Patents by Inventor Tarou AIKAWA

Tarou AIKAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fixing structure for heat source element and heat conducting member, and method of fixing heat source element and heat conducting member
    Patent number: 8797743
    Abstract: An electronic device mounted on a circuit board and accommodated in a housing includes a heat source element accommodated in the housing and mounted on the circuit board, and a heat conducting member accommodated in the housing. The heat conducting member is movably mounted on the circuit board. An elastic member fixes the heat source element and the heat conducting member in abutment with each other. The elasticity of the elastic member permits variations in the relative positions of the heat source element and the heat conducting member while maintaining the abutment of the heat source element and the heat conducting member.
    Type: Grant
    Filed: November 17, 2011
    Date of Patent: August 5, 2014
    Assignee: Aisin Aw Co., Ltd.
    Inventors: Yoichiro Taka, Masashi Takano, Tarou Aikawa
  • FIXING STRUCTURE FOR HEAT SOURCE ELEMENT AND HEAT CONDUCTING MEMBER, AND METHOD OF FIXING HEAT SOURCE ELEMENT AND HEAT CONDUCTING MEMBER
    Publication number: 20120140418
    Abstract: An electronic device mounted on a circuit board and accommodated in a housing includes a heat source element accommodated in the housing and mounted on the circuit board, and a heat conducting member accommodated in the housing. The heat conducting member is movably mounted on the circuit board. An elastic member fixes the heat source element and the heat conducting member in abutment with each other. The elasticity of the elastic member permits variations in the relative positions of the heat source element and the heat conducting member while maintaining the abutment of the heat source element and the heat conducting member.
    Type: Application
    Filed: November 17, 2011
    Publication date: June 7, 2012
    Applicant: AISIN AW CO., LTD.
    Inventors: Yoichiro TAKA, Masashi TAKANO, Tarou AIKAWA