Patents by Inventor Tasi-Tung Kuo

Tasi-Tung Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Structure of electrolessly palladium and gold plated films and process for making the same, assembled structure of palladium and gold plated films bonded with copper or copper-palladium wire and assembling process therefore
    Publication number: 20120186852
    Abstract: Disclosed is a structure of electrolessly palladium (Pd) and gold (Au) plated films on a bonding pad, comprising a Pd plated layer on the bonding pad; and an Au plated layer on the Pd plated layer. Also disclosed is an assembled structure formed of the electrolessly Pd—Au plated films wire-bonded with a copper (Cu) or Pd—Cu wire to the Au plated layer. In addition, a process for producing the structure of the electrolessly Pd—Au plated films and an assembling process for the assembled structure are disclosed. According to the present invention, the Pd plated layer is used to replace the conventional nickel layer so as to enhance the wire-bonding strength between the Cu or Pd—Cu wire and the bonding pad.
    Type: Application
    Filed: December 15, 2011
    Publication date: July 26, 2012
    Applicant: Taiwan Uyemura Co., Ltd.
    Inventors: Ming-Hung Lin, Tasi-Tung Kuo, Kuan-Cheng Liu, Ying-Chien Lee, Kuo-Pin Chiu