Patents by Inventor Tatsunobu Abe

Tatsunobu Abe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor packaging substrate and semiconductor device
    Patent number: 8319345
    Abstract: A semiconductor packaging substrate with a plurality of pads arranged in a square grid pattern thereon, in which among the pads, two pads obliquely adjacent to each other are connected with through-holes respectively and another through-hole is provided between the through-holes connected with the two pads obliquely adjacent to each other.
    Type: Grant
    Filed: July 17, 2010
    Date of Patent: November 27, 2012
    Assignee: Hitachi, Ltd.
    Inventors: Tatsunobu Abe, Seiji Miyamoto
  • SEMICONDUCTOR PACKAGING SUBSTRATE AND SEMICONDUCTOR DEVICE
    Publication number: 20110062593
    Abstract: A semiconductor packaging substrate with a plurality of pads arranged in a square grid pattern thereon, in which among the pads, two pads obliquely adjacent to each other are connected with through-holes respectively and another through-hole is provided between the through-holes connected with the two pads obliquely adjacent to each other.
    Type: Application
    Filed: July 17, 2010
    Publication date: March 17, 2011
    Inventors: Tatsunobu ABE, Seiji Miyamoto