Abstract: A chip mounting apparatus includes an X-Y robot having a chip mounting head and a substrate position recognizing camera both positioned in an upper arm of the robot apparatus. The chip mounting head is for holding a chip to be mounted. A substrate holding member is for holding a chip mounting substrate and is disposed below the robot. A chip position recognizing camera is also disposed below the robot. The positional relationship between the chip mounting head and the substrate position recognizing camera is equivalent to the positional relationship between a chip mounting position of the chip mounting substrate and the chip position recognizing camera.

Abstract: A first distance measurement device for measuring a height of the surface of a substrate with respect to a reference plane of a drawing machine which drawing a pattern on the substrate by issuing paste-like material from a nozzle is mounted on a revolution member rotating about the nozzle, and the first distance measurement device is always positioned in the moving direction of the nozzle and measures a height of the surface of the substrate at a slightly preceding position from the nozzle, on the other band a second distance measurement device substantially measures a height of the nozzle from the reference plane, thus, a position of the nozzle is controlled on the basis of both the measured result, and an interval between the nozzle and the surface of the substrate is kept within a predetermined value.