Patents by Inventor Tatsuhiro Doi

Tatsuhiro Doi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12516435
    Abstract: A composite material including a composite film formed on a base material, the composite film including a silver layer containing carbon particles, wherein a content of Sb in the composite film is 1 mass % or less, and a crystallite size of silver in the composite film is 40 nm or less.
    Type: Grant
    Filed: April 21, 2021
    Date of Patent: January 6, 2026
    Assignee: DOWA METALTECH CO., LTD.
    Inventors: Yukiya Kato, Hirotaka Takahashi, Tatsuhiro Doi, Hirotaka Kotani, Takao Tomiya, Hiroto Narieda
  • Publication number: 20250382720
    Abstract: There is provided a composite material in which a composite coating composed of a silver layer containing carbon particles is provided on a base material, the composite coating having a silver crystallite size of more than 40 nm and not more than 70 nm and having an arithmetic mean roughness Ra (?m) of 2.0 ?m or less.
    Type: Application
    Filed: October 2, 2023
    Publication date: December 18, 2025
    Applicant: DOWA METALTECH CO., LTD.
    Inventors: Airi HIRAYAMA, Tatsuhiro DOI, Takao TOMIYA, Hirotaka KOTANI, Hirotaka TAKAHASHI
  • Publication number: 20250179677
    Abstract: There is provided a composite material, that is a composite material in which a composite coating composed of a silver layer containing carbon particles is provided on a base material, wherein a crystallite size of silver of the composite coating is 30 nm or less; a value obtained by dividing an arithmetic average roughness Ra (?m) of the composite coating by a thickness (?m) of the composite coating is less than 0.2; and a proportion of carbon particles on a surface of the composite coating is 5% by area or more and 80% by area or less.
    Type: Application
    Filed: March 7, 2023
    Publication date: June 5, 2025
    Applicant: DOWA METALTECH CO., LTD.
    Inventors: Tatsuhiro DOI, Airi HIRAYAMA, Hiroto NARIEDA, Takao TOMIYA, Hirotaka KOTANI, Yukiya KATO, Hirotaka TAKAHASHI
  • Publication number: 20250034741
    Abstract: There is provided a composite material having a composite film on a substrate, the composite film including a silver layer that contains carbon particles, wherein a crystallite size of silver of the composite film is 30 to 100 nm and Vickers hardness Hv of the composite film is 75 or more.
    Type: Application
    Filed: December 9, 2022
    Publication date: January 30, 2025
    Applicant: DOWA METALTECH CO., LTD.
    Inventors: Hirotaka TAKAHASHI, Takao TOMIYA, Tatsuhiro DOI, Hirotaka KOTANI, Yukiya KATO, Hiroto NARIEDA
  • Publication number: 20240287699
    Abstract: There is provided a composite material in which an oxygen-containing silver-based coating layer is formed on a base material. the oxygen-containing silver-based coating layer containing silver and having oxygen present in the vicinity of its surface. and the base material comprising copper or copper alloy.
    Type: Application
    Filed: March 17, 2022
    Publication date: August 29, 2024
    Applicant: DOWA METALTECH CO., LTD.
    Inventors: Hirotaka KOTANI, Hiroto NARIEDA, Takao TOMIYA, Tatsuhiro DOI, Yukiya KATO, Hirotaka TAKAHASHI
  • Patent number: 11926917
    Abstract: There is provided a composite plating material and a related technique thereof, the composite plating material including: a base material, and a composite plating layer on the base material, the composite plating layer comprising a composite material containing carbon particles and Sb in an Ag layer, with a carbon content of 6.0 mass % or more and a Sb content of 0.5 mass % or more.
    Type: Grant
    Filed: June 10, 2020
    Date of Patent: March 12, 2024
    Assignee: DOWA METALTECH CO., LTD.
    Inventors: Yukiya Kato, Hirotaka Kotani, Tatsuhiro Doi, Takao Tomiya, Hiroto Narieda
  • Patent number: 11920255
    Abstract: There are provided a composite plated product wherein a composite plating film of a composite material containing carbon particles in a silver layer is formed on a base material and wherein the amount of the carbon particles dropped out of the composite plating film is small, and a method for producing the same. After a composite plating film of a composite material containing carbon particles in a silver layer is formed on a base material (of preferably copper or a copper alloy) by electroplating using a silver-plating solution to which the carbon particles are added, a treatment for removing part of the carbon particles on the surface thereof is carried out.
    Type: Grant
    Filed: June 4, 2020
    Date of Patent: March 5, 2024
    Assignee: Dowa Metaltech Co., Ltd.
    Inventors: Hirotaka Kotani, Yukiya Kato, Tatsuhiro Doi, Takao Tomiya, Hiroto Narieda
  • Publication number: 20230175160
    Abstract: A composite material including a composite film formed on a base material, the composite film including a silver layer containing carbon particles, wherein a content of Sb in the composite film is 1 mass % or less, and a crystallite size of silver in the composite film is 40 nm or less.
    Type: Application
    Filed: April 21, 2021
    Publication date: June 8, 2023
    Applicant: DOWA METALTECH CO., LTD.
    Inventors: Yukiya KATO, Hirotaka TAKAHASHI, Tatsuhiro DOI, Hirotaka KOTANI, Takao TOMIYA, Hiroto NARIEDA
  • Publication number: 20230046780
    Abstract: There is provided a composite plating material and a related technique thereof, the composite plating material including: a base material, and a composite plating layer on the base material, the composite plating layer comprising a composite material containing carbon particles and Sb in an Ag layer, with a carbon content of 6.0 mass % or more and a Sb content of 0.5 mass % or more.
    Type: Application
    Filed: June 10, 2020
    Publication date: February 16, 2023
    Applicant: DOWA METALTECH CO., LTD.
    Inventors: Yukiya KATO, Hirotaka KOTANI, Tatsuhiro DOI, Takao TOMIYA, Hiroto NARIEDA
  • Publication number: 20220259753
    Abstract: There are provided a composite plated product wherein a composite plating film of a composite material containing carbon particles in a silver layer is formed on a base material and wherein the amount of the carbon particles dropped out of the composite plating film is small, and a method for producing the same. After a composite plating film of a composite material containing carbon particles in a silver layer is formed on a base material (of preferably copper or a copper alloy) by electroplating using a silver-plating solution to which the carbon particles are added, a treatment for removing part of the carbon particles on the surface thereof is carried out.
    Type: Application
    Filed: June 4, 2020
    Publication date: August 18, 2022
    Applicant: Dowa Metaltech Co., Ltd.
    Inventors: Hirotaka Kotani, Yukiya Kato, Tatsuhiro Doi, Takao Tomiya, Hiroto Narieda
  • Patent number: 10985485
    Abstract: There are provided a tin-plated product which has a zinc plating layer on the surface thereof and which has good corrosion resistance and good adhesion of the zinc plating even if the connecting portion of a terminal of the tin-plated product to an electric wire of aluminum or an aluminum alloy is not processed during press fitting such as swaging (or caulking) when the tin-plated product is used as the material of the terminal which is to be connected to the electric wire by press fitting, and a method for producing the same.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: April 20, 2021
    Assignee: DOWA METALTECH CO., LTD.
    Inventors: Hiroto Narieda, Yuta Sonoda, Tatsuhiro Doi, Takao Tomiya
  • Publication number: 20200076103
    Abstract: There are provided a tin-plated product which has a zinc plating layer on the surface thereof and which has good corrosion resistance and good adhesion of the zinc plating even if the connecting portion of a terminal of the tin-plated product to an electric wire of aluminum or an aluminum alloy is not processed during press fitting such as swaging (or caulking) when the tin-plated product is used as the material of the terminal which is to be connected to the electric wire by press fitting, and a method for producing the same.
    Type: Application
    Filed: November 21, 2017
    Publication date: March 5, 2020
    Applicant: Dowa Metaltech Co., Ltd.
    Inventors: Hiroto Narieda, Yuta Sonoda, Tatsuhiro Doi, Takao Tomiya