Abstract: A chemical formulation having at least one solvent and a chemical having the structure of Formula (I): where R includes at least one aromatic moiety, and X and X? may both or independently include an aromatic moiety, an aliphatic moiety, or a hydrogen.

Abstract: Chemical compositions are provided having the structure of Formula (I): where R includes at least one aromatic moiety, and X and X? may both or independently include an aromatic moiety, an aliphatic moiety, or a hydrogen. Additionally, chemical formulations are provided which include the chemical composition having the structure of Formula (I) and at least one solvent.

Abstract: Chemical compositions are provided having the structure of Formula (I): where R includes at least one aromatic moiety, and X and X? may both or independently include an aromatic moiety, an aliphatic moiety, or a hydrogen. Additionally, chemical formulations are provided which include the chemical composition having the structure of Formula (I) and at least one solvent.

Abstract: Method embodiments for producing a fiber-reinforced epoxy composite comprise providing a mold defining a shape for a composite, applying a fiber reinforcement over the mold, covering the mold and fiber reinforcement thereon in a vacuum enclosure, performing a vacuum on the vacuum enclosure to produce a pressure gradient, insulating at least a portion of the vacuum enclosure with thermal insulation, infusing the fiber reinforcement with a reactive mixture of uncured epoxy resin and curing agent under vacuum conditions, wherein the reactive mixture of uncured epoxy resin and curing agent generates exothermic heat, and producing the fiber-reinforced epoxy composite having a glass transition temperature of at least about 100° C.

Abstract: Embodiments of a reversible thermoset adhesive formed by incorporating thermally-reversible cross-linking units and a method for making the reversible thermoset adhesive are provided. One approach to formulating reversible thermoset adhesives includes incorporating dienes, such as furans, and dienophiles, such as maleimides, into a polymer network as reversible covalent cross-links using Diels Alder cross-link formation between the diene and dienophile. The chemical components may be selected based on their compatibility with adhesive chemistry as well as their ability to undergo controlled, reversible cross-linking chemistry.

Abstract: Method embodiments for producing a fiber-reinforced epoxy composite comprise providing a mold defining a shape for a composite, applying a fiber reinforcement over the mold, covering the mold and fiber reinforcement thereon in a vacuum enclosure, performing a vacuum on the vacuum enclosure to produce a pressure gradient, insulating at least a portion of the vacuum enclosure with thermal insulation, infusing the fiber reinforcement with a reactive mixture of uncured epoxy resin and curing agent under vacuum conditions, wherein the reactive mixture of uncured epoxy resin and curing agent generates exothermic heat, and producing the fiber-reinforced epoxy composite having a glass transition temperature of at least about 100° C.

Abstract: The presently disclosed formula utilizes a composition of a rigid, semi-crystalline polymer, such as polybutylene terephthalate, and an amorphous polymer, such as poly(vinyl acetate), to create a thermoplastic shape memory polymer that can be processed through methods such as extrusion and injection molding, which require high heat. The polybutylene terephthalate acts as a cross-linker for the poly(vinyl acetate), therefore the thermoplastic shape memory polymer that is created has a much higher melting point and greater heat stability than other shape memory polymers.

Abstract: Rigid-rod monomers and polymers are provided for use in applications such as rapid prototyping, composites and adhesives. The monomers can be photocured through the end groups and then thermally post cured through the acetylene groups. The result is a highly crosslinked polymer having an effective glass transition temperature well above 200° C.

Abstract: Rigid-rod monomers and polymers are provided for use in applications such as rapid prototyping, composites and adhesives. The monomers can be photocured through the end groups and then thermally post cured through the acetylene groups. The result is a highly crosslinked polymer having an effective glass transition temperature well above 200° C.