Patents by Inventor Tasha E. Lopez

Tasha E. Lopez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Compressible films surrounding solder connectors
    Patent number: 7566649
    Abstract: Disclosed is a method of forming an integrated circuit structure that forms lead-free connectors on a device, surrounds the lead-free connectors with a compressible film, connects the device to a carrier (the lead-free connectors electrically connect the device to the carrier), and fills the gaps between the carrier and the device with an insulating underfill.
    Type: Grant
    Filed: September 20, 2007
    Date of Patent: July 28, 2009
    Assignee: International Business Machines Corporation
    Inventors: William E. Bernier, Tien-Jen Cheng, Marie S. Cole, David E. Eichstadt, Mukta G. Farooq, John A. Fitzsimmons, Lewis S. Goldmann, John U. Knickerbocker, Tasha E. Lopez, David J. Welsh
  • Low stress conductive polymer bump
    Patent number: 7442878
    Abstract: Disclosed is a laminated (or non-laminated) conductive interconnection for joining an integrated circuit device to a device carrier, where the conductive interconnection comprises alternating metal layers and polymer layers. In addition, the polymer can include dendrites, metal projections from the carrier or device, and/or micelle brushes on the outer portion of the polymer. The polymer layers include metal particles and the alternating metal layers and polymer layers form either a cube-shaped structure or a cylinder-shaped structure.
    Type: Grant
    Filed: October 5, 2006
    Date of Patent: October 28, 2008
    Assignee: International Business Machines Corporation
    Inventors: William E. Bernier, Marie S. Cole, Mukta G. Farooq, John U. Knickerbocker, Tasha E. Lopez, Roger A. Quon, David J. Welsh
  • Compressible films surrounding solder connectors
    Patent number: 7332821
    Abstract: Disclosed is a method of forming an integrated circuit structure that forms lead-free connectors on a device, surrounds the lead-free connectors with a compressible film, connects the device to a carrier (the lead-free connectors electrically connect the device to the carrier), and fills the gaps between the carrier and the device with an insulating underfill.
    Type: Grant
    Filed: August 20, 2004
    Date of Patent: February 19, 2008
    Assignee: International Business Machines Corporation
    Inventors: William E. Bernier, Tien-Jen Cheng, Marie S. Cole, David E. Eichstadt, Mukta G. Farooq, John A. Fitzsimmons, Lewis S. Goldmann, John U. Knickerbocker, Tasha E. Lopez, David J. Welsh
  • Low stress conductive polymer bump
    Patent number: 7170187
    Abstract: Disclosed is a laminated (or non-laminated) conductive interconnection for joining an integrated circuit device to a device carrier, where the conductive interconnection comprises alternating metal layers and polymer layers. In addition, the polymer can include dendrites, metal projections from the carrier or device, and/or micelle brushes on the outer portion of the polymer. The polymer layers include metal particles and the alternating metal layers and polymer layers form either a cube-shaped structure or a cylinder-shaped structure.
    Type: Grant
    Filed: August 31, 2004
    Date of Patent: January 30, 2007
    Assignee: International Business Machines Corporation
    Inventors: William E. Bernier, Marie S. Cole, Mukta G. Farooq, John U. Knickerbocker, Tasha E. Lopez, Roger A. Quon, David J. Welsh