Patents by Inventor Tatsuo Eda

Tatsuo Eda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7816623
    Abstract: In a method for processing brittle material, a laser light from a laser light source irradiates the brittle material and transports an irradiating position of the laser light along a predetermined line, wherein the laser light L from a plurality of laser light sources 11, 12 . . . m1, m2 . . . mn is irradiated simultaneously onto the surface of the brittle material W, and an irradiating range of the laser light, which is set to a predetermined shape, is moved over the surface of the brittle material. Furthermore, a plurality of optical wave guides 10 . . . 10 that guide the laser light from the laser light sources 11, 12 . . . m1, m2 . . . mn to the brittle material are provided, and composite laser light L irradiates the surface of the brittle material, with these optical wave guides 10 . . . 10 bundled together.
    Type: Grant
    Filed: October 24, 2007
    Date of Patent: October 19, 2010
    Assignee: Mitsuboshi Diamond Industrial Co., Ltd.
    Inventors: Yasuhide Otsu, Tatsuo Eda
  • Publication number: 20080053972
    Abstract: In a method for processing brittle material, a laser light from a laser light source irradiates the brittle material and transports an irradiating position of the laser light along a predetermined line, wherein the laser light L from a plurality of laser light sources 11, 12 . . . m1, m2 . . . mn is irradiated simultaneously onto the surface of the brittle material W, and an irradiating range of the laser light, which is set to a predetermined shape, is moved over the surface of the brittle material. Furthermore, a plurality of optical wave guides 10 . . . 10 that guide the laser light from the laser light sources 11, 12 . . . m1, m2 . . . mn to the brittle material are provided, and composite laser light L irradiates the surface of the brittle material, with these optical wave guides 10 . . . 10 bundled together.
    Type: Application
    Filed: October 24, 2007
    Publication date: March 6, 2008
    Applicant: MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD.
    Inventors: Yasuhide Otsu, Tatsuo Eda
  • Patent number: 7304265
    Abstract: In a method for processing brittle material, a laser light from a laser light source irradiates the brittle material and transports an irradiating position of the laser light along a predetermined line, wherein the laser light L from a plurality of laser light sources 11, 12 . . . m1, m2 . . . mn is irradiated simultaneously onto the surface of the brittle material W, and an irradiating range of the laser light, which is set to a predetermined shape, is moved over the surface of the brittle material. Furthermore, a plurality of optical wave guides 10 . . . 10 that guide the laser light from the laser light sources 11, 12 m1, m2 . . . mn to the brittle material are provided, and composite laser light L irradiates the surface of the brittle material, with these optical wave guides 10 . . . 10 bundled together.
    Type: Grant
    Filed: March 12, 2003
    Date of Patent: December 4, 2007
    Assignee: Mitsuboshi Diamond Industrial Co., Ltd.
    Inventors: Yasuhide Otsu, Tatsuo Eda
  • Publication number: 20050150254
    Abstract: Setting in advance an absorptance of a light L (for example laser light) of a brittle material W to be processed, an absorptance of a plate-shaped sample S of the same material as the brittle material W to be processed is calculated using that set value of absorptance, a thickness of the tabular sample S when that sample S is irradiated by the light L having a same wavelength as that irradiated onto the brittle material, and based on this calculated value of absorptance, and the actual absorptance data obtained by the actual irradiation of the light L on the sample S, a light wavelength that is selected appropriate for the absorptance of the brittle material to be processed is selected, and processing of the brittle material W is carried out using light of the selected wavelength.
    Type: Application
    Filed: March 12, 2003
    Publication date: July 14, 2005
    Inventors: Hideki Morita, Yasuhide Otsu, Tatsuo Eda
  • Publication number: 20050109953
    Abstract: In a method for processing brittle material, a laser light from a laser light source irradiates the brittle material and transports an irradiating position of the laser light along a predetermined line, wherein the laser light L from a plurality of laser light sources 11, 12 . . . m1, m2 . . . mn is irradiated simultaneously onto the surface of the brittle material W, and an irradiating range of the laser light, which is set to a predetermined shape, is moved over the surface of the brittle material. Furthermore, a plurality of optical wave guides 10 . . . 10 that guide the laser light from the laser light sources 11, 12 m1, m2 . . . mn to the brittle material are provided, and composite laser light L irradiates the surface of the brittle material, with these optical wave guides 10 . . . 10 bundled together.
    Type: Application
    Filed: March 12, 2003
    Publication date: May 26, 2005
    Inventors: Yasuhide Otsu, Tatsuo Eda