Patents by Inventor Tateo Nakashima

Tateo Nakashima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and device for mounting electronic component
    Patent number: 6708402
    Abstract: In a component mounting device in which a component is picked up and mounted on a circuit board by a suction nozzle, an amount of displacement between a center position of the suction nozzle 11 and that of the picked-up component 12 is measured, and when it is larger than a preliminarily determined value, a warning is generated indicating that the parts cassette 3 from which the component 12 has been fed is in abnormal condition, as well as the mounting action of the component 12 is stopped.
    Type: Grant
    Filed: March 15, 2001
    Date of Patent: March 23, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masato Hirano, Yoshinori Sakai, Tateo Nakashima
  • Method and device for mounting electronic component
    Patent number: 6493931
    Abstract: In a component mounting device in which a component is picked up and mounted on a circuit board by a suction nozzle, an amount of displacement between a center position of the suction nozzle 11 and that of the picked-up component 12 is measured, and when it is larger than a preliminarily determined value, a warning is generated indicating that the parts cassette 3 from which the component 12 has been fed is in abnormal condition, as well as the mounting action of the component 12 is stopped.
    Type: Grant
    Filed: March 15, 2001
    Date of Patent: December 17, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masato Hirano, Yoshinori Sakai, Tateo Nakashima
  • Method and device for mounting electronic component
    Publication number: 20010010498
    Abstract: In a component mounting device in which a component is picked up and mounted on a circuit board by a suction nozzle, an amount of displacement between a center position of the suction nozzle 11 and that of the picked-up component 12 is measured, and when it is larger than a preliminarily determined value, a warning is generated indicating that the parts cassette 3 from which the component 12 has been fed is in abnormal condition, as well as the mounting action of the component 12 is stopped.
    Type: Application
    Filed: March 15, 2001
    Publication date: August 2, 2001
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masato Hirano, Yoshinori Sakai, Tateo Nakashima
  • Method and device for mounting electronic component
    Publication number: 20010010120
    Abstract: In a component mounting device in which a component is picked up and mounted on a circuit board by a suction nozzle, an amount of displacement between a center position of the suction nozzle 11 and that of the picked-up component 12 is measured, and when it is larger than a preliminarily determined value, a warning is generated indicating that the parts cassette 3 from which the component 12 has been fed is in abnormal condition, as well as the mounting action of the component 12 is stopped.
    Type: Application
    Filed: March 15, 2001
    Publication date: August 2, 2001
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masato Hirano, Yoshinori Sakai, Tateo Nakashima
  • Method and device for mounting electronic component
    Patent number: 6230393
    Abstract: In a component mounting device in which a component is picked up and mounted on a circuit board by a suction nozzle, an amount of displacement between a center position of the suction nozzle 11 and that of the picked-up component 12 is measured, and when it is larger than a preliminarily determined value, a warning is generated indicating that the parts cassette 3 from which the component 12 has been fed is in abnormal condition, as well as the mounting action of the component 12 is stopped.
    Type: Grant
    Filed: July 2, 1998
    Date of Patent: May 15, 2001
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masato Hirano, Yoshinori Sakai, Tateo Nakashima
  • Method and device for mounting electronic component
    Patent number: RE44384
    Abstract: In a component mounting device in which a component is picked up and mounted on a circuit board by a suction nozzle, an amount of displacement between a center position of the suction nozzle 11 and that of the picked-up component 12 is measured, and when it is larger than a preliminarily determined value, a warning is generated indicating that the parts cassette 3 from which the component 12 has been fed is in abnormal condition, as well as the mounting action of the component 12 is stopped.
    Type: Grant
    Filed: March 22, 2006
    Date of Patent: July 23, 2013
    Assignee: Panasonic Corporation
    Inventors: Masato Hirano, Yoshinori Sakai, Tateo Nakashima