Patents by Inventor Tatjana ASENOV

Tatjana ASENOV has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11978967
    Abstract: UWB Antenna comprising: a first substrate layer (10); a second substrate layer (20); a conductive ground layer (300) arranged on a first side of the first substrate layer and connected to a ground terminal; a first conductive layer (100) arranged between the first substrate layer (10) and the second substrate layer (20), wherein a central portion (140) of the first conductive layer (100) is connected to the feed terminal (3), wherein the first conductive layer (100) has a shape with a plurality of arms extending radially from the central portion (140), wherein the plurality of arms (110, 120, 130) is connected in its distal portion (111, 121, 131) with the ground layer (300); a second conductive layer (200) arranged on a second side of the second substrate layer (20, 20?), wherein the layers (10, 20, 100, 200, 300) are realised with a multilayer circuit board.
    Type: Grant
    Filed: August 3, 2022
    Date of Patent: May 7, 2024
    Assignee: INFINEON TECHNOLOGIES SWITZERLAND AG
    Inventors: David Barras, Tatjana Asenov
  • Publication number: 20230043116
    Abstract: UWB Antenna comprising: a first substrate layer (10); a second substrate layer (20); a conductive ground layer (300) arranged on a first side of the first substrate layer and connected to a ground terminal; a first conductive layer (100) arranged between the first substrate layer (10) and the second substrate layer (20), wherein a central portion (140) of the first conductive layer (100) is connected to the feed terminal (3), wherein the first conductive layer (100) has a shape with a plurality of arms extending radially from the central portion (140), wherein the plurality of arms (110, 120, 130) is connected in its distal portion (111, 121, 131) with the ground layer (300); a second conductive layer (200) arranged on a second side of the second substrate layer (20, 20?), wherein the layers (10, 20, 100, 200, 300) are realised with a multilayer circuit board.
    Type: Application
    Filed: August 3, 2022
    Publication date: February 9, 2023
    Applicant: 3DB ACCESS
    Inventors: David BARRAS, Tatjana ASENOV