Abstract: A semiconductor chip includes a semiconductor substrate and a multilayer wiring layer formed on the semiconductor substrate, and at least one layer of the multilayer wiring layer is formed with a conductive pattern. The conductive pattern is formed so as to continuously surround a lower inductor and an upper inductor in plan view.

Abstract: A semiconductor device includes a semiconductor substrate, a multilayer wiring layer formed on the semiconductor substrate, a first wiring formed on the multilayer wiring layer and configured to be applied with a first potential, an upper inductor formed on the multilayer wiring layer and configured to be applied with a second potential different from the first potential, an inorganic insulating film formed on the multilayer wiring layer, the first wiring, and the upper inductor, and an organic insulating film formed on the inorganic insulating film and disposed so as to cover the inorganic insulating film located between the first wiring and the upper inductor in plan view. Here, between the first wiring and the upper inductor, an opening portion exposing a part of the upper surface of the inorganic insulating film is formed in the organic insulating film.

Abstract: A semiconductor chip includes a lower wiring layer, a multilayer wiring layer formed on the lower wiring layer, and an upper wiring layer formed on the multilayer wiring layer. Here, a thickness of a wiring provided in the lower wiring layer is larger than a thickness of each of a plurality of wirings provided in the multilayer wiring layer, and a thickness of a wiring provided in the upper wiring layer is larger than the thickness of each of the plurality of wirings provided in the multilayer wiring layer. A lower inductor which is a component of a transformer is provided in the lower wiring layer, and an upper inductor which is a component of the transformer is provided in the upper wiring layer.

Abstract: Disclosed are a semiconductor device and a method for manufacturing the semiconductor device that is capable of adequately reducing the influence of inter-wiring capacitance even when a photoelectric conversion element is progressively miniaturized. A plurality of transfer transistors each include a photoelectric conversion element and a signal output section. A plurality of other transistors include at least one signal input/output section that is electrically coupled to the transfer transistors. An interlayer insulating film is formed so as to cover the transfer transistors and the other transistors. A total of at least three of at least one signal output section of the transfer transistors and at least one signal input/output section of the other transistors are coupled by a coupling layer that includes a conductor filled into a groove formed in the interlayer insulating film.

Abstract: Disclosed are a semiconductor device and a method for manufacturing the semiconductor device that is capable of adequately reducing the influence of inter-wiring capacitance even when a photoelectric conversion element is progressively miniaturized. A plurality of transfer transistors each include a photoelectric conversion element and a signal output section. A plurality of other transistors include at least one signal input/output section that is electrically coupled to the transfer transistors. An interlayer insulating film is formed so as to cover the transfer transistors and the other transistors. A total of at least three of at least one signal output section of the transfer transistors and at least one signal input/output section of the other transistors are coupled by a coupling layer that includes a conductor filled into a groove formed in the interlayer insulating film.

Abstract: A technique for enhancing the performance of a memory- and logic-equipped semiconductor device is provided. The semiconductor device comprises a semiconductor substrate, and insulating layer on the semiconductor substrate, a plurality of contact plugs in the insulating layer, and an insulating layer where capacitors, a plurality of contact plugs, barrier metal layers and copper interconnections are formed. Source/drain regions in the upper surface of the semiconductor substrate are electrically connected to the copper interconnections. One of adjacent source/drain regions in the upper surface of the semiconductor substrate is electrically connected to the copper interconnection, while the other is electrically connected to the capacitor.

Abstract: A technique for enhancing the performance of a memory- and logic-equipped semiconductor device is provided. The semiconductor device comprises a semiconductor substrate, and insulating layer on the semiconductor substrate, a plurality of contact plugs in the insulating layer, and an insulating layer where capacitors, a plurality of contact plugs, barrier metal layers and copper interconnections are formed. Source/drain regions in the upper surface of the semiconductor substrate are electrically connected to the copper interconnections. One of adjacent source/drain regions in the upper surface of the semiconductor substrate is electrically connected to the copper interconnection, while the other is electrically connected to the capacitor.

Abstract: According to one embodiment of the present invention, a method of manufacturing a semiconductor device includes below steps. A step of preparing a phase shift mask and a normal photomask. A step of stacking a first wiring layer on a semiconductor substrate, and further stacking, on the first wiring layer, a second wiring layer. The second wiring layer includes a second wiring and third wiring. A step of stacking an interlayer insulating film on the second wiring layer. A step of forming, in the interlayer insulating film, a first opening in which the second wiring is exposed, and a second opening in which the third wiring is exposed by photolithography using the normal photomask. A step of burying a metal in the first opening and the second opening. A step of providing a pad to be overlaid on the first and second openings.

Abstract: A technique for enhancing the performance of a memory- and logic-equipped semiconductor device is provided. The semiconductor device comprises a semiconductor substrate (1), an insulating layer (19) on the semiconductor substrate (1), a plurality of contact plugs (16, 66) in the insulating layer (19), and an insulating layer (30) where capacitors (82), a plurality of contact plugs (25, 75), barrier metal layers (27, 87) and copper interconnections (29, 88) are formed. Source/drain regions (9) in the upper surface of the semiconductor substrate (1) are electrically connected to the copper interconnections (29). One of adjacent source/drain regions (59) in the upper surface of the semiconductor substrate (1) is electrically connected to the copper interconnection (88), while the other is electrically connected to the capacitor (82).

Abstract: A technique for enhancing the performance of a memory- and logic-equipped semiconductor device is provided. The semiconductor device comprises a semiconductor substrate (1), an insulating layer (19) on the semiconductor substrate (1), a plurality of contact plugs (16, 66) in the insulating layer (19), and an insulating layer (30) where capacitors (82), a plurality of contact plugs (25, 75), barrier metal layers (27, 87) and copper interconnections (29, 88) are formed. Source/drain regions (9) in the upper surface of the semiconductor substrate (1) are electrically connected to the copper interconnections (29). One of adjacent source/drain regions (59) in the upper surface of the semiconductor substrate (1) is electrically connected to the copper interconnection (88), while the other is electrically connected to the capacitor (82).

Abstract: A technique for enhancing the performance of a memory- and logic-equipped semiconductor device is provided. The semiconductor device comprises a semiconductor substrate (1), an insulating layer (19) on the semiconductor substrate (1), a plurality of contact plugs (16, 66) in the insulating layer (19), and an insulating layer (30) where capacitors (82), a plurality of contact plugs (25, 75), barrier metal layers (27, 87) and copper interconnections (29, 88) are formed. Source/drain regions (9) in the upper surface of the semiconductor substrate (1) are electrically connected to the copper interconnections (29). One of adjacent source/drain regions (59) in the upper surface of the semiconductor substrate (1) is electrically connected to the copper interconnection (88), while the other is electrically connected to the capacitor (82).

Abstract: According to one embodiment of the present invention, a method of manufacturing a semiconductor device includes below steps. A step of preparing a phase shift mask and a normal photomask. A step of stacking a first wiring layer on a semiconductor substrate, and further stacking, on the first wiring layer, a second wiring layer. The a second wiring layer includes a second wiring and a third wiring. A step of stacking an interlayer insulating film on the second wiring layer. A step of forming, in the interlayer insulating film, a first opening in which the second wiring is exposed, and a second opening in which the third wiring is exposed by photolithography using the normal photomask. A step of burying a metal in the first opening and the second opening. A step of providing a pad to be overlaid on the first and second openings.

Abstract: According to one embodiment of the present invention, a method of manufacturing a semiconductor device includes below steps. A step of preparing a phase shift mask and a normal photomask. A step of stacking a first wiring layer on a semiconductor substrate, and further stacking, on the first wiring layer, a second wiring layer. The a second wiring layer includes a second wiring and a third wiring. A step of stacking an interlayer insulating film on the second wiring layer. A step of forming, in the interlayer insulating film, a first opening in which the second wiring is exposed, and a second opening in which the third wiring is exposed by photolithography using the normal photomask. A step of burying a metal in the first opening and the second opening. A step of providing a pad to be overlaid on the first and second openings.

Abstract: A technique for enhancing the performance of a memory- and logic-equipped semiconductor device is provided. The semiconductor device comprises a semiconductor substrate (1), an insulating layer (19) on the semiconductor substrate (1), a plurality of contact plugs (16, 66) in the insulating layer (19), and an insulating layer (30) where capacitors (82), a plurality of contact plugs (25, 75), barrier metal layers (27, 87) and copper interconnections (29, 88) are formed. Source/drain regions (9) in the upper surface of the semiconductor substrate (1) are electrically connected to the copper interconnections (29). One of adjacent source/drain regions (59) in the upper surface of the semiconductor substrate (1) is electrically connected to the copper interconnection (88), while the other is electrically connected to the capacitor (82).

Abstract: A technique for enhancing the performance of a memory- and logic-equipped semiconductor device is provided. The semiconductor device comprises a semiconductor substrate (1), an insulating layer (19) on the semiconductor substrate (1), a plurality of contact plugs (16, 66) in the insulating layer (19), and an insulating layer (30) where capacitors (82), a plurality of contact plugs (25, 75), barrier metal layers (27, 87) and copper interconnections (29, 88) are formed. Source/drain regions (9) in the upper surface of the semiconductor substrate (1) are electrically connected to the copper interconnections (29). One of adjacent source/drain regions (59) in the upper surface of the semiconductor substrate (1) is electrically connected to the copper interconnection (88), while the other is electrically connected to the capacitor (82).

Abstract: According to one embodiment of the present invention, a method of manufacturing a semiconductor device includes below steps. A step of preparing a phase shift mask and a normal photomask. A step of stacking a first wiring layer on a semiconductor substrate, and further stacking, on the first wiring layer, a second wiring layer. The a second wiring layer includes a second wiring and a third wiring. A step of stacking an interlayer insulating film on the second wiring layer. A step of forming, in the interlayer insulating film, a first opening in which the second wiring is exposed, and a second opening in which the third wiring is exposed by photolithography using the normal photomask. A step of burying a metal in the first opening and the second opening. A step of providing a pad to be overlaid on the first and second openings.

Abstract: A technique for enhancing the performance of a memory- and logic-equipped semiconductor device is provided. The semiconductor device comprises a semiconductor substrate (1), an insulating layer (19) on the semiconductor substrate (1), a plurality of contact plugs (16, 66) in the insulating layer (19), and an insulating layer (30) where capacitors (82), a plurality of contact plugs (25, 75), barrier metal layers (27, 87) and copper interconnections (29, 88) are formed. Source/drain regions (9) in the upper surface of the semiconductor substrate (1) are electrically connected to the copper interconnections (29). One of adjacent source/drain regions (59) in the upper surface of the semiconductor substrate (1) is electrically connected to the copper interconnection (88), while the other is electrically connected to the capacitor (82).

Abstract: A technique for enhancing the performance of a memory- and logic-equipped semiconductor device is provided. The semiconductor device comprises a semiconductor substrate (1), an insulating layer (19) on the semiconductor substrate (1), a plurality of contact plugs (16, 66) in the insulating layer (19), and an insulating layer (30) where capacitors (82), a plurality of contact plugs (25, 75), barrier metal layers (27, 87) and copper interconnections (29, 88) are formed. Source/drain regions (9) in the upper surface of the semiconductor substrate (1) are electrically connected to the copper interconnections (29). One of adjacent source/drain regions (59) in the upper surface of the semiconductor substrate (1) is electrically connected to the copper interconnection (88), while the other is electrically connected to the capacitor (82).

Abstract: A first metal film, a first interlayer insulating film, a second metal film, and a second interlayer insulating film are deposited in this order over a silicon nitride film. An opening penetrating the first and second interlayer insulating films and the first and second metal films is created, whereby a contact metal, to hold a to-be-formed lower electrode thereon, is exposed. A metal film is provided to cover the second interlayer insulating film. The opening is filled with the metal film. A main part and the uppermost fin (namely, the fin farthest from a substrate) of a lower electrode, are formed by the same process.

Abstract: A semiconductor device includes a diffusion region in a semiconductor substrate, a gate insulation film on the semiconductor substrate, a gate electrode on the gate insulation film, an interlayer insulation film on the semiconductor substrate covering the gate electrode, and a capacitor on the interlayer insulation film. The capacitor includes a laminated structure made up of a lower electrode, a dielectric film, and an upper electrode. The diffusion region, the gate electrode, and the lower electrode are connected to one another by a common contact in the interlayer insulation film.