Abstract: A coil assembly for use in an optical or a magneto-optical data storage system includes an undercoat and an electrically conductive coil formed of a length of electrical conductor and deposited and secured to the undercoat by means of available wafer processing techniques. The conductive coil terminates in two bonding pads for providing electrical connection to the coil, such that the coil is capable of sustaining an electrical current in excess of approximately 300 mA. The coil is also capable of generating a vertical magnetic field intensity greater than, or equal to approximately 200 Oersteds, and has a resistance of less than, or equal to approximately 2 ohms. The coil assembly further includes a yoke, and an insulation layer which encapsulates at least part of the conductor. The conductor is formed of a plurality of multi-layered turns, such that a first layer is connected to one contact pad and is looped helically, inwardly, and terminates in an innermost turn with a terminal end.

Abstract: The object of the present invention is to improve the bonding characteristics and peeling resistance of the insulating film formed on the substrate of a thin-film magnetic head.An insulating film consisting of Al.sub.2 O.sub.3 is formed by sputtering on the surface of an ALTIC substrate in which numerous recesses and projections (in which the projecting portions consist of TiC) have been formed by selectively removing the alumina portions of said substrate by etching using an RIE process. An electromagnetic transducer element circuit is then laminated on the surface of said insulating film.Since the contact area between the substrate surface and the insulating layer is increased, and especially since the contact area between the TiC and the Al.sub.2 O.sub.3 is increased due to the projection of the TiC, the bonding force between the two films is increased, and the resistance to peeling is conspicuously improved.