Patents by Inventor Taro Nishioka
Taro Nishioka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9887150Abstract: A semiconductor device is disclosed. The semiconductor device has a semiconductor chip, an island having an upper surface to which the semiconductor chip is bonded, a lead disposed around the island, a bonding wire extended between the surface of the semiconductor chip and the upper surface of the lead, and a resin package sealing the semiconductor chip, the island, the lead, and the bonding wire, while the lower surface of the island and the lower surface of the lead are exposed on the rear surface of the resin package, and the lead is provided with a recess concaved from the lower surface side and opened on a side surface thereof.Type: GrantFiled: March 3, 2017Date of Patent: February 6, 2018Assignee: ROHM CO., LTD.Inventors: Akihiro Koga, Taro Nishioka
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Patent number: 9793195Abstract: A semiconductor device is disclosed. The semiconductor device has a semiconductor chip, an island having an upper surface to which the semiconductor chip is bonded, a lead disposed around the island, a bonding wire extended between the surface of the semiconductor chip and the upper surface of the lead, and a resin package sealing the semiconductor chip, the island, the lead, and the bonding wire, while the lower surface of the island and the lower surface of the lead are exposed on the rear surface of the resin package, and the lead is provided with a recess concaved from the lower surface side and opened on a side surface thereof.Type: GrantFiled: June 21, 2017Date of Patent: October 17, 2017Assignee: ROHM CO., LTD.Inventors: Akihiro Koga, Taro Nishioka
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Publication number: 20170287817Abstract: A semiconductor device is disclosed. The semiconductor device has a semiconductor chip, an island having an upper surface to which the semiconductor chip is bonded, a lead disposed around the island, a bonding wire extended between the surface of the semiconductor chip and the upper surface of the lead, and a resin package sealing the semiconductor chip, the island, the lead, and the bonding wire, while the lower surface of the island and the lower surface of the lead are exposed on the rear surface of the resin package, and the lead is provided with a recess concaved from the lower surface side and opened on a side surface thereof.Type: ApplicationFiled: June 21, 2017Publication date: October 5, 2017Applicant: ROHM CO., LTD.Inventors: Akihiro KOGA, Taro NISHIOKA
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Publication number: 20170179006Abstract: A semiconductor device is disclosed. The semiconductor device has a semiconductor chip, an island having an upper surface to which the semiconductor chip is bonded, a lead disposed around the island, a bonding wire extended between the surface of the semiconductor chip and the upper surface of the lead, and a resin package sealing the semiconductor chip, the island, the lead, and the bonding wire, while the lower surface of the island and the lower surface of the lead are exposed on the rear surface of the resin package, and the lead is provided with a recess concaved from the lower surface side and opened on a side surface thereof.Type: ApplicationFiled: March 3, 2017Publication date: June 22, 2017Applicant: ROHM CO., LTD.Inventors: Akihiro KOGA, Taro NISHIOKA
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Patent number: 9607932Abstract: A semiconductor device is disclosed. The semiconductor device has a semiconductor chip, an island having an upper surface to which the semiconductor chip is bonded, a lead disposed around the island, a bonding wire extended between the surface of the semiconductor chip and the upper surface of the lead, and a resin package sealing the semiconductor chip, the island, the lead, and the bonding wire, while the lower surface of the island and the lower surface of the lead are exposed on the rear surface of the resin package, and the lead is provided with a recess concaved from the lower surface side and opened on a side surface thereof.Type: GrantFiled: April 8, 2016Date of Patent: March 28, 2017Assignee: ROHM CO., LTD.Inventors: Akihiro Koga, Taro Nishioka
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Patent number: 9476949Abstract: A semiconductor device is provided with a substrate including a main surface and a back surface that face in opposite directions to each other in a thickness direction, and first, second and third direction sensor elements having different detection reference axes from each other. The substrate is formed with a recessed portion that is recessed from the main surface toward the back surface side. The first direction sensor element is disposed at least partially within the recessed portion. The second direction sensor element is disposed so as to overlap with the main surface as viewed in the thickness direction.Type: GrantFiled: August 4, 2014Date of Patent: October 25, 2016Assignee: ROHM CO., LTD.Inventors: Taro Nishioka, Mamoru Yamagami
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Publication number: 20160225700Abstract: A semiconductor device is disclosed. The semiconductor device has a semiconductor chip, an island having an upper surface to which the semiconductor chip is bonded, a lead disposed around the island, a bonding wire extended between the surface of the semiconductor chip and the upper surface of the lead, and a resin package sealing the semiconductor chip, the island, the lead, and the bonding wire, while the lower surface of the island and the lower surface of the lead are exposed on the rear surface of the resin package, and the lead is provided with a recess concaved from the lower surface side and opened on a side surface thereof.Type: ApplicationFiled: April 8, 2016Publication date: August 4, 2016Applicant: ROHM CO., LTD.Inventors: Akihiro KOGA, Taro NISHIOKA
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Patent number: 9337128Abstract: A semiconductor device is disclosed. The semiconductor device has a semiconductor chip, an island having an upper surface to which the semiconductor chip is bonded, a lead disposed around the island, a bonding wire extended between the surface of the semiconductor chip and the upper surface of the lead, and a resin package sealing the semiconductor chip, the island, the lead, and the bonding wire, while the lower surface of the island and the lower surface of the lead are exposed on the rear surface of the resin package, and the lead is provided with a recess concaved from the lower surface side and opened on a side surface thereof.Type: GrantFiled: March 4, 2015Date of Patent: May 10, 2016Assignee: ROHM CO., LTD.Inventors: Akihiro Koga, Taro Nishioka
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Publication number: 20160007464Abstract: An electronic device includes an electronic element, a plurality of first sub-electrodes arrayed in a first direction, a plurality of second sub-electrodes arrayed in a second direction that is orthogonal to the first direction, a dummy electrode, and a sealing resin. The sealing resin has a resin back surface from which the plurality of first sub-electrodes, the plurality of second sub-electrodes and the dummy electrode are exposed. The plurality of second sub-electrodes are located further in the first direction than any of the plurality of first sub-electrodes. The plurality of first sub-electrodes are located further in the second direction than any of the plurality of second sub-electrodes. The dummy electrode is located further in the first direction than any of the plurality of first sub-electrodes, and is located further in the second direction than any of the plurality of second sub-electrodes.Type: ApplicationFiled: July 1, 2015Publication date: January 7, 2016Inventors: Hiroaki MATSUBARA, Yasumasa KASUYA, Taro NISHIOKA
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Publication number: 20150179554Abstract: A semiconductor device is disclosed. The semiconductor device has a semiconductor chip, an island having an upper surface to which the semiconductor chip is bonded, a lead disposed around the island, a bonding wire extended between the surface of the semiconductor chip and the upper surface of the lead, and a resin package sealing the semiconductor chip, the island, the lead, and the bonding wire, while the lower surface of the island and the lower surface of the lead are exposed on the rear surface of the resin package, and the lead is provided with a recess concaved from the lower surface side and opened on a side surface thereof.Type: ApplicationFiled: March 4, 2015Publication date: June 25, 2015Applicant: ROHM CO., LTD.Inventors: Akihiro KOGA, Taro NISHIOKA
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Patent number: 9035436Abstract: A semiconductor device is disclosed. The semiconductor device has a semiconductor chip, an island having an upper surface to which the semiconductor chip is bonded, a lead disposed around the island, a bonding wire extended between the surface of the semiconductor chip and the upper surface of the lead, and a resin package sealing the semiconductor chip, the island, the lead, and the bonding wire, while the lower surface of the island and the lower surface of the lead are exposed on the rear surface of the resin package, and the lead is provided with a recess concaved from the lower surface side and opened on a side surface thereof.Type: GrantFiled: April 21, 2014Date of Patent: May 19, 2015Assignee: ROHM CO., LTD.Inventors: Akihiro Koga, Taro Nishioka
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Publication number: 20150035528Abstract: A semiconductor device is provided with a substrate including a main surface and a back surface that face in opposite directions to each other in a thickness direction, and first, second and third direction sensor elements having different detection reference axes from each other. The substrate is formed with a recessed portion that is recessed from the main surface toward the back surface side. The first direction sensor element is disposed at least partially within the recessed portion. The second direction sensor element is disposed so as to overlap with the main surface as viewed in the thickness direction.Type: ApplicationFiled: August 4, 2014Publication date: February 5, 2015Inventors: Taro NISHIOKA, Mamoru YAMAGAMI
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Publication number: 20140225243Abstract: A semiconductor device is disclosed. The semiconductor device has a semiconductor chip, an island having an upper surface to which the semiconductor chip is bonded, a lead disposed around the island, a bonding wire extended between the surface of the semiconductor chip and the upper surface of the lead, and a resin package sealing the semiconductor chip, the island, the lead, and the bonding wire, while the lower surface of the island and the lower surface of the lead are exposed on the rear surface of the resin package, and the lead is provided with a recess concaved from the lower surface side and opened on a side surface thereof.Type: ApplicationFiled: April 21, 2014Publication date: August 14, 2014Applicant: ROHM CO., LTD.Inventors: Akihiro KOGA, Taro NISHIOKA
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Patent number: 8742552Abstract: The semiconductor device according to the present invention includes a semiconductor chip, an island having an upper surface to which the semiconductor chip is bonded, a lead arranged around the island, a bonding wire extended between the surface of the semiconductor chip and the upper surface of the lead, and a resin package collectively sealing the semiconductor chip, the island, the lead and the bonding wire, while the lower surface of the island and the lower surface of the lead are exposed on the rear surface of the resin package, and the lead is provided with a recess concaved from the lower surface side and opened on a side surface thereof.Type: GrantFiled: June 28, 2013Date of Patent: June 3, 2014Assignee: Rohm Co., Ltd.Inventors: Akihiro Koga, Taro Nishioka
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Publication number: 20130285250Abstract: The semiconductor device according to the present invention includes a semiconductor chip, an island having an upper surface to which the semiconductor chip is bonded, a lead arranged around the island, a bonding wire extended between the surface of the semiconductor chip and the upper surface of the lead, and a resin package collectively sealing the semiconductor chip, the island, the lead and the bonding wire, while the lower surface of the island and the lower surface of the lead are exposed on the rear surface of the resin package, and the lead is provided with a recess concaved from the lower surface side and opened on a side surface thereof.Type: ApplicationFiled: June 28, 2013Publication date: October 31, 2013Inventors: Akihiro KOGA, Taro NISHIOKA
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Patent number: 8502359Abstract: The semiconductor device according to the present invention includes a semiconductor chip, an island having an upper surface to which the semiconductor chip is bonded, a lead arranged around the island, a bonding wire extended between the surface of the semiconductor chip and the upper surface of the lead, and a resin package collectively sealing the semiconductor chip, the island, the lead and the bonding wire, while the lower surface of the island and the lower surface of the lead are exposed on the rear surface of the resin package, and the lead is provided with a recess concaved from the lower surface side and opened on a side surface thereof.Type: GrantFiled: December 2, 2009Date of Patent: August 6, 2013Assignee: Rohm Co., Ltd.Inventors: Akihiro Koga, Taro Nishioka
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Publication number: 20120018896Abstract: The semiconductor device according to the present invention includes a semiconductor chip, an island having an upper surface to which the semiconductor chip is bonded, a lead arranged around the island, a bonding wire extended between the surface of the semiconductor chip and the upper surface of the lead, and a resin package collectively sealing the semiconductor chip, the island, the lead and the bonding wire, while the lower surface of the island and the lower surface of the lead are exposed on the rear surface of the resin package, and the lead is provided with a recess concaved from the lower surface side and opened on a side surface thereof.Type: ApplicationFiled: December 2, 2009Publication date: January 26, 2012Applicant: ROHM Co. LtdInventors: Akihiro Koga, Taro Nishioka
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Patent number: 7612456Abstract: An inventive electronic device includes a substrate, a bump of a first metal material provided on a surface of the substrate, a bonding film of a second metal material provided on a top surface of the bump for bonding the electronic device to an electrical connection portion of a second device, the second metal material having a lower melting point in an elemental state than an alloy of the first metal material and the second metal material, and a diffusion prevention film of a third metal material provided between the top surface of the bump and the bonding film as covering at least part of the top surface of the bump, the third metal material having a lower diffusion coefficient than the second metal material with respect to the first metal material.Type: GrantFiled: June 16, 2005Date of Patent: November 3, 2009Assignee: Rohm Co., Ltd.Inventors: Sadamasa Fujii, Taro Nishioka
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Publication number: 20070075422Abstract: Disclosed is an electronic device comprising a substrate, a bump formed on a substrate surface and composed of a first metal material, a junction film for connection with an electrical connecting portion of another device which is formed on the top face of the bump and composed of a second metal material, the melting point of which second metal material itself is lower than the melting point of an alloy thereof with the first metal material, and a diffusion-preventing film which is so arranged between the top face of the bump and the junction film as to cover at least a part of the top face of the bump and composed of a third metal material whose diffusion coefficient in the first metal material is lower than that of the second metal material.Type: ApplicationFiled: June 16, 2005Publication date: April 5, 2007Inventors: Sadamasa Fujii, Taro Nishioka