Patents by Inventor Tatsumi Kawafuchi

Tatsumi Kawafuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11826964
    Abstract: The method of metal-thermoplastic resin direct bonding is characterized by comprising a first step for irradiating a surface of the metal material with a pulse laser under an oxidizing atmosphere to form a surface modification region, a second step for causing the thermoplastic resin material to abut against the surface modification region to form a bonding interface, and a third step for heating up the bonding interface by laser irradiation to achieve bonding, the first step including forming metal oxide particle clusters obtained when metal oxide particles having a particle diameter of 5-500 nm to be continuously bonded at the surface modification region, so that the maximum height (Sz) of a surface of the metal oxide particle clusters is 50 nm-3 ?m.
    Type: Grant
    Filed: April 21, 2021
    Date of Patent: November 28, 2023
    Assignee: HIROTEC CORPORATION
    Inventors: Kiminori Washika, Tatsumi Kawafuchi
  • Publication number: 20230173763
    Abstract: The method of metal-thermoplastic resin direct bonding is characterized by comprising a first step for irradiating a surface of the metal material with a pulse laser under an oxidizing atmosphere to form a surface modification region, a second step for causing the thermoplastic resin material to abut against the surface modification region to form a bonding interface, and a third step for heating up the bonding interface by laser irradiation to achieve bonding, the first step including forming metal oxide particle clusters obtained when metal oxide particles having a particle diameter of 5-500 nm to be continuously bonded at the surface modification region, so that the maximum height (Sz) of a surface of the metal oxide particle clusters is 50 nm-3 µm.
    Type: Application
    Filed: April 21, 2021
    Publication date: June 8, 2023
    Applicant: HIROTEC CORPORATION
    Inventors: Kiminori Washika, Tatsumi Kawafuchi