Patents by Inventor Tatero Takai

Tatero Takai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing printed wiring board
    Patent number: 5277787
    Abstract: A method of manufacturing printed wiring board is disclosed. The method comprising steps of providing a double-sided copper clad laminate; embedding a conductive ink into a through hole provided in the copper clad laminate; subjecting the opposing surfaces of the double-sided copper clad laminate to copper electroplating to form a copper plated layer after curing the conductive ink under the given conditions; providing a circuit for displacing component mounting lands onto the copper plated layer directly over the cured conductive ink with the use of a dry film or ink for forming other circuit; and forming a printed wiring circuit with the material removing treatment.
    Type: Grant
    Filed: October 28, 1992
    Date of Patent: January 11, 1994
    Assignee: Nippon CMK Corp.
    Inventors: Yasuaki Otani, Fusao Birukawa, Tatero Takai