Abstract: A visit assistance device, a visit assistance system, a visit assistance method, and a program are provided that can assist realization of a comfortable visit. A visit assistance device (1) includes a registration unit (2) configured to register a status in a seated condition of a user who is seated in a predetermined space for each user and a display control unit (3) configured to cause a display device installed in an entrance of the space to display the registered status of the user together with information identifying the user.

Abstract: A visit assistance device, a visit assistance system, a visit assistance method, and a program are provided that can assist realization of a comfortable visit. A visit assistance device (1) includes a registration unit (2) configured to register a status in a seated condition of a user who is seated in a predetermined space for each user and a display control unit (3) configured to cause a display device installed in an entrance of the space to display the registered status of the user together with information identifying the user.

Abstract: An optical module includes: a stem including a first surface and a second surface opposite to the first surface; a thermoelectric cooler including a heat-releasing substrate fixed to the first surface; a semiconductor laser element attached to the thermoelectric cooler; a cap fixed to the first surface and covering the thermoelectric cooler and the semiconductor laser element; a lens fixed to the cap; and a restriction body fixed to the second surface. The linear thermal expansion coefficients of the heat-releasing substrate and the restriction body are smaller than the linear thermal expansion coefficient of the stem.

Abstract: Provided is an optical module comprising a plate-like metal stem and a semiconductor optical modulation element mounted to a dielectric substrate provided on one side of the metal stem, wherein the metal stem has a metal stem penetration section in which a metal lead pin is inserted coaxially in a penetration hole which is formed in the metal stem and a dielectric member is provided to fill the penetration hole around the outer circumference of the lead pin, and a signal for modulation is supplied to the semiconductor optical modulation element connected in parallel with a terminal matching circuit, from the other side of the metal stem via the metal stem penetration section, wherein the terminal matching circuit is configured by a series connecting body which is comprised of a first resistor and a parallel body which is comprised of a second resistor and a capacitor.

Abstract: The optical module which is disclosed in the present application comprises a plate-like metal stem in which a metallic lead pin is inserted in a through-hole so as to be coaxial with the through-hole and one sheet of a dielectric substrate which is equipped with a high-frequency signal line to be connected to the lead pin and a semiconductor optical integrated element, in which a semiconductor laser and an optical modulator are integrated, and which is connected to the high-frequency signal line with a bonding wire, wherein one side surface of the dielectric substrate extends in a direction perpendicular to the light axis direction of the semiconductor optical integrated element, and the side surface of the dielectric substrate is arranged in contact with a surface of the metal stem.

Abstract: Provided is an optical module comprising a plate-like metal stem and a semiconductor optical modulation element mounted to a dielectric substrate provided on one side of the metal stem, wherein the metal stem has a metal stem penetration section in which a metal lead pin is inserted coaxially in a penetration hole which is formed in the metal stem and a dielectric member is provided to fill the penetration hole around the outer circumference of the lead pin, and a signal for modulation is supplied to the semiconductor optical modulation element connected in parallel with a terminal matching circuit, from the other side of the metal stem via the metal stem penetration section, wherein the terminal matching circuit is configured by a series connecting body which is comprised of a first resistor and a parallel body which is comprised of a second resistor and a capacitor.

Abstract: An optical module includes: a stem including a first surface and a second surface opposite to the first surface; a thermoelectric cooler including a heat-releasing substrate fixed to the first surface; a semiconductor laser element attached to the thermoelectric cooler; a cap fixed to the first surface and covering the thermoelectric cooler and the semiconductor laser element; a lens fixed to the cap; and a restriction body fixed to the second surface. The linear thermal expansion coefficients of the heat-releasing substrate and the restriction body are smaller than the linear thermal expansion coefficient of the stem.

Abstract: An optical module includes a semiconductor laser element, a lens configured to collect emitted light that is emitted from the semiconductor laser element, a cap configured to hold the lens and hermetically seal the semiconductor laser element, a monitor light-receiving element configured to receive backlight of the semiconductor laser element, a transmission plate arranged between the semiconductor laser element and the monitor light-receiving element and configured to attenuate the backlight according to decrease in a temperature around the cap so as to cause the backlight to enter the monitor light-receiving element, and a control unit configured to control an injection current of the semiconductor laser element such that an output of the monitor light-receiving element is kept at a constant level.

Abstract: A first resistor connected in parallel to a semiconductor optical modulator having first ends, the first resistor and first ends connected to a reference potential. A first end of a first transmission line is connected to second ends of the semiconductor optical modulator and the first resistor. A second transmission line is connected in series to the first transmission line and has an impedance lower than that of the first resistor. A first end of the second transmission line is connected to a second end of the first transmission line. A third transmission line is connected in series to the first and second transmission lines and has an end connected to a second end of the second transmission line, and has an impedance equal to that of the first transmission line. A second resistor and a capacitor are connected in series between the third transmission line and the reference potential.

Abstract: A first resistor connected in parallel to a semiconductor optical modulator having first ends, the first resistor and first ends connected to a reference potential. A first end of a first transmission line is connected to second ends of the semiconductor optical modulator and the first resistor. A second transmission line is connected in series to the first transmission line and has an impedance lower than that of the first resistor. A first end of the second transmission line is connected to a second end of the first transmission line. A third transmission line is connected in series to the first and second transmission lines and has an end connected to a second end of the second transmission line, and has an impedance equal to that of the first transmission line. A second resistor and a capacitor are connected in series between the third transmission line and the reference potential.