Patents by Inventor Tat Wing Lee

Tat Wing Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for thin die detachment
    Patent number: 8026126
    Abstract: The invention provides an apparatus and method for thin die detachment involving the use of a collet for holding and detaching a die mounted on an adhesive surface of an adhesive film. An ejector device comprising a plurality of ejector pins is employed to partially delaminate said die from the adhesive surface for detachment by the collet. Each ejector pin is operative to contact and raise a second surface of the film opposite the adhesive surface at a position substantially at a corner of the die to be detached within a predetermined distance from the edges of said die.
    Type: Grant
    Filed: July 28, 2003
    Date of Patent: September 27, 2011
    Assignee: ASM Assembly Automation Ltd
    Inventors: Yiu Ming Cheung, Chi Ming Chong, Tat Wing Lee, Ka Lok Leung
  • Apparatus and method for thin die detachment
    Publication number: 20040115904
    Abstract: The invention provides an apparatus and method for thin die detachment involving the use of a collet for holding and detaching a die mounted on an adhesive surface of an adhesive film. An ejector device comprising a plurality of ejector pins is employed to partially delaminate said die from the adhesive surface for detachment by the collet. Each ejector pin is operative to contact and raise a second surface of the film opposite the adhesive surface at a position substantially at a corner of the die to be detached within a predetermined distance from the edges of said die.
    Type: Application
    Filed: July 28, 2003
    Publication date: June 17, 2004
    Inventors: Yiu Ming Cheung, Chi Ming Chong, Tat Wing Lee, Ka Lok Leung