Abstract: A drive unit includes: an inverter; an electric motor that has a first winding connected to an output part of the inverter and a second winding connected to the first winding; a first semiconductor switch that has a first end connected to the first winding and a second end connected to the second winding; a second semiconductor switch that has a first end and a second end connected to the first winding and the first semiconductor switch; and a snubber circuit that is provided between the second end of the first semiconductor switch and the first end of the second semiconductor switch and has a capacitor and a diode.

Abstract: A drive unit includes: an inverter; an electric motor that has a first winding connected to an output part of the inverter and a second winding connected to the first winding; a first semiconductor switch that has a first end connected to the first winding and a second end connected to the second winding; a second semiconductor switch that has a first end and a second end connected to the first winding and the first semiconductor switch; and a snubber circuit that is provided between the second end of the first semiconductor switch and the first end of the second semiconductor switch and has a capacitor and a diode.

Abstract: The present power converter includes a power conversion semiconductor device, an electrode connection conductor which electrically connects multiple electrodes having the same potential, and also has a generally flat upper surface for electrically connecting to an exterior portion, and a sealing material provided so as to cover the power conversion semiconductor device, and also to expose the generally flat upper surface of the electrode connection conductor.

Abstract: A wiring board includes a conductor plate including a wiring portion and an electrode portion connected to a power conversion semiconductor element, a liquid-cooling pipe mounted near the conductor plate and causing a cooling liquid to be supplied therethrough, and an insulating resin material arranged at least between the conductor plate and the liquid-cooling pipe.

Abstract: The present invention provides a power module in which a first semiconductor device disposed on a first substrate and a second semiconductor device disposed on a second substrate are disposed at symmetrical positions with a third substrate interposed therebetween.

Abstract: A wiring board includes a conductor plate including a wiring portion and an electrode portion connected to a power conversion semiconductor element, a liquid-cooling pipe mounted near the conductor plate and causing a cooling liquid to be supplied therethrough, and an insulating resin material arranged at least between the conductor plate and the liquid-cooling pipe.

Abstract: This power converter includes a power-conversion semiconductor element, an electrode conductor having a substantially flat upper end surface, and a sealant. The sealant allows the substantially flat upper end surface of the electrode conductor to be exposed at an upper surface of the sealant, and provides electrical connection with an external device at the upper end surface of the exposed electrode conductor.

Abstract: The present power converter includes a power conversion semiconductor device, an electrode connection conductor which electrically connects multiple electrodes having the same potential, and also has a generally flat upper surface for electrically connecting to an exterior portion, and a sealing material provided so as to cover the power conversion semiconductor device, and also to expose the generally flat upper surface of the electrode connection conductor.

Abstract: The present invention provides a power module in which a first semiconductor device disposed on a first substrate and a second semiconductor device disposed on a second substrate are disposed at symmetrical positions with a third substrate interposed therebetween.