Abstract: A method is provided for self-provisioning and personalization of a companion device. A primary user device receives, via an activation application for cellular service activation of a companion device, user input to initiate a cellular service activation process for the companion device. The primary user device establishes a local network connection with the companion device and receives from the companion device an embedded universal integrated circuit card (eUICC) identifier. The primary user device forwards, to a network device in a service provider network, the eUICC identifier along with an identifier for the primary user device. The primary user device receives, from the network device, an activation code for the eUICC and forwards to the companion device the activation code. The activation code automatically causes the companion device to initiate a profile download request for an eUICC to be included with a new line of service under a subscriber account associated with the primary user device.

Abstract: A method including determining whether a subscriber identification profile (SIDP) is stored within a UE; sending an initial attach request along with a default network access key to a MME, upon determining that the SIDP is not stored; receiving a first authorization to attach to the network in response to the initial attach request, the first authorization restricts connectivity of the UE to an M2M activation system accessed by a dedicated APN associated with the default network access key; receiving, from a subscription management system, a SIDP generated by the M2M activation system; detaching from the M2M activation system and the network; sending a second attach request to the network based on the received SIDP; and receiving a second authorization to the network in response to the second attach request; the second authorization provides unrestricted APN connectivity and access to services associated with the subscriber identification profile.

Abstract: A third-party data balance transfer system enables a user of a wireless service network to transfer a data balance to another user of the wireless service network. For example, a third-party data balance transfer system may provide an interface to receive a request from a donor to transfer a data balance to a recipient. A third-party data balance transfer system may verify that the donor is eligible to transfer a data balance, and that the recipient is eligible to receive data. The third-party data balance transfer system may forward a message to the recipient when the eligibility of the donor and recipient are verified. The message may include instructions that direct the recipient to perform certain actions to activate the transfer a data balance.

Abstract: A third-party data balance transfer system enables a user of a wireless service network to transfer a data balance to another user of the wireless service network. For example, a third-party data balance transfer system may provide an interface to receive a request from a donor to transfer a data balance to a recipient. A third-party data balance transfer system may verify that the donor is eligible to transfer a data balance, and that the recipient is eligible to receive data. The third-party data balance transfer system may forward a message to the recipient when the eligibility of the donor and recipient are verified. The message may include instructions that direct the recipient to perform certain actions to activate the transfer a data balance.

Abstract: A Ball Grid Array (BGA) integrated circuit package having (i) an additional dedicated ground ring on the package substrate which provides a reduced area return current loop path to reduce wire bond inductance; and/or (ii) ground wires positioned between adjacent input/output wires on the substrate which provide additional transient current paths among the input/output wires for improved characteristic impedance and cross talk control.

Abstract: A package substrate is provided with a side/edge-mounted decoupling capacitor that can provide substantially instant power or control simultaneous switching noise (SSN) associated with a semiconductor device package. A fabrication method for such a package substrate is also provided. Further, a semiconductor device package that includes such a package substrate is provided. According to various embodiments, the decoupling capacitor is connected to edges or sides of a power plane and a ground plane in the package substrate for connection via the semiconductor device package's power delivery system to a power source or component.

Abstract: A semiconductor package including a universal substrate with interior pads, peripheral pads, and substrate traces positioned between the interior pads and the peripheral pads. The interior pads are configured for electrical interface with a first semiconductor chip. The peripheral pads are configured for electrical interface with a second semiconductor chip that is larger than the first semiconductor chip. By providing a universal substrate that can accommodate multiple die sizes, package design time and costs can thus be reduced.