Abstract: Disclosed are semiconducting or conducting organic small molecules, oligomers, and polymers that are based on a donor-acceptor strategy featuring heavy group 16 elements (Se and Te) at the core of acceptor unit(s).

Abstract: Disclosed are semiconducting or conducting organic small molecules and oligomers that contain a central, electron rich, functionalized dihydrodicyclopentylanthracene core (or electron donor core) that is connected to at least one or two comparatively electron deficient monomeric unit or units (or electron acceptor units) that feature group 16 heteroatoms sulfur, selenium or tellurium or combinations thereof. Multiple electron rich cores can be linked together through one or more alkynyl linkages.

Abstract: Disclosed are semiconducting or conducting organic small molecules, oligomers, and polymers that are based on a donor-acceptor strategy featuring heavy group 16 elements (Se and Te) at the core of acceptor unit(s).

Abstract: Disclosed are semiconducting or conducting organic small molecules and oligomers that contain a central, electron rich, functionalized dihydrodicyclopentylanthracene core (or electron donor core) that is connected to at least one or two comparatively electron deficient monomeric unit or units (or electron acceptor units) that feature group 16 heteroatoms sulfur, selenium or tellurium or combinations thereof. Multiple electron rich cores can be linked together through one or more alkynyl linkages.

Abstract: Disclosed are methods for making conductive materials. The methods can be used to make transparent, opaque, or reflective electrodes by using the same materials and equipment but varying the processing conditions or amounts of materials used. The methods can include: (a) providing a substrate comprising a first surface and an opposite second surface, wherein micro- or nanostructures are disposed on at least a portion of the first surface, and wherein the first surface is not pre-conditioned to increase attachment between the micro- or nanostructures and the substrate; (b) applying heat to heat the substrate surface to a temperature that is greater than the glass transition temperature or the Vicat softening temperature of the substrate and less than the melting point of the substrate; (c) applying pressure such that the substrate and the micro- or nanostructures are pressed together; and (d) removing the pressure to obtain the conductive material.