Abstract: An irradiation control system includes a radiation energy source for producing radiation energy in the form of pulses; a path defined for the radiation energy, between the radiation energy source and a surface to be irradiated with the radiation energy from the radiation energy source; an energy changing member provided in relation to the path and being effective to change the proportion of the radiation energy, irradiating the surface, to the radiation energy produced by the radiation energy source; a detecting device for detecting the irradiation of the surface with a predetermined amount of radiation energy; a driving device for changing the state of the energy changing member at least during a period from start of irradiation of the surface with the radiation energy to the detection of irradiation of the surface with the predetermined amount of radiation energy through the detecting device; and a control device for controlling the timing of production of radiation energy by the radiation energy source, in

Abstract: A wafer prober for contacting probe needles of a probe card to bonding pads of a chip formed on a wafer, for allowing examination of characteristics of the chip, is disclosed. The wafer prober includes a wafer holder for holding a wafer and moving the same in X and Y directions. By the wafer holder, the wafer can be moved from an alignment information detecting station whereat alignment information can be detected by use of a TV camera, to an examining station whereat the probe needles of the probe card are used for the examination. The position of the wafer in a Z direction at the time when the alignment information is detected by the TV camera, can be made substantially coincident with the position of the wafer in the Z direction at the time when the probe needles contact the bonding pads.

Abstract: A wafer prober usable with a probe card for examination of chips formed on a wafer is disclosed. The wafer prober has a function for automatically aligning bonding pads of each chip with probe needles of the probe card. The prober includes a contact plate movable in X and Y directions with a wafer chuck. The contact blade is pressed against at least one of the tips of the probe needles, and the thus contacted needle tip is observed by a TV camera from the underneath of the contact plate. The video signal obtained thereby is used for the alignment between the bonding pads and the probe needles. Also, the TV camera is moved in the X and Y directions with the wafer chuck to allow that one and the same reference mark is observed by this TV camera and by another TV camera provided for image-taking the bonding pads. With the proposed structure, the bonding pads and the probe needles can be aligned automatically and accurately.

Abstract: A wafer detecting device usable with a carrier has a plurality of wafer carrying portions disposed in stories for carrying wafers thereon. The device comprises a light emitting portion for emitting a light beams so that it passes through the carrier from one side thereof to the other side thereof and in a direction substantially parallel to a plane in which a wafer is carried on a wafer carrying portion of the carrier. A light receiving portion is disposed at the other side of the carrier for detecting presence/absence of the light passed through the carrier.