Abstract: According to one embodiment, a semiconductor device includes a silicon carbide member, a first member, a first layer, and a second layer. The silicon carbide member includes a first region. The first member includes silicon and oxygen. The first layer is provided between the first region and the first member. The first layer includes a bond between silicon and nitrogen. The second layer is provided between the first layer and the first member. The second layer includes a bond between silicon and oxygen and a bond between silicon and nitrogen.

Abstract: Provided is an adhesive composition leading to sufficient adhesive strength when used for bonding to a polyolefin resin molded article that bonds poorly with other members. Also provided is an adhesive composition having excellent heat resistance (heat resistant adhesion) in the bonded part of a composite body obtained by joining a polyolefin resin-formed body and other member. This adhesive composition contains an organic solvent, a carboxyl group-containing polyolefin resin which is dissolved in this organic solvent and which has a melt flow rate of 5 to 40 g/10 min when measured at 130° C., and a polyfunctional isocyanate compound. This adhesive composition may further contain a carboxyl group-containing polyolefin resin having a melting point of 120° C. to 170° C.

Abstract: The purpose of the present invention is to provide an adhesive composition leading to sufficient adhesive strength when used for bonding to a polyolefin resin molded article that bonds poorly with other members. Another purpose of the present invention is to provide an adhesive composition having excellent heat resistance (heat resistant adhesion) in the bonded part of a composite body obtained by joining a polyolefin resin-formed body and other member. This adhesive composition contains an organic solvent, a carboxyl group-containing polyolefin resin which is dissolved in this organic solvent and which has a melt flow rate of 5 to 40 g/10 min when measured at 130° C., and a polyfunctional isocyanate compound. This adhesive composition may further contain a carboxyl group-containing polyolefin resin having a melting point of 120° C. to 170° C.

Abstract: An aqueous fluororesin coating composition and a process for producing the same, the coating composition comprising a core/shell fluorine-containing copolymer dispersed in an aqueous medium, the core/shell fluorine-containing copolymer comprising a core comprising a fluorine-containing copolymer comprising a repeating unit derived from a fluoroolefin monomer and a repeating unit derived from a vinyl carboxylate monomer and having a glass transition point Tg of 40.degree. C. or more, and a shell comprising a fluorine-containing copolymer comprising a repeating unit derived from a fluoroolefin monomer and a repeating unit derived from a vinyl carboxylate monomer and having a glass transition point Tg of from -10 to 30.degree. C., the weight ratio of the core to the shell being from 20/1 to 1/2.

Abstract: A paper feed device is mounted to a shredder. The intermittent activation time of paper feeding is adjusted, taking into consideration of the distance from the paper feed start position to the paper shredding position of a cutter of the shredder, thereby decreasing the speed of travel from the time the paper sensor detects the leading edge of the paper to the time the paper reaches the paper shredding position, so that operation is switched from intermittent to continuous activation preferably immediately before the leading edge of the paper reaches the cutter. Thus paper feed troubles associated with conventional devices are prevented, due to paper jamming, etc., caused by bending of the paper, etc.

Abstract: A paper feed device is mounted to a shredder. The intermittent activation time of paper feeding is adjusted, taking into consideration of the distance from the paper feed start position to the paper shredding position of a cutter of the shredder, thereby decreasing the speed of travel from the time the paper sensor detects the leading edge of the paper to the time the paper reaches the paper shredding position, so that operation is switched from intermittent to continuous activation preferably immediately before the leading edge of the paper reaches the cutter. Thus paper feed troubles associated with conventional devices are prevented, due to paper jamming, etc., caused by bending of the paper, etc.