Abstract: A manufacturing method of an electronic device, includes the steps of: implanting P (phosphorous) ions into a substrate semiconductor region made of Si or SiGe by using a resist as a mask; ashing the resist while it is heated in a vacuum environment; and taking out the substrate, the substrate being ashing processed so that a temperature of the substrate is equal to or less than 130° C.

Abstract: A manufacturing method of an electronic device, includes the steps of: implanting P (phosphorous) ions into a substrate semiconductor region made of Si or SiGe by using a resist as a mask; ashing the resist while it is heated in a vacuum environment; and taking out the substrate, the substrate being ashing processed so that a temperature of the substrate is equal to or less than 130° C.

Abstract: A bar code reading apparatus includes a light source for illuminating a bar code, a light receiving part for receiving reflected light from the bar code and for subjecting the received reflected light to a photoelectric conversion to output an electrical signal, and a decoding part for decoding the bar code by reading width data related to widths of the bars and spaces of the bar code based on the electrical signal from the light receiving part.

Abstract: A wafer positioning apparatus includes at least first, second and third optical position detectors for detecting a circumference portion of a wafer. The first to third optical position detectors are arranged on a circumference of a circle having a diameter identical to that of the wafer. A transportation robot is used for holding the wafer and moving the held wafer with respect to the first to third optical position detectors. A control circuit controls the transportation robot in accordance with output signals of the first to third optical position detectors so that all of the first to third optical position detectors detect the circumference portion of the wafer at the same time.