Patents by Inventor Tatsuo Nozawa

Tatsuo Nozawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5507873
    Abstract: A vertical boat for holding a plurality of semiconductor wafers comprising two end members (5) positioned at the top and the bottom of the vertical boat, and a plurality of support members (3,4) vertically mounted on the end members (5), the support members (3,4) including two front support members (3) located on the wafer inserting side and at least one rear support members (4) located on the rear side of the boat, each support member (3,4) having a series of slits (3a,4a) formed thereon at a predetermined interval and a series of support portions defined by the slits (3a,4a) for supporting semiconductor wafers (1), wherein the front support member (3) is generally formed by a circular arc plate, and wherein each angle (A,B) formed between the wafer inserting direction (X) and a line linking the front end (3b) of the support portion of the front support member (3) to the center (1a) of the wafer (1) is 100 degrees or more.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: April 16, 1996
    Assignee: Toshiba Ceramics Co., Ltd.
    Inventors: Yutaka Ishizuka, Yoshiyuki Watanabe, Tatsuo Nozawa, Shinzi Sawanobori, Tomio Kon
  • Patent number: 5492229
    Abstract: A vertical boat for holding a plurality of semiconductor wafers comprising two end members (2) positioned at the top and the bottom of the vertical boat, and a plurality of support members (3,4,5,6,104) vertically mounted on the end members (2) for supporting the wafers, wherein each support member (3,4,5,6,104) is formed by a plate-like member having a series of slits (9,10,7,8,108) formed thereon in such a manner that a plurality of support arms are defined by the slits (9,10,7,8,108) at a predetermined interval, each support arm having a support projection (11,12,13,14,112) formed at the end thereof, and wherein the inner portions (P) of the wafer (1) is to be supported by the support projections (11,12,13,14,112) whereas the periphery of the wafer (1) does not contact the arms of the support members (3,4,5,6,104).
    Type: Grant
    Filed: November 12, 1993
    Date of Patent: February 20, 1996
    Assignee: Toshiba Ceramics Co., Ltd.
    Inventors: Takashi Tanaka, Jun Yoshikawa, Eiichi Toya, Atsuo Kitazawa, Kazunori Meguro, Tatsuo Nozawa, Yutaka Ishizuka, Yoshiyuki Watanabe, Masaru Seino, Hideo Nakanishi