Abstract: A filter device includes a stack body, plate electrodes, resonators, and shield conductors. The plate electrodes are disposed inside the stack body apart from each other in the stacking direction. The resonators are disposed between the plate electrodes and extend in the Y-axis direction. The shield conductors are disposed on the side surfaces of the stack body, respectively. The shield conductors are connected to the plate electrodes. The resonators are disposed inside the stack body side by side in the X-axis direction. A first end of each of the resonators is connected to the shield conductor, and a second end thereof is separated from the shield conductor. The first end of each of the resonators is formed with a cutout.

Abstract: A wiring board that includes: a wiring conductor; a first dielectric layer around the wiring conductor and containing a first glass and a first ceramic filler; and a second dielectric layer interposed between the wiring conductor and the first dielectric layer, the second dielectric layer being in contact with the wiring conductor and the first dielectric layer, and the second dielectric layer containing a second glass and a second ceramic filler. A sintering temperature of the second glass contained in the second dielectric layer is higher than a sintering temperature of the wiring conductor, and a grain size of the second glass contained in the second dielectric layer is smaller than a grain size of the first glass contained in the first dielectric layer.

Abstract: A filter device includes a laminated body, a plurality of resonator portions, and a plurality of capacitor portions facing the plurality of resonator portions in a Y-axis direction, respectively. Each of the resonator portions is formed by a plurality of resonant electrode elements. Each of the capacitor portions is formed by a plurality of capacitive electrode elements. The plurality of resonant electrode elements in the resonator portion are formed such that all of facing ends with respect to the capacitive electrode elements do not overlap with each other when viewed in a planar view from a Z-axis direction. The capacitive electrode elements in the capacitor portion are formed such that a gap between the capacitive electrode element and the resonant electrode element facing each other in a Y-axis direction is substantially constant in each layer in the Z-axis direction.

Abstract: A filter device includes a laminated body, plate electrodes, shield terminals, a plurality of resonator portions, and a plurality of capacitor portions facing the plurality of resonator portions in a Y-axis direction, respectively. Each of the resonator portions is formed by a plurality of resonant electrode elements. Each of the capacitor portions is formed by a plurality of capacitive electrode elements. A part in each of the plurality of resonant electrode elements that faces the capacitive electrode elements extends in a direction along the Y-axis direction. The plurality of capacitive electrode elements extend in a direction that intersects with the Y-axis direction.

Abstract: A ceramic electronic component that includes a ceramic insulator and a terminal electrode on a surface of the ceramic insulator. The ceramic insulator contains a crystalline material and an amorphous material. The terminal electrode contains a metal and an oxide. The crystalline material and the oxide contain, in common, at least one type of a metal element. An adjacent region in the ceramic insulator which surrounds the terminal electrode and has a thickness of 5 ?m is higher in concentration of the metal element than a remote region which is distant from the terminal electrode by 100 ?m and has a thickness of 5 ?m.

Abstract: Close-contact layers that are capable of improving the degree of contact between electrodes and a ceramic insulating layer can be formed at low cost by firing a glass paste. When the electrodes, the ceramic insulating layer, and the close-contact layers are fired at the same time, the glass paste is sintered last, and thus, formation of voids, defects, and the like in portions of the ceramic insulating layer, on which the electrodes are disposed, as a result of shrinkage of the electrodes and the ceramic insulating layer at the time of firing being hindered by stress generated due to the difference in the degree of shrinkage can be suppressed. Therefore, the structure of the ceramic insulating layers in the above portions can be elaborated by the close-contact layers.

Abstract: A bridge section 12 is disposed in an area where mounting sections 11 are opposed to each other such that it is displaced toward a predetermined side. Accordingly, even if the line width of the bridge section 12 is formed larger than that in the related art, the self-alignment phenomenon can occur appropriately in a reflow process. It is thus possible to provide a resin-sealed module having high resin-charging properties and including a circuit substrate on which the bridge section 12 is not broken even if the size of a common land electrode 10 is reduced in accordance with a smaller size of a circuit component 5 and on which a sufficient gap between plural circuit components 5 mounted on the circuit substrate is reliably secured.

Abstract: A ceramic electronic component that includes a ceramic insulator and a terminal electrode on a surface of the ceramic insulator. The ceramic insulator contains a crystalline material and an amorphous material. The terminal electrode contains a metal and an oxide. The crystalline material and the oxide contain, in common, at least one type of a metal element. An adjacent region in the ceramic insulator which surrounds the terminal electrode and has a thickness of 5 ?m is higher in concentration of the metal element than a remote region which is distant from the terminal electrode by 100 ?m and has a thickness of 5 ?m.

Abstract: A multilayer wiring substrate that can realize a higher-density wiring structure is obtained. Provided is a multilayer wiring substrate, where a multilayer body including a first insulating layer and a second insulating layer stacked on the bottom surface of the first insulating layer includes printed wiring electrodes; the printed wiring electrodes are formed by printing with and sintering conductive paste; the printed wiring electrodes respectively include first wiring electrode portions located on the second insulating layer and second wiring electrode portions respectively joined to first wiring electrode portions; and the second wiring electrode portions respectively extend into through holes and, further, are exposed at the top surface of the first insulating layer.

Abstract: Close-contact layers that are capable of improving the degree of contact between electrodes and a ceramic insulating layer can be formed at low cost by firing a glass paste. When the electrodes, the ceramic insulating layer, and the close-contact layers are fired at the same time, the glass paste is sintered last, and thus, formation of voids, defects, and the like in portions of the ceramic insulating layer, on which the electrodes are disposed, as a result of shrinkage of the electrodes and the ceramic insulating layer at the time of firing being hindered by stress generated due to the difference in the degree of shrinkage can be suppressed. Therefore, the structure of the ceramic insulating layers in the above portions can be elaborated by the close-contact layers.

Abstract: A bridge section 12 is disposed in an area where mounting sections 11 are opposed to each other such that it is displaced toward a predetermined side. Accordingly, even if the line width of the bridge section 12 is formed larger than that in the related art, the self-alignment phenomenon can occur appropriately in a reflow process. It is thus possible to provide a resin-sealed module having high resin-charging properties and including a circuit substrate on which the bridge section 12 is not broken even if the size of a common land electrode 10 is reduced in accordance with a smaller size of a circuit component 5 and on which a sufficient gap between plural circuit components 5 mounted on the circuit substrate is reliably secured.

Abstract: A multilayer wiring substrate that can realize a higher-density wiring structure is obtained. Provided is a multilayer wiring substrate, where a multilayer body including a first insulating layer and a second insulating layer stacked on the bottom surface of the first insulating layer includes printed wiring electrodes; the printed wiring electrodes are formed by printing with and sintering conductive paste; the printed wiring electrodes respectively include first wiring electrode portions located on the second insulating layer and second wiring electrode portions respectively joined to first wiring electrode portions; and the second wiring electrode portions respectively extend into through holes and, further, are exposed at the top surface of the first insulating layer.