Abstract: The present invention prevents occurrence of electrical discharge on an electrically conductive structure in an environment in which high-energy electrons impinge onto the structure or on an electronic element mounted to a surface of the structure, which electrical discharge would otherwise occur when the potential of the structure or the electronic element increases in the negative direction due to a negative charge flowing thereinto. An insulating tape bonded to the surface of the electrically conductive structure is partially cut-removed; an electrically conductive adhesive is applied to an exposed portion of the surface of the electrically conductive structure; and an insulating film is bonded to the electrically conductive adhesive, such that the electrically conductive adhesive is exposed to the outside.

Abstract: The present invention prevents occurrence of electrical discharge on an electrically conductive structure in an environment in which high-energy electrons impinge onto the structure or on an electronic element mounted to a surface of the structure, which electrical discharge would otherwise occur when the potential of the structure or the electronic element increases in the negative direction due to a negative charge flowing thereinto. An insulating tape bonded to the surface of the electrically conductive structure is partially cut-removed; an electrically conductive adhesive is applied to an exposed portion of the surface of the electrically conductive structure; and an insulating film is bonded to the electrically conductive adhesive, such that the electrically conductive adhesive is exposed to the outside.