Patents by Inventor Taro Yasuda

Taro Yasuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6655547
    Abstract: A chip component take-in apparatus takes in and guides downward prismatic chip components stored in a bulk state in a storage chamber one by one in a predetermined direction. When a first take-in member and a second take-in member are relatively moved up and down in each flat face contact state, the chip components in face contact with the flat faces of the take-in members are gradually guided to a center along guide ways. The guided chip components in the longitudinal direction thereof are taken into a passage constituted by grooves and are moved downward along the passage by self-weight.
    Type: Grant
    Filed: August 9, 2001
    Date of Patent: December 2, 2003
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Koji Saito, Taro Yasuda, Hiroyuki Matsui
  • Patent number: 6443326
    Abstract: A component transfer mechanism transfers chip components along a liner passage by applying an inhaling pressure or a discharging pressure of an air bag or an air cylinder directly to the chip components in the liner passage, or by operating a component transfer member through an air actuator by the inhaling pressure or the discharging pressure. A component take-in mechanism stirs chip components in a storage chamber and takes them into a feeding passage by applying the inhaling pressure or the discharging pressure of the air bag or the air cylinder directly to the chip components in the storage chamber, or by operating a component stirring member through the air actuator by the inhaling pressure or the discharging pressure.
    Type: Grant
    Filed: August 13, 2001
    Date of Patent: September 3, 2002
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Koji Saito, Taro Yasuda
  • Patent number: 6371276
    Abstract: A chip component supplying apparatus is disclosed. The chip component supplying apparatus includes a storage chamber for storing chip components in random directions. A discharge channel allows the chip components in the storage chamber to move downward in a predetermined direction. A conveying channel conveys the chip components discharged from the discharge channel and wherein the discharge channel has an inclined portion at a lower part thereof and the chip components in the discharge channel are discharged to the conveying channel through the inclined portion.
    Type: Grant
    Filed: May 18, 2001
    Date of Patent: April 16, 2002
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Koji Saito, Kikuji Fukai, Taro Yasuda
  • Publication number: 20020027059
    Abstract: A component transfer mechanism transfers chip components along a liner passage by applying an inhaling pressure or a discharging pressure of an air bag or an air cylinder directly to the chip components in the liner passage, or by operating a component transfer member through an air actuator by the inhaling pressure or the discharging pressure. A component take-in mechanism stirs chip components in a storage chamber and takes them into a feeding passage by applying the inhaling pressure or the discharging pressure of the air bag or the air cylinder directly to the chip components in the storage chamber, or by operating a component stirring member through the air actuator by the inhaling pressure or the discharging pressure.
    Type: Application
    Filed: August 13, 2001
    Publication date: March 7, 2002
    Applicant: Taiyo Yuden Co., Ltd.
    Inventors: Koji Saito, Taro Yasuda
  • Publication number: 20020011398
    Abstract: A chip component take-in apparatus takes in and guides downward prismatic chip components stored in a bulk state in a storage chamber one by one in a predetermined direction. When a first take-in member and a second take-in member are relatively moved up and down in each flat face contact state, the chip components in face contact with the flat faces of the take-in members are gradually guided to a center along guide ways. The guided chip components in the longitudinal direction thereof are taken into a passage constituted by grooves and are moved downward along the passage by self-weight.
    Type: Application
    Filed: August 9, 2001
    Publication date: January 31, 2002
    Applicant: Taiyo Yuden Co., Ltd.
    Inventors: Koji Saito, Taro Yasuda, Hiroyuki Matsui
  • Publication number: 20010052446
    Abstract: A chip component take-in apparatus takes in and guides downward prismatic chip components stored in a bulk state in a storage chamber one by one in a predetermined direction. When a first take-in member and a second take-in member are relatively moved up and down in each flat face contact state, the chip components in face contact with the flat faces of the take-in members are gradually guided to a center along guide ways. The guided chip components in the longitudinal direction thereof are taken into a passage constituted by grooves and are moved downward along the passage by self-weight.
    Type: Application
    Filed: August 9, 2001
    Publication date: December 20, 2001
    Applicant: Taiyo Yuden Co., Ltd.
    Inventors: Koji Saito, Taro Yasuda, Hiroyuki Matsui
  • Publication number: 20010050208
    Abstract: An electronic component feeding apparatus conveys chip components intermittently by moving a belt. This apparatus has a motion changing mechanism for changing an input motion for moving the belt to an unequal speed motion having a low initial speed and for transmitting the changed unequal speed motion to a belt moving mechanism. This motion changing mechanism has a cam member having a cam face of a predetermined shape and a cam contact member in contact with the cam face, and performs the motion change by a relative movement between the cam member and the cam contact member. An unequal speed motion (accelerated motion) after being changed by the motion changing mechanism is transmitted to the belt moving mechanism, whereby an initial speed when the belt is moved is decreased.
    Type: Application
    Filed: April 18, 2001
    Publication date: December 13, 2001
    Applicant: Taiyo Yuden Co., Ltd.
    Inventors: Tatsuichi Ito, Koji Saito, Taro Yasuda
  • Patent number: 6308861
    Abstract: A chip component feeding apparatus translates chip components in alignment along a passage and feeds the foremost chip component to a predetermined take-out position. The foremost chip component is separated from the remaining translated chip components. A stopper is displaceable between a predetermined stop position where the foremost chip component stops, and a predetermined take-out position spaced from the stop position. A first attracting section attracts the foremost chip component to the stopper to displace the stopper and the foremost chip component at the stopped position. A second attracting section attracts the foremost chip component to a transport belt.
    Type: Grant
    Filed: June 9, 2000
    Date of Patent: October 30, 2001
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Koji Saito, Taro Yasuda
  • Patent number: 6296104
    Abstract: An electronic component feeding apparatus for separating a foremost electronic component conveyed to a predetermined takeout position from a succeeding electronic component, wherein, the separating device includes a first component stopper, a second component stopper projecting from the first component stopper and having a magnetic attractive force at a tip end thereof for separating a foremost electronic component. The second component stopper is movable within the first component stopper between a retracted and a protruding position so that the foremost electronic component engages both the first and second component stoppers during separation from a succeeding electronic component.
    Type: Grant
    Filed: December 8, 1998
    Date of Patent: October 2, 2001
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Tatsuichi Ito, Koji Saito, Taro Yasuda
  • Patent number: 6290095
    Abstract: A chip component take-in apparatus takes in and guides downward prismatic chip components stored in a bulk state in a storage chamber one by one in a predetermined direction. When a first take-in member and a second take-in member are relatively moved up and down in each flat face contact state, the chip components in face contact with the flat faces of the take-in members are gradually guided to a center along guide ways. The guided chip components in the longitudinal direction thereof are taken into a passage constituted by grooves and are moved downward along the passage by self-weight.
    Type: Grant
    Filed: May 15, 2000
    Date of Patent: September 18, 2001
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Koji Saito, Taro Yasuda, Hiroyuki Matsui
  • Publication number: 20010020567
    Abstract: An apparatus for supplying chip parts comprises a chip part supplying apparatus whereby electronic parts in a chip form accumulated at random directions are being supplied in an orderly line and a chip part feeding means which works to transfer the forefront one of the aligned chip parts onto a circuit component such as a printed circuit board is being disclosed here. Chip parts housed at random directions in a hopper are taken into a discharge channel being organized to a prescribed direction and transferred through said discharge channel before being discharged through its bottom end onto a conveying belt before being carried by said belt toward a prescribed direction. A clearance is forcefully caused between the forefront chip part and the next chip part at the stage just before the forefront chip part is picked up, said clearance occurring between the two chip parts working to separate the two chip parts completely.
    Type: Application
    Filed: May 18, 2001
    Publication date: September 13, 2001
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Koji Saito, Kikuji Fukai, Taro Yasuda
  • Patent number: 6283325
    Abstract: A component transfer mechanism transfers chip components along a liner passage by applying an inhaling pressure or a discharging pressure of an air bag or an air cylinder directly to the chip components in the liner passage, or by operating a component transfer member through an air actuator by the inhaling pressure or the discharging pressure. A component take-in mechanism stirs chip components in a storage chamber and takes them into a feeding passage by applying the inhaling pressure or the discharging pressure of the air bag or the air cylinder directly to the chip components in the storage chamber, or by operating a component stirring member through the air actuator by the inhaling pressure or the discharging pressure.
    Type: Grant
    Filed: December 8, 1998
    Date of Patent: September 4, 2001
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Koji Saito, Taro Yasuda
  • Patent number: 6264061
    Abstract: A supply apparatus for prism-shaped chip components has two relatively movable taking-in members. When the members move relative to each other, flat surfaces thereof contact each other and a parallel space is formed between the upper portions of the two taking-in members. Relative movement of the two talking-in members causes the components in a storage chamber to enter the parallel space between the upper portions of the two taking-in members. The components entering the parallel space have the same thickness-wise orientation and are lengthwise in a supply passageway in a one by one in a state. The components move downward by gravity in the supply passageway and then in a discharge passageway.
    Type: Grant
    Filed: February 3, 1999
    Date of Patent: July 24, 2001
    Assignee: Taiyo Yuden Co., LTD
    Inventors: Kikuji Fukai, Koji Saito, Taro Yasuda, Yutaka Aikawa
  • Patent number: 6253902
    Abstract: An electronic component supplying apparatus conveys electronic components in an aligned state to supply the same to a predetermined taking-out position. When a leading chip component abuts on a component stopper and a component conveyance is stopped, a plurality of the chip components including the leading chip component are covered in a non-contacting state by a slider, the leading chip component which has abutted on the component stopper is attracted to the component stopper. In a state where the component conveyance by the conveying path is stopped, the component stopper is displaced in a component conveying direction, the leading chip component is separated from a second leading chip component, and also the slider is displaced in a direction opposite to the component conveying direction, so that the slider covering is uncovered, and the leading chip component is allowed to be taken out.
    Type: Grant
    Filed: September 29, 2000
    Date of Patent: July 3, 2001
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Koji Saito, Taro Yasuda
  • Patent number: 6250455
    Abstract: A chip component supplying apparatus is disclosed. The chip component supplying apparatus includes a storage chamber for storing chip components in random directions. A discharge channel allows the chip components in the storage chamber to move downward in a predetermined direction. A conveying channel conveys the chip components discharged from the discharge channel and wherein the discharge channel has an inclined portion at a lower part thereof and the chip components in the discharge channel are discharged to the conveying channel through the inclined portion.
    Type: Grant
    Filed: April 20, 2000
    Date of Patent: June 26, 2001
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Koji Saito, Kikuji Fukai, Taro Yasuda
  • Patent number: 6195876
    Abstract: In an electronic component placing apparatus, four magazines are mounted on a head, and yet electronic components are housed in each magazine. In this apparatus, by an operation of selectively inserting a suction nozzle into four insertion openings in the magazines, it is possible to load a desired electronic component on a substrate, and this component loading can be repeatedly performed until the housed components are exhausted.
    Type: Grant
    Filed: March 5, 1999
    Date of Patent: March 6, 2001
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Kazushige Koyama, Kikuji Fukai, Kiyoshi Murase, Masaru Aoki, Taro Yasuda, Koji Saito
  • Patent number: 6135264
    Abstract: An electronic component supplying apparatus conveys electronic components in an aligned state to supply the same to a predetermined taking-out position. When a leading chip component abuts on a component stopper and a component conveyance is stopped, a plurality of the chip components including the leading chip component are covered in a non-contacting state by a slider, the leading chip component which has abutted on the component stopper is attracted to the component stopper. In a state where the component conveyance by the conveying path is stopped, the component stopper is displaced in a component conveying direction, the leading chip component is separated from a second leading chip component, and also the slider is displaced in a direction opposite to the component conveying direction, so that the slider covering is uncovered, and the leading chip component is allowed to be taken out.
    Type: Grant
    Filed: March 4, 1999
    Date of Patent: October 24, 2000
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Koji Saito, Taro Yasuda
  • Patent number: 6131725
    Abstract: A chip component conveyor belt of the present invention comprises an endless timing belt having a plurality of teeth at predetermined intervals on its back surface. Wherein a height of the teeth is made uniform by polishing or grinding the tip of each tooth. Thus, there arises no variation of surface height of the endless timing belt even when any tooth of the endless timing belt meshes a timing pulley, or even when the endless timing belt is supported by a belt guide member.
    Type: Grant
    Filed: March 25, 1998
    Date of Patent: October 17, 2000
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Koji Saito, Taro Yasuda
  • Patent number: 6116840
    Abstract: A component supply apparatus includes a rectangular cross-sectional component passage which can house a plurality of chip components in a longitudinal direction, and at a first side surface of the tip of this component passage a rectangular-shaped component discharge opening is formed, and at a second side surface opposing the first side surface of the tip of the component passage a rectangular-shaped pusher insertion opening is formed. Inserting the pusher into the component passage through the pusher insertion opening enables a forefront electronic component to be pushed by the pusher and be discharged outside from the component discharge opening in a predetermined direction.
    Type: Grant
    Filed: August 18, 1999
    Date of Patent: September 12, 2000
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Koji Saito, Taro Yasuda, Kazushige Koyama, Jinichi Ohkawara, Atsuo Kamimura
  • Patent number: 6102188
    Abstract: Electronic chips accumulated at random directions are arranged in an orderly line by a chip part supplier. A chip part feeder transfers the first aligned chip onto a printed circuit board. Chip parts having random directions in a hopper are fed to a discharge channel, organized in a prescribed direction and transferred through the discharge channel before being discharged through the channel bottom end onto a conveying belt before being carried by the belt in a prescribed direction. A clearance forcefully caused between the first chip and next chip separates the two chips completely just before the first chip is picked up. The thus separated first chip part is picked up by a suction head before being transferred to the printed circuit board.
    Type: Grant
    Filed: August 27, 1998
    Date of Patent: August 15, 2000
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Koji Saito, Kikuji Fukai, Taro Yasuda