Abstract: To offer excellent hermeticity inside a battery having high productivity and being covered with package members by means of solving a problem such as sealing failures caused by gaps between sides of lead electrodes and the package members in sealing parts, in which the lead electrode to be disposed. During a step of sealing between ends of the package members and the lead electrodes by fusing the sealing members, or during a step of adhering the fused sealing members to the lead electrodes, stripping sheets made of a material such that the fused sealing members does not adhere to heaters, are inserted between the package members, or the sealing members and the heaters. Accordingly, even if the fused sealing members are forced out from ends of the package members, or leaked toward the outside, the sealing members does not adhere to surfaces of the heaters or crumble their shapes.

Abstract: To offer excellent hermeticity inside a battery having high productivity and being covered with package members by means of solving a problem such as sealing failures caused by gaps between sides of lead electrodes and the package members in sealing parts, in which the lead electrode to be disposed. During a step of sealing between ends of the package members and the lead electrodes by fusing the sealing members, or during a step of adhering the fused sealing members to the lead electrodes, stripping sheets made of a material such that the fused sealing members does not adhere to heaters, are inserted between the package members, or the sealing members and the heaters. Accordingly, even if the fused sealing members are forced out from ends of the package members, or leaked toward the outside, the sealing members does not adhere to surfaces of the heaters or crumble their shapes.

Abstract: To offer excellent hermeticity inside a battery having high productivity and being covered with package members by means of solving a problem such as sealing failures caused by gaps between sides of lead electrodes and the package members in sealing parts, in which the lead electrode to be disposed. During a step of sealing between ends of the package members and the lead electrodes by fusing the sealing members, or during a step of adhering the fused sealing members to the lead electrodes, stripping sheets made of a material such that the fused sealing members does not adhere to heaters, are inserted between the package members, or the sealing members and the heaters. Accordingly, even if the fused sealing members are forced out from ends of the package members, or leaked toward the outside, the sealing members does not adhere to surfaces of the heaters or crumble their shapes.

Abstract: To offer excellent hermeticity inside a battery having high productivity and being covered with package members by means of solving a problem such as sealing failures caused by gaps between sides of lead electrodes and the package members in sealing parts, in which the lead electrode to be disposed. During a step of sealing between ends of the package members and the lead electrodes by fusing the sealing members, or during a step of adhering the fused sealing members to the lead electrodes, stripping sheets made of a material such that the fused sealing members does not adhere to heaters, are inserted between the package members, or the sealing members and the heaters. Accordingly, even if the fused sealing members are forced out from ends of the package members, or leaked toward the outside, the sealing members does not adhere to surfaces of the heaters or crumble their shapes.

Abstract: The wafer support structure is used with a movable backplane having a curved upper surface which is moved between a wafer access position and a wafer process position to clamp a wafer against a clamping structure during processing. A guide ring surrounds the backplane and a floating ring is spring-mounted on the guide ring by flat, elongated lift springs. RF bias springs are positioned on top of the floating ring along with wafer support pins which support a wafer above the curved backplane surface. When the backplane is moved toward the clamping structure to clamp the wafer, the RF bias springs make electrical contact with a portion of the clamping structure, and the clamping structure acts against the floating ring to flex the lift springs and lower the floating ring such that the wafer is transferred to the backplane surface to be clamped against the clamping structure. When the wafer is clamped, the support pins are out of contact with the wafer.