Abstract: The invention provides a curable resin composition having low weight reduction ratio during heat curing for obtaining a cured product having high heat resistance, but having reduced mold shrinkage ratio and coefficient of thermal expansion, a cured product thereof, and a method of producing the curable resin composition and the cured product. Also provided is a semiconductor device using the product as a sealant. The curable resin composition includes: (A) a benzoxazine compound; (B) an epoxy compound; and (C) a phenolic curing agent, wherein the number of epoxy groups in the (B) epoxy compound, the number of benzoxazine rings in the (A) benzoxazine compound, and the number of hydroxyl groups in the (C) phenolic curing agent satisfy the mathematical formula (1), and the content of the (B) alicyclic epoxy compound is 3 to 12 mass % with respect to the total of the (A), (B), and (C).

Abstract: According to one embodiment, a platooning operation system organizes a platoon by making a plurality of vehicles cooperate. The platooning operation system includes an application acceptance processor and a platoon organization processor. The application acceptance processor accepts an application of a vehicle for admission to the platoon. The platoon organization processor which selects a platoon to which the vehicle is to be admitted or determines possibility of admission of the vehicle to the platoon, based on at least one of information on a driver driving the vehicle and information on the vehicle.

Abstract: The present invention relates to a reservoir tank for coolant that stores the coolant for cooling an internal combustion engine. The reservoir tank includes: a tank chamber that stores the coolant; an opening, which is disposed in an upper part of the tank chamber, through which the coolant flows in and flows out, and in a circumferential wall of which a breathing hole is formed; and a first communication passage, a second communication passage, and a third communication passage that respectively communicate with the opening and the tank chamber.

Abstract: To provide a vehicle seat which makes the load from the airbag more likely to be concentrated on a weakened part of a skin member, a vehicle seat provided with a seat cushion constituting a seating surface and a seat back constituting a backrest including a seat back frame forming a structural member of the seat back; an airbag module supported on a side portion of the seat back frame on a vehicle outer side; a pad member covering the airbag module; and a skin member covering a surface of the pad member, wherein the skin member is provided with a weakened part vertically extending on an edge part of the seat back on a vehicle outer side and a first low-elasticity reinforcement part extending from a vicinity of the weakened part in a direction intersecting with the weakened part.

Abstract: The invention relates to a curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a trisphenolmethane type epoxy compound, and (D) a curing agent, and optionally (E) an inorganic filler and (F) a curing accelerator; a cured product thereof; methods of producing the curable resin composition and the cured product; and a semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

Abstract: The invention relates to a curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a naphthylene ether type epoxy compound, and (D) a curing agent, and optionally (E) an inorganic filler and (F) a curing accelerator; a cured product thereof; methods of producing the curable resin composition and the cured product and a semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

Abstract: The invention relates to a curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a biphenyl type epoxy compound, and (D) a curing agent, and optionally (E) an inorganic filler and (F) a curing accelerator; a cured product thereof; methods of producing the curable resin composition and the cured product; and a semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

Abstract: The invention provides a curable resin composition containing (A) a multifunctional benzoxazine compound having at least two benzoxazine rings, the compound being at least one multifunctional benzoxazine compound selected from a multifunctional benzoxazine compound having a structural unit of formula (1) and a multifunctional benzoxazine compound represented by a structure of formula (2), (B) a multifunctional epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a curing agent, and (D) a curing accelerator which is a bisphenol salt of a diazabicycloalkene. The invention also provides a cured product of the curable resin composition and methods of producing the curable resin composition and the cured product, as well as a semiconductor device using the cured product as a sealant.

Abstract: Provided is a curable resin composition being excellent in normal-temperature stability for obtaining cured product having high heat resistance, cured product thereof, methods of producing the composition and the product, and a semiconductor device using the product as sealant. Further provided is a resin composition, cured product thereof, and methods of producing the composition and the product, wherein the composition includes: (A) multifunctional benzoxazine compound having at least two benzoxazine rings, (B) epoxy compound containing at least one epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) curing agent; wherein composition consisting of (A), (B), and (C) has weight-average molecular weight of 350 or more and 650 or less in terms of polystyrene.

Abstract: The invention provides a curable resin composition excellent in curability at low temperature for obtaining a cured product high in heat resistance, a cured product thereof, and methods of producing the curable resin composition and the cured product. Also provided is a semiconductor device using the cured product as a sealant. In particular, the invention provides a curable resin composition comprising (A) a benzoxazine compound represented by a structure of formula (1), (B) an epoxy compound, and (C) a phenol-based curing agent, wherein a number of epoxy groups in the epoxy compound (B), a number of benzoxazine rings in the benzoxazine compound (A), and a number of hydroxyl groups in the phenol-based curing agent (C) satisfy formula (2), and a ratio of the benzoxazine equivalent in the benzoxazine compound (A) to the hydroxyl group equivalent in the phenol-based curing agent (C) is 1.1 to 8.0.

Abstract: The invention provides a curable resin composition containing (A) a multifunctional benzoxazine compound having at least two benzoxazine rings, the compound being at least one multifunctional benzoxazine compound selected from a multifunctional benzoxazine compound having a structural unit of formula (1) and a multifunctional benzoxazine compound represented by a structure of formula (2), (B) a multifunctional epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a curing agent, and (D) a curing accelerator which is a bisphenol salt of a diazabicycloalkene. The invention also provides a cured product of the curable resin composition and methods of producing the curable resin composition and the cured product, as well as a semiconductor device using the cured product as a sealant.

Abstract: The invention relates to a curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a biphenyl type epoxy compound, and (D) a curing agent, and optionally (E) an inorganic filler and (F) a curing accelerator; a cured product thereof; methods of producing the curable resin composition and the cured product; and a semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

Abstract: The invention relates to a curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a naphthylene ether type epoxy compound, and (D) a curing agent, and optionally (E) an inorganic filler and (F) a curing accelerator; a cured product thereof; methods of producing the curable resin composition and the cured product and a semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

Abstract: The invention relates to a curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a trisphenolmethane type epoxy compound, and (D) a curing agent, and optionally (E) an inorganic filler and (F) a curing accelerator; a cured product thereof; methods of producing the curable resin composition and the cured product; and a semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

Abstract: The present disclosure relates to methods of producing Enterovirus C, e.g., for poliomyelitis vaccine production. In some embodiments, the methods include adding polysorbate to the cell culture medium during or prior to inoculation with the virus and/or culturing cells in a fixed bed bioreactor. Further provided herein is an Enterovirus C produced by the methods of production disclosed herein, as well as compositions, immunogenic compositions, and vaccines related thereto.