Abstract: A slider and suspension of a hard disk drive are joined with a low modulus epoxy adhesive. The slider and suspension are set in a bonding jig while they are moving from process to process or subjected to a thermosetting treatment in a controlled temperature chamber. The slider and suspension must be kept bound together with the bonding jig until the adhesive is cured through a thermal treatment. The low modulus epoxy adhesive is cured with heat from a laser beam. In addition, a resistance value of the head disposed at the slider is measured so as to monitor the temperature of the head, thereby deciding both output and irradiation time of the laser beam for obtaining a desired strength of the bond within a predetermined temperature range.

Abstract: A capillary tube for a solder ball connection device connects a first connection surface of a pad to a second connection surface of a pad with a solder ball. The first connection surface is formed at a slider held by a slider holder in a disk unit. The second connection surface is formed at an end of a lead wired to the slider holder. The capillary tube has a ball regulator with a substantially conic, hollow portion. The solder ball regulator has an opening at its top that opens to the tip of the hollow portion. The center axes of the hollow portion and the opening are common. The solder ball regulator also has a pair of projections along the center axis around the opening, where the projections face each other with the center axis therebetween. The projections regulate the movement of the solder ball. The tip of the hollow portion is tapered when viewed from a line connecting the pair of projections and the extreme tips of the tapered tip portions.