Patents by Inventor Tatsuhito Kunihiro

Tatsuhito Kunihiro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8393370
    Abstract: A substrate laminating apparatus which sticks substrates together in vacuum with high accuracy. The apparatus includes a first chamber into which two substrates are carried; a second chamber in which substrates are stuck together; and a third chamber which delivers a substrate laminate. The pressure level in the first chamber and the third chamber is varied from atmospheric to medium vacuum under control and that in the second chamber is varied from medium vacuum to high vacuum under control. In the second chamber, electrostatic adsorption means which can move up and down picks up an upper substrate and holds it on an upper table.
    Type: Grant
    Filed: July 24, 2007
    Date of Patent: March 12, 2013
    Assignee: Hitachi Plant Technologies, Ltd.
    Inventors: Masaru Mitsumoto, Shigeo Watanabe, Tatsuhito Kunihiro
  • Publication number: 20080017322
    Abstract: A substrate laminating apparatus which sticks substrates together in vacuum with high accuracy. The apparatus includes a first chamber into which two substrates are carried; a second chamber in which substrates are stuck together; and a third chamber which delivers a substrate laminate. The pressure level in the first chamber and the third chamber is varied from atmospheric to medium vacuum under control and that in the second chamber is varied from medium vacuum to high vacuum under control. In the second chamber, electrostatic adsorption means which can move up and down picks up an upper substrate and holds it on an upper table.
    Type: Application
    Filed: July 24, 2007
    Publication date: January 24, 2008
    Inventors: Masaru Mitsumoto, Shigeo Watanabe, Tatsuhito Kunihiro