Patents by Inventor Tatsumi Setomoto
Tatsumi Setomoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7250637Abstract: An LED illumination source comprises a heat dissipating substrate which includes a metal plate and at least two insulating layers thereon. LEI) bare chips are mounted on a surface of the substrate. An optical reflector with holes surrounds the LED bare chips. The optical reflector is provided on the surface of the substrate on which the LED bare chips are mounted. A resin encapsulates the entire optical reflector on the substrate, the resin molding each of the LED bare chips and functioning as an optical lens for each of the LED bare chips.Type: GrantFiled: March 30, 2006Date of Patent: July 31, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Masanori Shimizu, Tadashi Yano, Tatsumi Setomoto, Nobuyuki Matsui, Tetsushi Tamura
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Patent number: 7242086Abstract: A wiring board used for mounting an LED bare chip capable of firmly bonding the LED bare chip and improving yield. In a printed wiring board 2, a distance D between wiring patterns 81 and 85 disposed so as to oppose each other is the smallest at a position nearest to a center point (G) of an LED chip 14 disposed at a designed location, and increases with an increasing distance from the point G. In addition, pattern edges 83 and 87 of the wiring patterns 81 and 85 recede in the direction of widening the distance D as a distance from the center point G increases with respect to electrode edges 148 and 149 of the LED chip 14.Type: GrantFiled: December 24, 2003Date of Patent: July 10, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Tetsushi Tamura, Tatsumi Setomoto, Nobuyuki Matsui, Masanori Shimizu, Yoshihisa Yamashita
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Publication number: 20060160409Abstract: An LED illumination apparatus includes at least one connector and a lighting drive circuit. The connector is connected to an insertable and removable card-type LED illumination source, which includes multiple LEDs that have been mounted on one surface of a substrate. The lighting drive circuit is electrically connected to the card-type LED illumination source by way of the connector. The card-type LED illumination source preferably includes a metal base substrate and the multiple LEDs that have been mounted on one surface of the metal base substrate. The back surface of the metal base substrate, including no LEDs thereon, thermally contacts with a portion of the illumination apparatus. A feeder terminal to be electrically connected to the connector is provided on the surface of the metal base substrate on which the LEDs are provided.Type: ApplicationFiled: March 30, 2006Publication date: July 20, 2006Inventors: Masanori SHIMIZU, Tadashi YANO, Tatsumi SETOMOTO, Nobuyuki Matsui, Tetsushi TAMURA
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Publication number: 20060104563Abstract: A wiring board used for mounting an LED bare chip capable of firmly bonding the LED bare chip and improving yield. In a printed wiring board 2, a distance D between wiring patterns 81 and 85 disposed so as to oppose each other is the smallest at a position nearest to a center point (G) of an LED chip 14 disposed at a designed location, and increases with an increasing distance from the point G. In addition, pattern edges 83 and 87 of the wiring patterns 81 and 85 recede in the direction of widening the distance D as a distance from the center point G increases with respect to electrode edges 148 and 149 of the LED chip 14.Type: ApplicationFiled: December 24, 2003Publication date: May 18, 2006Inventors: Tetsushi Tamura, Tatsumi Setomoto, Nobuyuki Matsui, Masanori Shimizu, Yoshihisa Yamashita
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Patent number: 7045828Abstract: An LED illumination source is disclosed. The illumination source includes a metal base substrate including a line pattern and an insulating layer including a composite material with an inorganic filler and a resin composition. LED bare chips are mounted on one surface of the metal base substrate An optical reflector with holes to surround the bare chips is provided on the surface of the metal base substrate on which the LED bare chips are mounted. Stress relaxing means is provided between the metal base substrate and the optical reflector.Type: GrantFiled: June 22, 2005Date of Patent: May 16, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Masanori Shimizu, Tadashi Yano, Tatsumi Setomoto, Nobuyuki Matsui, Tetsushi Tamura
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Publication number: 20060087843Abstract: In a module socket, a connecter and a connector are connected by wiring, and three LED modules are connected in parallel with respect to a constant voltage circuit unit via the wiring. Each module has a constant current circuit unit and an LED mounting unit. The constant current circuit unit includes one resistor and two transistors mounted on a surface of a sub-substrate on which a conductive land is formed. The sub-substrate is bonded to a main substrate.Type: ApplicationFiled: December 22, 2003Publication date: April 27, 2006Inventors: Tatsumi Setomoto, Nobuyuki Matsui, Tetsushi Tamura, Noriyasu Tanimoto, Masanori Shimizu
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Publication number: 20060043382Abstract: A metal base wiring board including: an insulation substrate composed of an upper insulation layer and a lower insulation layer; and a metal base attached to a rear surface of the insulation substrate. In front surfaces of the upper and lower insulation layers, wiring patterns are embedded and connected to each other. The insulation substrate has a plurality of recesses whose bottom faces are exposed areas of the front surface of the lower insulation layer. LED bare chips are mounted on the bottom faces of the recesses so as to be connected to the wiring pattern of the lower insulation layer.Type: ApplicationFiled: February 5, 2004Publication date: March 2, 2006Inventors: Nobuyuki Matsui, Tatsumi Setomoto, Tetsushi Tamura, Masanori Shimizu, Yoshihisa Yamashita
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Publication number: 20050263777Abstract: An LED lamp includes a substrate, an LED chip, and a resin portion. The LED chip is flip-chip bonded to the substrate. The resin portion covers the LED chip and includes at least one type of phosphor that transforms the emission of the LED chip into light having a longer wavelength than the emission. In this LED lamp, the resin portion has at least one side surface. The side surface is separated from another surface that can reflect the outgoing light of the resin portion, surrounds the side surfaces of the LED chip and is curved at least partially.Type: ApplicationFiled: July 29, 2005Publication date: December 1, 2005Inventors: Tadashi Yano, Masanori Shimizu, Nobuyuki Matsui, Tatsumi Setomoto, Tetsushi Tamura
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Patent number: 6963166Abstract: An LED lamp includes a substrate, an LED chip, and a resin portion. The LED chip is flip-chip bonded to the substrate. The resin portion covers the LED chip and includes at least one type of phosphor that transforms the emission of the LED chip into light having a longer wavelength than the emission. In this LED lamp, the resin portion has at least one side surface. The side surface is separated from another surface that can reflect the outgoing light of the resin portion, surrounds the side surfaces of the LED chip and is curved at least partially.Type: GrantFiled: November 7, 2003Date of Patent: November 8, 2005Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Tadashi Yano, Masanori Shimizu, Nobuyuki Matsui, Tatsumi Setomoto, Tetsushi Tamura
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Publication number: 20050242362Abstract: An LED illumination apparatus includes at least one connector and a lighting drive circuit. The connector is connected to an insertable and removable card-type LED illumination source, which includes multiple LEDs that have been mounted on one surface of a substrate. The lighting drive circuit is electrically connected to the card-type LED illumination source by way of the connector. The card-type LED illumination source preferably includes a metal base substrate and the multiple LEDs that have been mounted on one surface of the metal base substrate. The back surface of the metal base substrate, including no LEDs thereon, thermally contacts with a portion of the illumination apparatus. A feeder terminal to be electrically connected to the connector is provided on the surface of the metal base substrate on which the LEDs are provided.Type: ApplicationFiled: June 22, 2005Publication date: November 3, 2005Inventors: Masanori Shimizu, Tadashi Yano, Tatsumi Setomoto, Nobuyuki Matsui, Tetsushi Tamura
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Publication number: 20050237747Abstract: An LED illumination apparatus includes at least one connector and a lighting drive circuit. The connector is connected to an insertable and removable card-type LED illumination source, which includes multiple LEDs that have been mounted on one surface of a substrate. The lighting drive circuit is electrically connected to the card-type LED illumination source by way of the connector. The card-type LED illumination source preferably includes a metal base substrate and the multiple LEDs that have been mounted on one surface of the metal base substrate. The back surface of the metal base substrate, including no LEDs thereon, thermally contacts with a portion of the illumination apparatus. A feeder terminal to be electrically connected to the connector is provided on the surface of the metal base substrate on which the LEDs are provided.Type: ApplicationFiled: June 22, 2005Publication date: October 27, 2005Inventors: Masanori Shimizu, Tadashi Yano, Tatsumi Setomoto, Nobuyuki Matsui, Tetsushi Tamura
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Patent number: 6949772Abstract: An LED illumination apparatus according to the present invention includes at least one connector and a lighting drive circuit. The connector is connected to an insertable and removable card-type LED illumination source, which includes multiple LEDs that have been mounted on one surface of a substrate. The lighting drive circuit is electrically connected to the card-type LED illumination source by way of the connector. The card-type LED illumination source preferably includes a metal base substrate and the multiple LEDs that have been mounted on one surface of the metal base substrate. The back surface of the metal base substrate, including no LEDs thereon, thermally contacts with a portion of the illumination apparatus. A feeder terminal to be electrically connected to the connector is provided on the surface of the metal base substrate on which the LEDs are provided.Type: GrantFiled: February 26, 2003Date of Patent: September 27, 2005Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Masanori Shimizu, Tadashi Yano, Tatsumi Setomoto, Nobuyuki Matsui, Tetsushi Tamura
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Publication number: 20050207165Abstract: An LED illumination apparatus according to the present invention includes at least one connector and a lighting drive circuit. The connector is connected to an insertable and removable card-type LED illumination source, which includes multiple LEDs that have been mounted on one surface of a substrate. The lighting drive circuit is electrically connected to the card-type LED illumination source by way of the connector. The card-type LED illumination source preferably includes a metal base substrate and the multiple LEDs that have been mounted on one surface of the metal base substrate. The back surface of the metal base substrate, including no LEDs thereon, thermally contacts with a portion of the illumination apparatus. A feeder terminal to be electrically connected to the connector is provided on the surface of the metal base substrate on which the LEDs are provided.Type: ApplicationFiled: May 9, 2005Publication date: September 22, 2005Inventors: Masanori Shimizu, Tadashi Yano, Tatsumi Setomoto, Nobuyuki Matsui, Tetsushi Tamura
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Patent number: 6940101Abstract: An LED lamp includes at least one LED chip and a wavelength converting portion including a phosphor for transforming the emission of the LED chip into light having a longer wavelength than that of the emission. The LED lamp further includes filtering member. The filtering member is designed such that the spectral transmittance thereof becomes lower in at least a portion of the wavelength range of 550 nm to 605 nm than in the remaining visible radiation range.Type: GrantFiled: November 25, 2003Date of Patent: September 6, 2005Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Tadashi Yano, Masanori Shimizu, Nobuyuki Matsui, Tatsumi Setomoto, Tetsushi Tamura
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Patent number: 6922024Abstract: An LED lamp includes at least one LED chip having an emission peak wavelength of 400 nm to 490 nm, and a wavelength converting portion including a phosphor for transforming the emission of the LED chip into light having a longer wavelength than that of the emission. The LED lamp further includes a filtering member, of which the spectral transmittance is adjusted so as to minimize color shifting even if the amount of current supplied to the LED chip to make the LED chip produce the emission has changed.Type: GrantFiled: November 24, 2003Date of Patent: July 26, 2005Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Tadashi Yano, Masanori Shimizu, Nobuyuki Matsui, Tatsumi Setomoto, Tetsushi Tamura
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Publication number: 20040124430Abstract: An LED lamp includes at least one LED chip having an emission peak wavelength of 400 nm to 490 nm, and a wavelength converting portion including a phosphor for transforming the emission of the LED chip into light having a longer wavelength than that of the emission. The LED lamp further includes a filtering member, of which the spectral transmittance is adjusted so as to minimize color shifting even if the amount of current supplied to the LED chip to make the LED chip produce the emission has changed.Type: ApplicationFiled: November 24, 2003Publication date: July 1, 2004Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Tadashi Yano, Masanori Shimizu, Nobuyuki Matsui, Tatsumi Setomoto, Tetsushi Tamura
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Publication number: 20040119086Abstract: An LED lamp includes at least one LED chip and a wavelength converting portion including a phosphor for transforming the emission of the LED chip into light having a longer wavelength than that of the emission. The LED lamp further includes filtering member. The filtering member is designed such that the spectral transmittance thereof becomes lower in at least a portion of the wavelength range of 550 nm to 605 nm than in the remaining visible radiation range.Type: ApplicationFiled: November 25, 2003Publication date: June 24, 2004Applicant: Matsushita Electric Industrial Co. Ltd.Inventors: Tadashi Yano, Masanori Shimizu, Nobuyuki Matsui, Tatsumi Setomoto, Tetsushi Tamura
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Publication number: 20040100192Abstract: An LED lamp includes a substrate, an LED chip, and a resin portion. The LED chip is flip-chip bonded to the substrate. The resin portion covers the LED chip and includes at least one type of phosphor that transforms the emission of the LED chip into light having a longer wavelength than the emission. In this LED lamp, the resin portion has at least one side surface. The side surface is separated from another surface that can reflect the outgoing light of the resin portion, surrounds the side surfaces of the LED chip and is curved at least partially.Type: ApplicationFiled: November 7, 2003Publication date: May 27, 2004Applicant: Matsuhita Electric Industrial Co., Ltd.Inventors: Tadashi Yano, Masanori Shimizu, Nobuyuki Matsui, Tatsumi Setomoto, Tetsushi Tamura
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Publication number: 20030189829Abstract: An LED illumination apparatus according to the present invention includes at least one connector and a lighting drive circuit. The connector is connected to an insertable and removable card-type LED illumination source, which includes multiple LEDs that have been mounted on one surface of a substrate. The lighting drive circuit is electrically connected to the card-type LED illumination source by way of the connector. The card-type LED illumination source preferably includes a metal base substrate and the multiple LEDs that have been mounted on one surface of the metal base substrate. The back surface of the metal base substrate, including no LEDs thereon, thermally contacts with a portion of the illumination apparatus. A feeder terminal to be electrically connected to the connector is provided on the surface of the metal base substrate on which the LEDs are provided.Type: ApplicationFiled: February 26, 2003Publication date: October 9, 2003Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Masanori Shimizu, Tadashi Yano, Tatsumi Setomoto, Nobuyuki Matsui, Tetsushi Tamura