Patents by Inventor Tatsumasa HIRATSUKA

Tatsumasa HIRATSUKA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING SOLID-STATE IMAGING DEVICE, AND ELECTRONIC DEVICE
    Publication number: 20230395636
    Abstract: To provide a solid-state imaging device capable of further improving quality and reliability of the solid-state imaging device. Provided is a solid-state imaging device including: a first substrate; a second substrate laminated on the first substrate by direct bonding on a side opposite to a light incident side of the first substrate, the second substrate having a size different from a size of the first substrate; a third substrate provided on a side opposite to a light incident side of the second substrate; and an insulating layer formed between the first substrate and the third substrate, in which the third substrate includes a well formed on a light incident side of the third substrate.
    Type: Application
    Filed: September 15, 2021
    Publication date: December 7, 2023
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Kentaro AKIYAMA, Tatsumasa HIRATSUKA, Takahiro KAMEI, Yosuke NITTA