Abstract: An electronic component carrier includes a carrier tape having a series of through holes formed therethrough and spaced from one another at a predetermined interval along the length of the casrrier tape. An adhesive tape having an adhesive layer is bonded to one side of the carrier tape by the adhesive layer. The adhesive layer partially covers each of the through holes. A plurality of electronic components are received respectively in the series of through holes and are bonded to that portion of the adhesive layer partially covering the through holes, thereby holding the electronic components on the carrier tape. An area of adhesive contact between the adhesive tape and the carrier tape and an area of adhesive contact between the adhesive tape and the electronic component can be isolated from each other at least in the direction of the width of the carrier tape.