Abstract: A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.

Abstract: The alignment method includes detecting an extending direction of a groove formed on a wafer, based on an image of the wafer picked up by a camera, and performing alignment so as to adjust the extending direction of the groove to be parallel to an array direction of pixels of the camera by relatively rotating the wafer and the camera.

Abstract: An alert apparatus starts alerting a driver of a host vehicle, when an oncoming vehicle, that is an other vehicle traveling in an oncoming lane with respect to a traveling lane in which the host vehicle is traveling so as to approach the host vehicle and that is predicted to pass through on a specific direction side with respect to a current position of the host vehicle, is present, a turn signal indicator of the host vehicle corresponding to the specific direction side is being operated, and it is likely that the host vehicle starts turning to the specific direction side.

Abstract: A measuring device includes a table on which a workpiece is to be mounted, a first imaging unit configured to image the surface of the workpiece on the table, a second imaging unit configured to image the surface of the workpiece on the table, the second imaging unit allowing measurement of a shape and/or roughness of the surface of the workpiece according to a plurality of images taken by scanning the surface of the workpiece in a Z-axis direction, and an image processing unit configured to process the image of the surface of the workpiece taken by the first imaging unit and the plurality of images taken by scanning the surface of the workpiece in the Z-axis direction by the second imaging unit, so as to measure the shape and/or the roughness of the surface of the workpiece.

Abstract: A pillar delivery method is a method for delivering a plurality of pillars onto a substrate, including a glass panel, to manufacture a glass panel unit. The pillar delivery method includes an irradiation step, a holding step, and a mounting step. The irradiation step includes setting, over a holder, a sheet for use to form pillars and irradiating the sheet with a laser beam to punch out the plurality of pillars. The holding step includes having the plurality of pillars, which have been punched out of the sheet, held by the holder. The mounting step includes picking up some or all of the plurality of pillars from the holder and mounting the pillars onto the substrate.

Abstract: A method for manufacturing a glass panel unit includes an assembling step, a bonding step, a gas exhausting step, a sealing step, and an activating step. The bonding step includes melting a peripheral wall in a baking furnace at a first predetermined temperature to hermetically bond a first glass pane and a second glass pane together with the peripheral wall thus melted. The gas exhausting step includes exhausting a gas from an internal space through an exhaust port in the baking furnace to turn the internal space into a vacuum space. The sealing step includes locally heating to a temperature higher than a second predetermined temperature, and thereby melting, either a port sealing material or an exhaust pipe to seal the exhaust port and thereby obtain a work in progress. The activating step includes activating a gas adsorbent after the sealing step to obtain a glass panel unit.

Abstract: A console box includes a box main body having an upper opening, and a lid that opens and closes the upper opening. The lid includes a lid main body, a pivot, and an operation portion. The pivot is provided at one side in a width direction of the lid main body and couples the lid main body to the box main body. The operation portion is provided to correspond to the pivot, and decouples the pivot and the box main body from each other when operated. The lid is configured to be pivotal about the pivot and to be detached from the box main body when the operation portion is operated.

Abstract: A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.

Abstract: A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.

Abstract: A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.

Abstract: A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.

Abstract: A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.

Abstract: A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.

Abstract: A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.

Abstract: A fluxmeter includes an application unit for applying a magnetic field, a superconducting quantum interference element and a flux transmitting circuit. The flux transmitting circuit includes a pickup coil formed of a superconducting print coil and a core for the pickup coil. The core is formed of a soft magnetic material. The core serves to suppress the leakage of magnetic flux to magnetically couple the pickup coil and the superconducting quantum interference element efficiently to improve the sensitivity and resolution of the fluxmeter. The pickup coil may be manufactured by photolithography, sputtering, laser beam deposition, MBE deposition, MOCVD or spray pyrolysis.

Abstract: On the basis of a finding that a magnetic hysteresis of a metal material, among magnetization characteristics changing with secular degradation of the metal material, shows a clear correspondence with the degree of degradation of the metal material, a change in such a magnetization characteristic is measured to estimate the degree of secular degradation of the metal material. In a typical embodiment, a superconducting quantum interference device is used to detect the magnetization characteristic of a measuring object. According to the present invention, the degree of embrittlement of a metal material used in an environment of high temperatures can be quickly detected in a non-destructive fashion so that the danger of brittle fracture of the metal material can be reliably prevented.

Abstract: A method and apparatus for inspecting the change in a water quality in terms of the change in a corrosion rate by detecting the capacity change between opposed electrodes due to the corrosion of electrode surfaces. As a result, the water quality can be continuously monitored over a long time while leaving the electrodes in the water to be inspected. Thus, the method and apparatus are suited for controlling the water quality especially in an atomic reactor vessel.

Abstract: On the basis of a finding that a magnetic hysteresis of a metal material, among magnetization characteristics changing with secular degradation of the metal material, shows a clear correspondence with the degree of degradation of the metal material, a change in such a magnetization characteristic is measured to estimate the degree of secular degradation of the metal material, In a typical embodiment, a superconducting quantum interference device is used to detect the magnetization characteristic of a measuring object. According to the present invention, the degree of embrittlement of a metal material used in an environment of high temperatures can be quickly detected in a non-destructive fashion so that the danger of brittle fracture of the metal material can be reliably prevented.

Abstract: Measurement of a physical property such as coercive force of a member to be inspected is performed at a plurality of locations in one region of the member. Similar measurement is performed in a plurality of different regions of the member and a maximum or minimum value (extreme value) is determined for each of the regions. On the basis of the extreme values thus determined, a recurrence period is determined in accordance with an extreme value statistic theory with the aid of a computer, whereon an estimated maximum value of the physical property of the member as a whole is determined from the recurrence period. On the basis of the estimated maximum value, the degree of deterioration of the member is predicted by the computer by consulting the data indicating the previously determined relation between the physical property and the degree of deterioration.

Abstract: A method for improving residual stress in a circumferential weld zone of a piping and the like which includes preventing deformation of the weld zone, and causing a local expansion or contraction of a portion of the piping axially spaced from the weld zone thereby effecting a plastic working so as to increase or decrease the diameter of piping. The method can effectively be applied to apparatus and pipe system which are used in a corrosive environment and under action of a static or dynamic outer load.