Abstract: A semiconductor device includes a first die pad with a first obverse surface facing in z direction, a second die pad spaced from the first die pad and including a second obverse surface facing in z direction, a first semiconductor element on the first obverse surface, a second semiconductor element on the second obverse surface, an insulating element on the first or second obverse surface and located between the first and second semiconductor elements in x direction to relay signals between the first and second semiconductor elements while electrically insulating these semiconductor elements, and a wire bonded to the first semiconductor element and the first obverse surface. The first die pad includes a first bond portion bonded to the wire, and a first opening located between the first bond portion and the first semiconductor element in y direction and including an opening end in the first obverse surface.

Abstract: A refrigerator includes: a heat-insulating main body composing a storage compartment; and a main door at an opening of the storage compartment, in which the main door includes: an opening provided at a front face of the main door; a sub door which freely opens and closes at the opening through rotation; an axis member for rotatably holding the sub door; a fixing member provided across a sub door side face and an opening inner side face, the sub door side face being a side face of the sub door in an axial direction of the axis member, and the opening inner side face being an inner side face of the opening opposite to the sub door side face; and a regulating member for regulating a rotational angle of the sub door at a predetermined angle by contacting the fixing member when the sub door is open.