Patents by Inventor Tatsuo Honda

Tatsuo Honda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Insulating material and electric machine winding and method for manufacturing the same
    Publication number: 20040226740
    Abstract: In order to provide an electric machine winding having an insulating layer excellent in electric characteristics and an insulating layer of an electric machine winding excellent in electric characteristics, a high-thermal-conductivity insulating layer 11 is formed around the peripheral portion of a winding conductor 10 by the use of a high-thermal-conductivity insulating tape 1 having a mica layer 3, a reinforcing material layer 5, and a high-thermal-conductivity filler layer 7, wherein the amount of resin of the mica layer 3 makes up 10 wt % to 25 wt % of the total weight of the insulating material and wherein the amount of resin of the high-thermal-conductivity filler layer 7 makes up 10 wt % to 25 wt % of the total weight of the insulating material.
    Type: Application
    Filed: March 9, 2004
    Publication date: November 18, 2004
    Applicant: Hitachi, Ltd.
    Inventors: Tomoya Tsunoda, Mitsuru Onoda, Shigeo Amagi, Tatsuo Honda
  • Insulating material and electric machine winding and method for manufacturing the same
    Patent number: 6746758
    Abstract: In order to provide an electric machine winding having an insulating layer excellent in electric characteristics and an insulating layer of an electric machine winding excellent in electric characteristics, a high-thermal-conductivity insulating layer 11 is formed around the peripheral portion of a winding conductor 10 by the use of a high-thermal-conductivity insulating tape 1 having a mica layer 3, a reinforcing material layer 5, and a high-thermal-conductivity filler layer 7, wherein the amount of resin of the mica layer 3 makes up 10 wt % to 25 wt % of the total weight of the insulating material and wherein the amount of resin of the high-thermal-conductivity filler layer 7 makes up 10 wt % to 25 wt % of the total weight of the insulating material.
    Type: Grant
    Filed: August 1, 2002
    Date of Patent: June 8, 2004
    Assignee: Hitachi, Ltd.
    Inventors: Tomoya Tsunoda, Mitsuru Onoda, Shigeo Amagi, Tatsuo Honda
  • Insulating material and electric machine winding and method for manufacturing the same
    Publication number: 20030035960
    Abstract: In order to provide an electric machine winding having an insulating layer excellent in electric characteristics and an insulating layer of an electric machine winding excellent in electric characteristics, a high-thermal-conductivity insulating layer 11 is formed around the peripheral portion of a winding conductor 10 by the use of a high-thermal-conductivity insulating tape 1 having a mica layer 3, a reinforcing material layer 5, and a high-thermal-conductivity filler layer 7, wherein the amount of resin of the mica layer 3 makes up 10 wt % to 25 wt % of the total weight of the insulating material and wherein the amount of resin of the high-thermal-conductivity filler layer 7 makes up 10 wt % to 25 wt % of the total weight of the insulating material.
    Type: Application
    Filed: August 1, 2002
    Publication date: February 20, 2003
    Applicant: Hitachi, Ltd.
    Inventors: Tomoya Tsunoda, Mitsuru Onoda, Shigeo Amagi, Tatsuo Honda
  • Insulating material, windings using same, and a manufacturing method thereof
    Patent number: 6504102
    Abstract: In order to provide windings for electrical rotating machines having an insulating film superior in electrical characteristics, a high heat conductive insulating film 11 is formed at outer periphery of wound conductor 10 using a high heat conductive insulating tape, which includes a mica layer 3, a reinforcement layer 5, and a high heat conductive filler layer 7, wherein the resin content in each layer of the mica layer 3 and the high heat conductive filler layer 7 is specified in the range of 10-25% by weight based on the whole weight of the material. 1-80% by weight of said filler is spherical.
    Type: Grant
    Filed: September 4, 2001
    Date of Patent: January 7, 2003
    Assignee: Hitachi, Ltd.
    Inventors: Tomoya Tsunoda, Keiichi Morikawa, Mitsuru Onoda, Shigeo Amagi, Tatsuo Honda
  • Insulating material, windings using same, and a manufacturing method thereof
    Publication number: 20020056569
    Abstract: In order to provide windings for electrical rotating machines having an insulating film superior in electrical characteristics, a high heat conductive insulating film 11 is formed at outer periphery of wound conductor 10 using a high heat conductive insulating tape, which comprises a mica layer 3, a reinforcement layer 5, and a high heat conductive filler layer 7, wherein the resin content in each layer of the mica layer 3 and the high heat conductive filler layer 7 is specified in the range of 10-25% by weight based on the whole weight of the material. 1-80% by weight of said filler is spherical.
    Type: Application
    Filed: September 4, 2001
    Publication date: May 16, 2002
    Inventors: Tomoya Tsunoda, Keiichi Morikawa, Mitsuru Onoda, Shigeo Amagi, Tatsuo Honda
  • Insulating material windings using same and a manufacturing method thereof
    Patent number: 6288341
    Abstract: In order to provide windings for electrical rotating machines having an insulating film superior in electrical characteristics, a high heat conductive insulating film 11 is formed at outer periphery of wound conductor 10 using a high heat conductive insulating tape, which includes a mica layer 3, a reinforcement layer 5, and a high heat conductive filler layer 7, wherein the resin content in each layer of the mica layer 3 and the high heat conductive filler layer 7 is specified in the range of 10-25% by weight based on the whole weight of the material. 1-80% by weight of said filler is spherical.
    Type: Grant
    Filed: December 9, 1999
    Date of Patent: September 11, 2001
    Assignee: Hitachi, Ltd.
    Inventors: Tomoya Tsunoda, Keiichi Morikawa, Mitsuru Onoda, Shigeo Amagi, Tatsuo Honda
  • Insulating material and windings thereby
    Patent number: 6069430
    Abstract: The high thermoconductive insulating film 11 was formed around the outer periphery of the wound conductors 10, using the high thermoconductive insulating tape 1 comprising the mica layer 3, the reinforcement layer 5, and the high thermoconductive filler layer 7, wherein the resin content in each layer of the mica layer 3 and the high thermoconductive filler layer 7 is specified to the range of 10-25% by weight of the total weight of the material.
    Type: Grant
    Filed: February 25, 1999
    Date of Patent: May 30, 2000
    Assignee: Hitachi, Ltd.
    Inventors: Tomoya Tsunoda, Keiichi Morikawa, Mitsuru Onoda, Shigeo Amagi, Tatsuo Honda