Abstract: Provided is a resin composition for a printed wiring board with which a substrate material having a low CTE can be formed while ensuring good moldability. A resin composition for a printed wiring board contains a thermosetting resin including an epoxy resin, a curing agent, an inorganic filler, and an expansion relief component including an acrylic resin that is soluble in an organic solvent. The content of the inorganic filler is 150 parts by mass or more with respect to 100 parts by mass of the total amount of the thermosetting resin and the curing agent. The melt viscosity at 130° C. is less than 50000 Ps.

Abstract: The problem to be solved by the invention is to provide an epoxy resin composition for a prepreg, which is used in the manufacture of a printed circuit board containing a multilayer printed circuit board, wherein the epoxy resin composition for a prepreg is characterized by containing as essential components, a phosphorus compound that has 1.8 or more and less than 3 on average of a phenolic hydroxyl group that is reactive to an epoxy resin in the molecule, and that has 0.8 or more on average of a phosphorus element; a bifunctional epoxy resin that has 1.8 or more and less than 2.6 on average of epoxy groups in the molecule; a multi-functional epoxy resin that contains 2.

Abstract: It is an object of the present invention to provide a removable copper foil attached substrate capable of easily producing a coreless circuit board at low production cost and low raw material cost as compared with a conventional example. The substrate includes a release resin layer attached copper foil including a copper foil and a release resin layer attached on a surface of the copper foil; and a support layer. The release resin layer attached copper foil is integrally bonded to the support layer with the release resin layer in-between. The release resin layer allows removal of the copper foil from the support layer. A peel strength for removal of the copper foil from the support layer is 20 to 300 N/m.

Abstract: The problem to be solved by the invention is to provide an epoxy resin composition for a prepreg, which is used in the manufacture of a printed circuit board containing a multilayer printed circuit board, wherein the epoxy resin composition for a prepreg is characterized by containing as essential components, a phosphorus compound that has 1.8 or more and less than 3 on average of a phenolic hydroxyl group that is reactive to an epoxy resin in the molecule, and that has 0.8 or more on average of a phosphorus element; a bifunctional epoxy resin that has 1.8 or more and less than 2.6 on average of epoxy groups in the molecule; a multi-functional epoxy resin that contains 2.

Abstract: An adhesive sheet with a base for flexible printed wiring boards is provided, which has advantages of easiness of machining, excellent moldability, high rigidity and preventing the fall of resin dust particles during machining of a multilayer flexible printed wiring board or a flex-rigid printed wiring board. This adhesive sheet is used for bonding of a flexible printed wiring board made of a polyimide resin, and comprises a woven or nonwoven fabric as the base and a resin composition. The resin composition contains, as essential components, (a) an epoxy resin having two or more of epoxy groups in one molecule; (b) a polycarbodiimide resin dispersible in a solvent, in which the epoxy resin (a) is also dispersible, and having a number average molecular weight of 2000 or more and less than 10000; and (c) an imidazole curing agent. A weight ratio of the component (a) and the component (b) is in a range of 80:20 to 20:80.

Abstract: An addition type imide resin prepolymer is obtained by a reaction of unsaturated bisimide of 1.0 mol to diamine of 0.25 to 0.43 mol and an addition of polyamine having three or more benzene rings. The prepolymer is thereby made to contain substantially no unreacted diamine component which affects human body of operators, and to have remarkably excellent heat resistance and adhesive properties, while effective to restrain a production of any component of a molecular weight exceeding 15,000.

Abstract: A process for producing an unsaturated dicarboxylic acid imide compound of formula (I): ##STR1## wherein D represents a divalent organic group having at least one carbon/carbon double bond; R.sup.1 represents an n-valent organic group having at least one carbon atom; and n is an integer of 1 or above, which comprises reacting an unsaturated amide acid compound of formula (II): ##STR2## wherein D, R.sup.1, and n are as defined above, with an orthoester of formula (III): ##STR3## wherein R.sup.2 and R.sup.3, which may be the same or different, each represents a monovalent organic group having at least one carbon atom, to form an unsaturated dicarboxylic acid amide acid ester compound of formula (IV): ##STR4## wherein D, R.sup.1, R.sup.3, and n are as defined above, and then imidating the compound of formula (IV).