Abstract: A fine fiber-reinforced elastomer composition (A) having a high elastic modulus, mechanical strength and creep resistance includes (a) 100 parts by weight of elastic component having a glass-transition temperature of 0.degree. C. or less, (b) 30 to 500 parts by weight of a polyolefin component and (c) 10 to 500 parts by weight of a polyamide component dispersed in the fine fiber form in the matrix consisting of the components (a) and (b), these components (a), (b) and (c) being chemically bonded to each other through a binding agent (d), for example, a silane coupling agent, and is useful for producing an elastic material having a high elastic modulus, an excellent fatigue resistance and a high isotropy, by admixing an additional elastic component (B) to the elastomer composition (A).

Abstract: A circuit board, which is formed with bump patterns subject to a narrow variation in height on the surface of the circuit board, and which permits high-density packaging of a semiconductor component thereon. In this circuit board, conductor circuits formed by electroplating are embedded in an insulating base that is formed of a resist layer and an insulating substrate, and bumps are exposed in the surface of the insulating base. The bumps and the conductor circuits are connected electrically with one another by means of pillar-shaped conductors that are formed by electroplating. Each bump is a multilayer structure in two or more layers formed by successively depositing different electrically conductive materials by electroplating.

Abstract: An adhesive-backed sheet for protecting painted surfaces comprising a supporting substrate having formed thereon a rubber-based pressure-sensitive adhesive layer compounded with a fatty acid glycerol ester.

Abstract: A process for producing a copper-clad laminate is disclosed which includes the steps of (a) contacting the surface of a conductive carrier with a catalyst liquid containing at least one noble metal selected from the group consisting of Pd, Pt, Ru, Au, and Ag; (b) subsequently forming a copper foil layer on the treated surface of the conductive carrier by copper electroplating; (c) laminating an insulating base on the copper foil layer by hot-press bonding; and (d) separating the conductive carrier from the resulting laminate. The copper foil layer in the resulting copper-clad laminate has reduced pinholes and exhibits isotropic mechanical characteristics.

Abstract: A process for producing a copper-clad laminate, which comprises a step (S2) of forming a copper foil of at least several micrometers on a planar conductive substrate by electrolysis, a step (S3) of roughening the surface of the copper foil, a step (S4) of laminating the copper foil together with the conductive substrate on an insulating substrate and tightly integrating the assembly by applying pressure and heat, and a step (S5) of separating only the conductive substrate. A metal film may exist between the conductive substrate and the copper foil. When the metal film has a thickness of 0.1 to 3 .mu.m, only the conductive substrate is separated with the metal film being firmly adhered to the copper foil surface and, when the metal film has a thickness of 70 to 250 .mu.m, it is separated together with the conductive substrate after the lamination. The copper foil formed by high-speed plating under the conditions of 6 to 12.0 m/sec in solution contact speed and 0.8 to 4.0 A/cm.sup.

Abstract: A method suited for producing a conductor circuit board having a high-density, fine circuit pattern. Conductor circuits and dummy circuits are formed on the surface of a planar, electrically conductive substrate, and after removing a resist mask, unnecessary dummy circuits are removed. A thin metal film is formed over the surface of the conductive substrate and the surfaces of the conductor circuits and remaining dummy circuits. An insulating substrate is superposed on the surface of the conductive substrate on which the thin metal film is formed, and the two substrates are pressure-bonded together with heat applied thereto. Subsequently, only the conductive substrate is removed, and exposed portions of the thin metal film are removed by etching.

Abstract: A thin metal layer with a thickness of 1 to 5 .mu. is formed electrolytically (S2) on an electrically conductive single-plate substrate having a predetermined roughness, a resist mask is formed (S3) on the surface of the thin metal layer, and a conductor circuit is then electroformed thereon (S4) using copper. After the surface of the conductor circuit is roughened (S5), the conductor circuit, along with the single plate and the interposed thin metal layer, is stacked on an insulating substrate for lamination, and the individual layers are adhered integrally to one another by the application of heat and pressure (S7). Then, the single plate only is peeled off (S8), and the exposed thin metal layer is removed by etching (S9). The thin metal layer and the conductor circuit are electroplated under high-speed conditions including a solution contact speed of 2.6 to 20 m/sec and a current density of 0.15 to 4.0 A/cm.sup.

Abstract: A tape speed control system for a multiple speed tape recording and reproducing apparatus comprising a transducer head for reproducing a tape speed indicative signal which has been recorded along an edge of a recording tape. The frequency of the reproduced speed indicative signal is compared with a plurality of reference values to determine to which one of separate frequency bands the frequency of the reproduced speed signal belongs. If the latter belongs to the frequency band other than the frequency band which includes a predetermined frequency derived when the playback speed equals to the recording speed, a corresponding motor drive signal is generated to vary the speed of the tape until the frequency of the reproduced speed signal reaches the predetermined frequency.

Abstract: Apparatus for the production of metal foil or printed circuit patterns on a continuously advancing strip of electrically conductive material includes a cathode under which the conductive strip is fed in sliding contact therewith. An insoluble anode is disposed under the cathode, with an interelectrode gap between the anode and the cathodic conductive strip traveling under the cathode. Lying next to one end of the anode is a solution inlet block defining a solution inlet from which the electroplating solution containing the metal to be deposited is fed turbulently into the interelectrode gap to cause the electrodeposition of the metal on the downward-facing surface of the conductive strip. A shield block of electrically insulating material is mounted over the solution inlet block for shielding the conductive strip traveling thereover from premature metal deposition due to leaking current and hence for avoiding the development of pinholes in the metal foil or circuit patterns.

Abstract: A magnetic tape recording and reproducing apparatus provided with means for recording a cue-signal which serves to mark a predetermined point of a magnetic tape on which video signals are recorded by a rotary magnetic head. The cue-signal is recorded by a full erasing head by supplying thereto a cue-signal current having a frequency lower than the frequency of the erasing current. For example, the cue-signal current is generated by using the control signal for synchronizing the rotation of the rotary head with the tape movement.

Abstract: This invention relates to a speed control circuit of a d.c. motor having a frequency generator. To the conventional method in which a rotation detection signal is delayed by a monostable multivibrator circuit and this delayed signal and the rotation detection signal are gated to obtain a speed error signal, a new time-voltage converter circuit is added, whereby even if the detected frequency of the generator is low, a stable speed control is possible. Because of no error synchronization, the present speed control circuit is suited to an apparatus which requires speed switching, and also to semiconductor integration.

Abstract: A metal surface such as an endless strip of stainless steel is masked with a plating resist, leaving exposed areas to form a desired circuit pattern. The circuit pattern comprising a high density major layer and a roughened surface layer is formed by copper electroplating on the masked metal surface as same is made cathodic in a copper sulfate bath and successively held opposite to first and second insoluble anodes therein. In order to realize a high copper deposition rate, the electrolyte is caused to flow turbulently at an elevated temperature through the spacings between the metal surface and the first and second anodes. The completed circuit pattern has its roughened surface layer bonded to an adhesive-coated strip of insulating base and is separated from the metal surface. If desired, an adhesive-coated strip of overlay may then be bonded to the circuit pattern on the insulating base strip. The complete process can be automated.