Patents by Inventor Tatsuo Kumura
Tatsuo Kumura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11322425Abstract: Provided is a semiconductor device having excellent heat radiation performance and electromagnetic wave suppression effect. A semiconductor device 1 comprises: a semiconductor element 30 formed on a substrate 50; a conductive shield can 20 having an opening hole 21; a conductive cooling member 40 located above the conductive shield can 20; a heat conductive sheet 10 formed between the semiconductor element 30 and the conductive cooling member 40 at least through the opening hole 21; and a conductive member 11 electrically connecting the conductive shield can 20 and the conductive cooling member 40.Type: GrantFiled: February 25, 2019Date of Patent: May 3, 2022Assignee: Dexerials CorporationInventor: Tatsuo Kumura
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Patent number: 11043461Abstract: Provided is a semiconductor device having excellent heat transferring performance and electromagnetic wave suppression effect. A semiconductor device 1 comprises: a semiconductor element 30 formed on a substrate 50; a conductive shield can 20 having an opening 21, covering at least a part of the semiconductor element 30, and connected to a ground 60; a cooling member 40 located above the conductive shield can 20; and an electromagnetic wave absorbing thermal conductive sheet 10 formed between the semiconductor element 30 and the cooling member 40 at least through the opening 21 of the conductive shield can 20.Type: GrantFiled: November 22, 2017Date of Patent: June 22, 2021Assignee: Dexerials CorporationInventors: Tatsuo Kumura, Hiroyuki Ryoson
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Publication number: 20210020542Abstract: Provided is a semiconductor device having excellent heat radiation performance and electromagnetic wave suppression effect. A semiconductor device 1 comprises: a semiconductor element 30 formed on a substrate 50; a conductive shield can 20 having an opening hole 21; a conductive cooling member 40 located above the conductive shield can 20; a heat conductive sheet 10 formed between the semiconductor element 30 and the conductive cooling member 40 at least through the opening hole 21; and a conductive member 11 electrically connecting the conductive shield can 20 and the conductive cooling member 40.Type: ApplicationFiled: February 25, 2019Publication date: January 21, 2021Applicant: Dexerials CorporationInventor: Tatsuo KUMURA
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Patent number: 10892204Abstract: Disclosed is an electromagnetic wave absorbing heat conductive sheet having superior heat conductivity and electromagnetic wave absorbency. The electromagnetic wave absorbing heat conductive sheet comprises a polymer matrix component; a magnetic metal power; and a fibrous heat conductive filler oriented in one direction.Type: GrantFiled: March 24, 2017Date of Patent: January 12, 2021Assignee: Dexerials CorporationInventors: Tatsuo Kumura, Yusuke Kubo, Keisuke Aramaki, Hiroyuki Ryoson
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Publication number: 20200152581Abstract: Provided is a semiconductor device having excellent heat transferring performance and electromagnetic wave suppression effect. A semiconductor device 1 comprises: a semiconductor element 30 formed on a substrate 50; a conductive shield can 20 having an opening 21, covering at least a part of the semiconductor element 30, and connected to a ground 60; a cooling member 40 located above the conductive shield can 20; and an electromagnetic wave absorbing thermal conductive sheet 10 formed between the semiconductor element 30 and the cooling member 40 at least through the opening 21 of the conductive shield can 20.Type: ApplicationFiled: November 22, 2017Publication date: May 14, 2020Applicant: Dexerials CorporationInventors: Tatsuo KUMURA, Hiroyuki RYOSON
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Publication number: 20190246521Abstract: Provided is a heat conductive sheet having an excellent electromagnetic wave suppressing effect in addition to excellent thermal conductivity. A heat conductive sheet 1 includes a heat conductive sheet body 10 containing a binder resin 11 and fibrous heat conductive fillers 12, and a low permittivity partition member 20 which has a lower dielectric constant than the heat conductive sheet body 10 and separates at least part of the heat conductive sheet body 10.Type: ApplicationFiled: October 10, 2017Publication date: August 8, 2019Applicant: Dexerials CorporationInventors: Tatsuo KUMURA, Hiroyuki RYOSON
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Patent number: 10269487Abstract: Provided is a contactless power supply antenna device that has raised power transmission efficiency while also enabling size-reduction for mounting on a wearable terminal or the like. The antenna device includes a power transmission antenna (2) and a power reception antenna (3). The power transmission antenna (2) includes: a magnetic core including two magnetic plates (21) that face each other, a magnetic material-containing connecting portion (22) that connects at least part of an end section of each of the two magnetic plates (21), and a space (23) between the two magnetic plates (21); and a power transmission coil (25) disposed on at least one of the two magnetic plates (21) at a side thereof that faces the space (23). The power reception antenna (3) includes a power reception coil (31) and is positionable in the space (23).Type: GrantFiled: December 8, 2015Date of Patent: April 23, 2019Assignee: Dexerials CorporationInventor: Tatsuo Kumura
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Publication number: 20190080978Abstract: Disclosed is an electromagnetic wave absorbing heat conductive sheet having superior heat conductivity and electromagnetic wave absorbency. The electromagnetic wave absorbing heat conductive sheet comprises a polymer matrix component; a magnetic metal power; and a fibrous heat conductive filler oriented in one direction.Type: ApplicationFiled: March 24, 2017Publication date: March 14, 2019Applicant: Dexerials CorporationInventors: Tatsuo KUMURA, Yusuke KUBO, Keisuke ARAMAKI, Hiroyuki RYOSON
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Patent number: 10002704Abstract: A coil module is provided which has been reduced in size and thickness by incorporating a material and a structure resistant to magnetic saturation. The coil module includes a magnetic shielding layer containing a magnetic material, and a spiral coil. The magnetic shielding layer has a plurality of magnetic resin layers containing magnetic particles, and at least a portion of the spiral coil is buried in a portion of the magnetic resin layers. This allows a reduction in size and thickness while achieving a heat dissipation effect by the magnetic resin layers. In addition, since magnetic resin layers resistant to magnetic saturation are provided, the coil inductance changes only slightly even in an environment where a strong magnetic field is applied, and thus stable communication can be provided.Type: GrantFiled: November 27, 2013Date of Patent: June 19, 2018Assignee: DEXERIALS CORPORATIONInventors: Tatsuo Kumura, Yusuke Kubo
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Publication number: 20170330683Abstract: Provided is a contactless power supply antenna device that has raised power transmission efficiency while also enabling size-reduction for mounting on a wearable terminal or the like. The antenna device includes a power transmission antenna (2) and a power reception antenna (3). The power transmission antenna (2) includes: a magnetic core including two magnetic plates (21) that face each other, a magnetic material-containing connecting portion (22) that connects at least part of an end section of each of the two magnetic plates (21), and a space (23) between the two magnetic plates (21); and a power transmission coil (25) disposed on at least one of the two magnetic plates (21) at a side thereof that faces the space (23). The power reception antenna (3) includes a power reception coil (31) and is positionable in the space (23).Type: ApplicationFiled: December 8, 2015Publication date: November 16, 2017Applicant: Dexerials CorporationInventor: Tatsuo KUMURA
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Publication number: 20160104937Abstract: Provided is a coil module which is reduced in size and made slimmer by incorporating a material and structure resistant to magnetic saturation. The coil module has: a magnetic resin layer containing magnetic particles; and a spiral coil, wherein the magnetic resin layer contains magnetic particles having a spherical shape or a spheroid shape having a dimensional ratio of not more than 6, the dimensional ratio being expressed as a ratio of the major diameter to the minor diameter.Type: ApplicationFiled: March 11, 2014Publication date: April 14, 2016Inventors: Tatsuo KUMURA, Yusuke KUBO, Hiroyuki RYOSON
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Publication number: 20150325362Abstract: A coil module is provided which has been reduced in size and thickness by incorporating a material and a structure resistant to magnetic saturation. The coil module includes a magnetic shielding layer containing a magnetic material, and a spiral coil. The magnetic shielding layer has a plurality of magnetic resin layers containing magnetic particles, and at least a portion of the spiral coil is buried in a portion of the magnetic resin layers. This allows a reduction in size and thickness while achieving a heat dissipation effect by the magnetic resin layers. In addition, since magnetic resin layers resistant to magnetic saturation are provided, the coil inductance changes only slightly even in an environment where a strong magnetic field is applied, and thus stable communication can be provided.Type: ApplicationFiled: November 27, 2013Publication date: November 12, 2015Applicant: DEXERIALS CORPORATIONInventors: Tatsuo KUMURA, Yusuke KUBO
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Publication number: 20150222017Abstract: An antenna device according to the invention includes a spiral coil, a magnetic layer supporting the spiral coil and including a recess or a through hole for containing an extension from an inner periphery of the spiral coil, and a circuit board having a plurality of conducting patterns and being formed with a first terminal connecting the spiral coil to the conducting patterns and with a second terminal connecting the conducting patterns to an external circuit. The magnetic layer has at least a part of the circuit board inside. This invented antenna device is formed in a thinner size.Type: ApplicationFiled: January 26, 2015Publication date: August 6, 2015Inventors: Tatsuo KUMURA, Yusuke KUBO, Hiroyuki RYOSON
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Publication number: 20150222018Abstract: An invented antenna device includes a spiral coil having terminal wires extending from an inner periphery side thereof and from an outer periphery side thereof, a magnetic layer supporting the spiral coil and being formed with a cutoff portion extending from an inner periphery side thereof to an outer periphery side thereof, and a circuit board having a pair of terminal portions for connecting to the terminal wire and a connecting terminal for connecting an external circuit. The circuit board is placed in the cutoff portion, and the terminal wire extending from the inner periphery side of the spiral coil is coupled to the terminal portion located on an inner periphery side of the circuit board whereas the terminal wire extending from the outer periphery side of the spiral coil is coupled to the terminal portion located on an outer periphery side of the circuit board.Type: ApplicationFiled: February 3, 2015Publication date: August 6, 2015Inventors: Tatsuo KUMURA, Yusuke KUBO, Hiroyuki RYOSON
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Patent number: 8465663Abstract: A composition for electromagnetic wave suppression and heat radiation includes: a matrix composed of a high molecular material or a low molecular material; and a magnetic particle filled in the matrix upon mixing a magnetic powder having a relation of {(tap density)/density}?0.58 with the matrix.Type: GrantFiled: January 29, 2010Date of Patent: June 18, 2013Assignee: Sony CorporationInventors: Yoshihiro Kato, Kazuhiko Suzuki, Tatsuo Kumura, Yusuke Kubo
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Publication number: 20100200796Abstract: A composition for electromagnetic wave suppression and heat radiation includes: a matrix composed of a high molecular material or a low molecular material; and a magnetic particle filled in the matrix upon mixing a magnetic powder having a relation of {(tap density)/density}?0.58 with the matrix.Type: ApplicationFiled: January 29, 2010Publication date: August 12, 2010Applicant: SONY CORPORATIONInventors: Yoshihiro Kato, Kazuhiko Suzuki, Tatsuo Kumura, Yusuke Kubo
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Patent number: 6132891Abstract: There is disclosed an amorphous soft magnetic material represented by a composition formula:Co.sub.x Zr.sub.y Pd.sub.z M.sub.a wherein M denotes at least one element selected from a group consisting of niobium, chromium, vanadium, tantalum, tungsten, molybdenum; and0.82.ltoreq.x.ltoreq.0.940.04.ltoreq.y.ltoreq.0.100.01.ltoreq.z.ltoreq.0.080.01.ltoreq.a.ltoreq.0.10.The amorphous soft magnetic material, which has a high saturated magnetic flux density, a low coercive force, a high magnetic permeability and excellent wear and corrosion resistances, can be obtained by adding at least one or more of the elements of the Va and VIa groups to a Co--Zr--Pd amorphous soft magnetic material.Type: GrantFiled: July 6, 1992Date of Patent: October 17, 2000Assignee: Sony CorporationInventors: Tatsuo Kumura, Yukari Utsumi, Hideaki Karamon
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Patent number: 5663857Abstract: A magnetic head comprising a pair of magnetic core halves each having a magnetic core film sandwiched between a pair of non-magnetic substrates, said magnetic core halves being abutted to each other with the end faces of the magnetic core films facing each other, with a magnetic gap being defined in an interface of abutment of said magnetic core films, wherein the magnetic core film is of a laminated magnetic film structure comprising a plurality of laminated magnetic film units laminated with insulating films in-between. Each laminated magnetic film unit in turn comprises a plurality of magnetic films with non-magnetic films in-between, with the magnetic films being magnetostatically connected to one another at film ends. By employing the laminated magnetic film unit for the magnetic core film, it becomes possible to markedly increase the magnetic permeability in a direction normal to the gap depth when anisotropy is applied in the gap depth direction.Type: GrantFiled: August 8, 1996Date of Patent: September 2, 1997Assignee: Sony CorporationInventors: Tatsuo Kumura, Fusashige Tokutake, Akira Urai, Junichi Honda, Hideaki Ojima
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Patent number: 5162960Abstract: The formation of a gap in a magnetic head core or the junction of a thin magnetic film of a metal with an oxide substrate of a magnetic head made of a composite of a thin magnetic film of a metal with an oxide material are conducted by the thermal diffusion between gold layers themselves at a low temperature. Then, chromium or titanium is provided between the gold layer and the junction surface to prevent deterioration of magnetic characteristics and generation of a false gap and, at the same time, to heighten the junction strength. The thermal diffusion between the gold layers themselves is effected at a temperature lower than that of glass fusion to suppress the deterioration of magnetic characteristics, distortion caused by thermal expansion, and diffusion reaction on the interface. The chromium or titanium layer works to maintain function strength between the thin magnetic layer or the oxide substrate and the gold layer.Type: GrantFiled: November 20, 1990Date of Patent: November 10, 1992Assignee: Sony CorporationInventors: Katsumi Sakata, Ikuko Sato, Tatsuo Kumura, Toshito Ikeda, Hiroya Eguchi, Hideaki Matsuyama, Hideaki Karamon
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Patent number: 5150511Abstract: A method for manufacturing a magnetic transducer head in which a track width regulating grooves provided on both edges of a magnetic gap are filled by blowing a powder beam of nonmagnetic material having a very fine particle size to deposit the nonmagnetic material in the grooves. A pair of magnetic core members are bonded together to form a magnetic gap therebetween by providing a metal layer of a bonding surface of the core members and applying a pressure to the core members under an elevated temperature to cause a mutual diffusion of the metal to bond the core members together. Thus the magnetic transducer head can be made without using a high-temperature heat treatment.Type: GrantFiled: May 31, 1991Date of Patent: September 29, 1992Assignee: Sony CorporationInventors: Katsumi Sakata, Tatsuo Kumura, Atsushi Suzuki, Yoshito Ikeda, Kaoru Aoki, Naoto Kojima, Akio Mishima