Patents by Inventor Tarun Amla

Tarun Amla has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11930596
    Abstract: Described herein are dielectric polymer films and printed circuit boards, such as multilayer and high-density interconnect printed circuit board comprising at least one dielectric polymer film.
    Type: Grant
    Filed: January 12, 2023
    Date of Patent: March 12, 2024
    Assignee: Thintronics, Inc.
    Inventors: Tarun Amla, Stefan J. Pastine
  • Patent number: 11860642
    Abstract: Systems and methods disclosed relate to autonomous vehicle technology. A follow vehicle having driving controls for use by humans may be equipped with a wireless transceiver, controller, sensors, and interfaces for use with control systems such that the follow vehicle may be caused to follow the lead vehicle without human interaction with the follow vehicle. The follow vehicle may wirelessly receive information from the lead vehicle regarding position, movement, acceleration or deceleration, steering, or other information relevant to following the lead vehicle. The follow vehicle may include sensors for sensing the position, movement, acceleration, deceleration, steering, or other properties of the lead vehicle. The lead vehicle may be equipped with RF transmitters that provide indicators to the follow vehicle, such that the sensors can more readily sense the lead vehicle. Multiple follow vehicles may be wirelessly linked to form a train that is not mechanically linked.
    Type: Grant
    Filed: March 5, 2021
    Date of Patent: January 2, 2024
    Assignee: AVISHTECH, INC.
    Inventors: Tarun Amla, Jyoti Amla, Keshav Amla
  • Patent number: 11820875
    Abstract: Provided herein is a polymer composition comprising a polyhydroxyamino ether (e.g., a crosslinked polyhydroxyamino ether) and printed circuit boards comprising the same.
    Type: Grant
    Filed: May 12, 2022
    Date of Patent: November 21, 2023
    Assignee: Thintronics, Inc.
    Inventors: Tarun Amla, Stefan J. Pastine
  • Publication number: 20230309221
    Abstract: Described herein are dielectric polymer films and printed circuit boards, such as multilayer and high-density interconnect printed circuit board comprising at least one dielectric polymer film.
    Type: Application
    Filed: January 12, 2023
    Publication date: September 28, 2023
    Applicant: Thintronics, Inc.
    Inventors: Tarun Amla, Stefan J. Pastine
  • Publication number: 20230099234
    Abstract: Provided herein is a polymer composition comprising a polyhydroxyamino ether (e.g., a crosslinked polyhydroxyamino ether) and printed circuit boards comprising the same.
    Type: Application
    Filed: May 12, 2022
    Publication date: March 30, 2023
    Inventors: Tarun Amla, Stefan J. Pastine
  • Patent number: 11596066
    Abstract: Described herein are dielectric polymer films and printed circuit boards, such as multilayer and high-density interconnect printed circuit board comprising at least one dielectric polymer film.
    Type: Grant
    Filed: March 22, 2022
    Date of Patent: February 28, 2023
    Assignee: Thintronics. Inc.
    Inventors: Tarun Amla, Stefan J. Pastine
  • Patent number: 11359062
    Abstract: Provided herein is a polymer composition comprising a polyhydroxyamino ether (e.g., a crosslinked polyhydroxyamino ether) and printed circuit boards comprising the same.
    Type: Grant
    Filed: January 20, 2021
    Date of Patent: June 14, 2022
    Assignee: Thintronics, Inc.
    Inventors: Tarun Amla, Stefan J. Pastine
  • Publication number: 20220153945
    Abstract: The present disclosure provides a polymer matrix composite, and a laminate, a prepreg and a printed circuit board using the same. The polymer matrix composite includes a polymeric resin and a non-woven inorganic material having a dielectric constant of from about 1.5 to about 4.8 and a dissipation factor at 10 GHz below 0.003. The printed circuit board uses the laminate including the polymer matrix as a core layer which is sandwiched between at least two outer layers.
    Type: Application
    Filed: February 1, 2022
    Publication date: May 19, 2022
    Inventors: TARUN AMLA, YEN-HSING WU, YU-CHEN HUANG
  • Patent number: 11155687
    Abstract: Varnish compositions and prepregs and laminates made therefrom wherein the varnish compositions include at least one first epoxy resin and at least one second epoxy resin that includes a bisphenol-A novolac epoxy resin and a harder wherein the at least one first epoxy resin and the at least one second bisphenol-A novolac epoxy resin are present in the varnish at a weight ratio ranging from about 1:1 to about 1:3.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: October 26, 2021
    Assignee: Isola USA Corp.
    Inventors: David Bedner, Tarun Amla
  • Patent number: 11116078
    Abstract: Prepregs and laminates made from resin compositions having a free resin portion and a resin impregnated reinforcing material portion where the resin includes one or more base resins and one or more high Dk materials wherein the one or more high Dk materials are present in the resin composition in an amount sufficient to impart the resin composition with a cured DkW that matches the DkWR of a resin impregnated reinforcing material to which the resin composition is applied to within plus or minus (±) 15%.
    Type: Grant
    Filed: March 3, 2020
    Date of Patent: September 7, 2021
    Inventors: Tarun Amla, Johann R. Schumacher, Sascha Kreuer, Peggy Conn, Stanley E. Wilson
  • Publication number: 20210216082
    Abstract: Systems and methods disclosed relate to autonomous vehicle technology. A follow vehicle having driving controls for use by humans may be equipped with a wireless transceiver, controller, sensors, and interfaces for use with control systems such that the follow vehicle may be caused to follow the lead vehicle without human interaction with the follow vehicle. The follow vehicle may wirelessly receive information from the lead vehicle regarding position, movement, acceleration or deceleration, steering, or other information relevant to following the lead vehicle. The follow vehicle may include sensors for sensing the position, movement, acceleration, deceleration, steering, or other properties of the lead vehicle. The lead vehicle may be equipped with RF transmitters that provide indicators to the follow vehicle, such that the sensors can more readily sense the lead vehicle. Multiple follow vehicles may be wirelessly linked to form a train that is not mechanically linked.
    Type: Application
    Filed: March 5, 2021
    Publication date: July 15, 2021
    Inventors: Tarun Amla, Jyoti Amla, Keshav Amla
  • Patent number: 10983531
    Abstract: Systems and methods disclosed relate to autonomous vehicle technology. A follow vehicle having driving controls for use by humans may be equipped with a wireless transceiver, controller, sensors, and interfaces for use with control systems such that the follow vehicle may be caused to follow the lead vehicle without human interaction with the follow vehicle. The follow vehicle may wirelessly receive information from the lead vehicle regarding position, movement, acceleration or deceleration, steering, or other information relevant to following the lead vehicle. The follow vehicle may include sensors for sensing the position, movement, acceleration, deceleration, steering, or other properties of the lead vehicle. The lead vehicle may be equipped with RF transmitters that provide indicators to the follow vehicle, such that the sensors can more readily sense the lead vehicle. Multiple follow vehicles may be wirelessly linked to form a train that is not mechanically linked.
    Type: Grant
    Filed: April 17, 2018
    Date of Patent: April 20, 2021
    Assignee: AVISHTECH, LLC
    Inventors: Tarun Amla, Jyoti Amla, Keshav Amla
  • Publication number: 20200413536
    Abstract: The present disclosure provides a polymer matrix composite, and a laminate, a prepreg and a printed circuit board using the same. The polymer matrix composite includes a polymeric resin and a non-woven inorganic material having a dielectric constant of from about 1.5 to about 4.8 and a dissipation factor at 10 GHz below 0.003. The printed circuit board uses the laminate including the polymer matrix as a core layer which is sandwiched between at least two outer layers.
    Type: Application
    Filed: September 21, 2020
    Publication date: December 31, 2020
    Inventors: TARUN AMLA, YEN-HSING WU, YU-CHEN HUANG
  • Publication number: 20200315007
    Abstract: Prepregs and laminates made from resin compositions having a free resin portion and a resin impregnated reinforcing material portion where the resin includes one or more base resins and one or more high Dk materials wherein the one or more high Dk materials are present in the resin composition in an amount sufficient to impart the resin composition with a cured DkW that matches the DkWR of a resin impregnated reinforcing material to which the resin composition is applied to within plus or minus (±) 15%.
    Type: Application
    Filed: March 3, 2020
    Publication date: October 1, 2020
    Inventors: Tarun Amla, Johann R. Schumacher, Sascha Kreuer, Peggy Conn, Stanley E. Wilson
  • Publication number: 20200181342
    Abstract: Varnish compositions and prepregs and laminates made therefrom wherein the varnish compositions include at least one first epoxy resin and at least one second epoxy resin that includes a bisphenol-A novolac epoxy resin and a harder wherein the at least one first epoxy resin and the at least one second bisphenol-A novolac epoxy resin are present in the varnish at a weight ratio ranging from about 1:1 to about 1:3.
    Type: Application
    Filed: July 18, 2019
    Publication date: June 11, 2020
    Inventors: David Bedner, Tarun Amla
  • Patent number: 10582614
    Abstract: Prepregs and laminates made from resin compositions having a free resin portion and a resin impregnated reinforcing material portion where the resin includes one or more base resins and one or more high Dk materials wherein the one or more high Dk materials are present in the resin composition in an amount sufficient to impart the resin composition with a cured DkW that matches the DkWR of a resin impregnated reinforcing material to which the resin composition is applied to within plus or minus (±) 15%.
    Type: Grant
    Filed: August 6, 2018
    Date of Patent: March 3, 2020
    Assignee: ISOLA USA CORP.
    Inventors: Tarun Amla, Johann R. Schumacher, Sascha Kreuer, Peggy Conn, Stanley E. Wilson
  • Patent number: 10364332
    Abstract: Varnish compositions and prepregs and laminates made therefrom wherein the varnish compositions include at least one first epoxy resin and at least one second epoxy resin that includes a bisphenol-A novolac epoxy resin and a harder wherein the at least one first epoxy resin and the at least one second bisphenol-A novolac epoxy resin are present in the varnish at a weight ratio ranging from about 1:1 to about 1:3.
    Type: Grant
    Filed: October 17, 2017
    Date of Patent: July 30, 2019
    Assignee: ISOLA USA CORP.
    Inventors: David Bedner, Tarun Amla
  • Publication number: 20190208628
    Abstract: Prepregs and laminates made from resin compositions having a free resin portion and a resin impregnated reinforcing material portion where the resin includes one or more base resins and one or more high Dk materials wherein the one or more high Dk materials are present in the resin composition in an amount sufficient to impart the resin composition with a cured DkW that matches the DkWR of a resin impregnated reinforcing material to which the resin composition is applied to within plus or minus (±) 15%.
    Type: Application
    Filed: August 6, 2018
    Publication date: July 4, 2019
    Inventors: Tarun Amla, Johann R. Schumacher, Sascha Kreuer, Peggy Conn, Stanley E. Wilson
  • Publication number: 20190104612
    Abstract: The present disclosure provides a polymer matrix composite, and a laminate, a prepreg and a printed circuit board using the same. The polymer matrix composite includes a polymeric resin and a non-woven reinforcing material having a dielectric constant of from about 1.5 to about 4.8 and a dissipation factor at 10 GHz below 0.003. The printed circuit board uses the laminate including the polymer matrix as a core layer which is sandwiched between at least two outer layers.
    Type: Application
    Filed: April 18, 2018
    Publication date: April 4, 2019
    Inventor: TARUN AMLA
  • Publication number: 20180354233
    Abstract: Ultrathin copper clad laminates including a fabric sheet material layer having a first planar surface, a second planar surface and an original thickness of from about 10 to about 30 microns and at least one copper foil sheet that is adhered to a planar surface of the fabric sheet material by a cured resin wherein the base laminate has a thickness of from about 1.0 to about 1.75 mils.
    Type: Application
    Filed: January 3, 2018
    Publication date: December 13, 2018
    Inventors: Johann R. Schumacher, Steven M. Schultz, Stanley E. Wilson, Tarun Amla