Abstract: Integrated circuits and methods of producing such integrated circuits are provided. In an exemplary embodiment, a method of producing an integrated circuit includes determining a guard ring width within an integrated circuit design layout, where a guard ring with the guard ring width surrounds an active area in the integrated circuit design layout. A deep trench location is calculated for replacing the guard ring, where the deep trench location depends on the guard ring width. The guard ring in the integrated circuit design layout is replaced with a deep trench having the deep trench location. The deep trench is formed within a substrate at the deep trench location, where the deep trench surrounds the active area.

Abstract: A design, device, system and process for placing slots in active regions (e.g., metal areas). Embodiments of the present invention improve the planarization of metal areas (e.g., lines) and insulators by reducing depressions (e.g., dishing) in the metal areas by including symmetric or square slots inside selected wide metal lines, by adhering to a set of placement rules. Embodiments reduce dishing in copper dual damascene structures. Embodiments reduce data processing requirements for designing and arranging the layout of IC devices and the slots.

Abstract: A design, device, system and process for placing slots in active regions (e.g., metal areas). Embodiments of the present invention improve the planarization of metal areas (e.g., lines) and insulators by reducing depressions (e.g., dishing) in the metal areas by including symmetric or square slots inside selected wide metal lines, by adhering to a set of placement rules. Embodiments reduce dishing in copper dual damascene structures. Embodiments reduce data processing requirements for designing and arranging the layout of IC devices and the slots.