Abstract: In a processing apparatus, a vibration detecting unit includes a light source, an interference unit configured to apply light emitted from the light source to a measurement target member and generate an interference pattern image. A control unit includes a storage section configured to store a first interference pattern image captured at a predetermined timing by the imaging unit and a second interference pattern image captured at a timing different from the timing of the first interference pattern image by the imaging unit, a comparing section configured to compare the first interference pattern image and the second interference pattern image stored in the storage section with each other, and a vibration detecting section configured to detect vibration on the basis of the first interference pattern image and the second interference pattern image compared with each other by the comparing section.

Abstract: A processing apparatus includes a touch panel that accepts an operator's operation, and a control unit that drives each of mechanisms by selection by the operator of an operation button displayed on the touch panel. The touch panel is configured such as to be able to display a progress confirmation screen on which a plurality of operation buttons are aligned, and displays the operation buttons which are selected by the operator and the works relevant to which have been completed and the operation buttons the works relevant to which have not been completed by the operator in a discriminable manner.

Abstract: In a method of controlling a processing apparatus having a touch-panel display: when an operator touches the display with a finger and moves the finger in an X-axis direction, a chuck table or a processing unit is moved in the X-axis direction for a distance depending on the distance that the finger is moved, and an image of a portion of a workpiece is moved in the X-axis direction on the display; and when the operator touches the display with a finger and moves the finger in a Y-axis direction, the chuck table or the processing unit is moved in the Y-axis direction for a distance depending on the distance that the finger is moved, and the image of the portion of the workpiece is moved in the Y-axis direction on the display.

Abstract: A method of detecting a spot shape of a pulsed laser beam, includes applying a pulsed laser beam having a wavelength absorbable by an inspection wafer held on a chuck table continuously to the inspection wafer with a focused point on an upper surface of the inspection wafer thereby to form a plurality of laser spots on the upper surface of the inspection wafer. An image of the laser spots is captured, and profiles of shapes of the laser spots are extracted from the captured image of the laser spots. A degree of similarity between the captured image and the profile of an ideal laser spot shape is calculated and stored in a memory. The shapes of the laser spots are found to be improper if the calculated degree of similarity is lower than a threshold value.

Abstract: In a method of controlling a processing apparatus having a touch-panel display: when an operator touches the display with a finger and moves the finger in an X-axis direction, a chuck table or a processing unit is moved in the X-axis direction for a distance depending on the distance that the finger is moved, and an image of a portion of a workpiece is moved in the X-axis direction on the display; and when the operator touches the display with a finger and moves the finger in a Y-axis direction, the chuck table or the processing unit is moved in the Y-axis direction for a distance depending on the distance that the finger is moved, and the image of the portion of the workpiece is moved in the Y-axis direction on the display.

Abstract: A method of detecting a spot shape of a pulsed laser beam, includes applying a pulsed laser beam having a wavelength absorbable by an inspection wafer held on a chuck table continuously to the inspection wafer with a focused point on an upper surface of the inspection wafer thereby to form a plurality of laser spots on the upper surface of the inspection wafer. An image of the laser spots is captured, and profiles of shapes of the laser spots are extracted from the captured image of the laser spots. A degree of similarity between the captured image and the profile of an ideal laser spot shape is calculated and stored in a memory. The shapes of the laser spots are found to be improper if the calculated degree of similarity is lower than a threshold value.