Abstract: In one embodiment, heat exchange device is provided, which includes a printed circuit board with a multichip module mounted on the printed circuit board. A cold plate is positioned on the multichip module and a bolster plate on a side of the printed circuit board opposite the cold plate. A fastener secures the bolster plate and the cold plate with the printed circuit board, and, urges the cold plate against the multichip module and the multichip module against the printed circuit board. The cold plate may form a lid to the multichip module. The multichip module may include a pin electronics die abutting the cold plate. In some embodiments the bolster plate is a compression plate.

Abstract: In at least one embodiment, the present invention is a heat exchange apparatus which includes at least one heat exchanger, an intake manifold, and at least one multichip module. Where the intake manifold is in fluid communication with each heat exchanger and where the intake manifold is capable of providing the heat exchange medium separately to each heat exchanger. Where the each multichip module is positioned at least adjacent to at least one heat exchanger, such that heat can transfer between each multichip module and at least one heat exchanger.

Abstract: In at least one embodiment, the present invention is a heat exchange apparatus which includes at least one heat exchanger, an intake manifold, and at least one multichip module. Where the intake manifold is in fluid communication with each heat exchanger and where the intake manifold is capable of providing the heat exchange medium separately to each heat exchanger. Where the each multichip module is positioned at least adjacent to at least one heat exchanger, such that heat can transfer between each multichip module and at least one heat exchanger.