taro Nakanoya