Patents by Inventor Tatsuki Nogiwa

Tatsuki Nogiwa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7517419
    Abstract: A substrate support jig, for removably holding a substrate when mounting electronic components on the substrate, includes a base member having a first surface and a second surface facing and substantially parallel to each other; and an adhesive layer with a predetermined shape and a predetermined thickness formed on the first surface side by applying an adhesive material with a predetermined unit tackiness to an adhesive region. In the adhesive region is formed a land section such that a surface of the land section protrudes from a surface of the adhesive layer by a predetermined amount. The tackiness between the adhesive material and the base member is lower than the tackiness between the adhesive material and the substrate.
    Type: Grant
    Filed: April 16, 2004
    Date of Patent: April 14, 2009
    Assignee: Panasonic Corporation
    Inventors: Tatsuki Nogiwa, Mitsuhiro Ikeda, Hiroshi Yamauchi, Mineo Tokunaga
  • Patent number: 7077908
    Abstract: In a substrate holder for holding a circuit board onto which a viscous material for bonding electronic components is printed by use of a squeegee through a screen mask, a first holding area for holding the screen mask and a second holding area for holding the circuit board are provided on a base surface. The squeegee is supported by at least one of the first holding area and the second holding area. The squeegee is abutted against the circuit board being held to the second holding area, via the screen mask placed on the circuit board.
    Type: Grant
    Filed: May 27, 2004
    Date of Patent: July 18, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tatsuki Nogiwa, Hidehiko Uemura, Hironori Uemura
  • Publication number: 20050230050
    Abstract: A substrate support jig, for removably holding a substrate when mounting electronic components on the substrate, includes a base member having a first surface and a second surface facing and substantially parallel to each other; and an adhesive layer with a predetermined shape and a predetermined thickness formed on the first surface side by applying an adhesive material with a predetermined unit tackiness to an adhesive region. In the adhesive region is formed a land section such that a surface of the land section protrudes from a surface of the adhesive layer by a predetermined amount. The tackiness between the adhesive material and the base member is lower than the tackiness between the adhesive material and the substrate.
    Type: Application
    Filed: April 16, 2004
    Publication date: October 20, 2005
    Inventors: Tatsuki Nogiwa, Mitsuhiro Ikeda, Hiroshi Yamauchi, Mineo Tokunaga
  • Publication number: 20040238595
    Abstract: In a substrate holder for holding a circuit board onto which a viscous material for bonding electronic components is printed by means of a squeegee through a screen mask, a first holding area for holding the screen mask and a second holding area for holding the circuit board are provided on a base surface. The squeegee is supported by at least one of the first holding area and the second holding area. The squeegee is abutted against the circuit board being held to the second holding area, via the screen mask placed on the circuit board.
    Type: Application
    Filed: May 27, 2004
    Publication date: December 2, 2004
    Inventors: Tatsuki Nogiwa, Hidehiko Uemura, Hironori Uemura
  • Publication number: 20040154529
    Abstract: A pallet 1 for holding an FPC 9 in order to mount electronic components thereon includes a first adhesive holding region 21 in a peripheral portion and a second adhesive holding region 22 in a central portion. The first adhesive holding region 21 has a relatively low tackiness, whereas the second adhesive holding region 22 has a higher tackiness than that of the first adhesive holding region 21. The pallet 1 has through holes 31 for receiving push-up pins to be used when peeling off the FPC 9, and air outlets 32 for assisting in the peeling.
    Type: Application
    Filed: February 6, 2004
    Publication date: August 12, 2004
    Inventors: Tatsuki Nogiwa, Hironori Uemura
  • Patent number: 5425793
    Abstract: According to the present invention, chamber units are sequentially coupled with each other to thereby provide a volume of clean space, and whereby different environments can be maintained in the different chamber units. An air blowhole or door is provided at an opening section of each chamber unit. Moreover, a space section can be defined at the coupling part of the chamber units, and a suction pump and a suction hose can be provided in the space section, so as to prevent the environments of the different chambers from influencing one another.
    Type: Grant
    Filed: February 9, 1993
    Date of Patent: June 20, 1995
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kazuhiro Mori, Yoshiyuki Kubota, Naoyuki Hashimoto, Tatsuki Nogiwa